Low-cost printed circuit board silver paste and preparation method thereof

Abstract

A low-cost printed circuit board silver paste comprises, by weight, 36 parts to 45 parts of 0.5-micrometer to 2-micrometer silver powder, 5 parts to 8 parts of nanometer aluminum powder, 10 parts to 20 parts of 20-nanometer to 40-nanometer silver powder, 4 parts to 7 parts of stannic oxide conductive ceramic powder, 2 parts to 4 parts of lecithin, 1 part to 2 parts of nanometer crystalline cellulose, 14 parts to 17 parts of dry alkyd resin, 3 parts to 6 parts of 1-micrometer to 10-micrometer crystalline flake graphite, 1 part to 3 parts of amyl acetate, 0.2 part to 0.4 part of texanol ester alcohol, 6 parts to 8 parts of glass powder, 6 parts to 8 parts of xylene, 8 parts to 10 parts of isophorone, 1 part to 2 parts of isoamyl acetate and 2 parts to 4 parts of ethylene glycol monobutyl ether. According to the silver paste, the nanometer aluminum powder, the stannic oxide conductive ceramic powder and the crystalline flake graphite are added, so that the use amount of the silver powder is reduced, the conductive effect is ensured, and meanwhile the cost is reduced; organic vehicles in the low-cost printed circuit board silver paste are good in leveling property and caking property with a circuit board, the printing performance is good, the circuit is clear and smooth, and no bubbles are generated after sintering.

Description

technical field [0001] The invention belongs to the technical field of electronic paste, in particular to a low-cost printed circuit board silver paste and a preparation method thereof. Background technique [0002] In the modern microelectronics industry, people have higher and higher requirements for electronic components, and the production is mostly carried out by process and standardization to reduce costs. The printed circuit board (PCB) was born to meet the needs of the microelectronics industry. Correspondingly, conduct research on new conductive pastes to match electronic pastes such as conductive pastes, electrode pastes, dielectric pastes, resistor pastes, and hole filling pastes with printed circuit boards (PCBs) that require new requirements. It is imperative. [0003] Generally speaking, the main components of electronic paste include functional phases such as metal, noble metal powder, etc., inorganic binders such as glass powder, oxide powder, etc., organic ...

AI Technical Summary

Problems solved by technology

[0005] The binder in the conductive silver paste has a great influence on the yield of circuit printing, such as viscosity, cohesiveness, adhesion, leveling, film formation, solvent volatility, etc. will affect the printing performance of the circuit , there are pores, open circuits, etc., and sometimes the glass phase has not yet begun to melt after the organic matter has volatilized, resulting in the phenomenon that the conductive line falls off from the substrate, and the conductive line is scrapped. Therefore, the performance of the organic binder needs to be improved.

[0006] At present, many inorganic binders use glass powder. Glass powder is made of metal oxides, silicon oxide and other materials. If the melting point is too high, the glass phase has not yet started to melt after the volatilization of organic matter is completed, resulting in conductive lines obtained from conductive silver paste. The phenomenon of falling off from the substrate makes the conductive circuit scrapped; and many of the current glass powders contain harmful substances such as lead, which is not good for the environment, so it is necessary to develop glass powders with better performance