A kind of composite seed crystal template and method for HVPE growth Gan single crystal
A technology of seed crystal and template, which is applied in the direction of gaseous chemical plating, coating, electrical components, etc., can solve the problems that it is not easy to obtain a clean seed crystal window, affect the epitaxial growth of the window area, and easily deposit GaN on the mask, to achieve Improve the isolation effect, not easy to stick, improve the effect of GaN crystal quality
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Embodiment 1
[0040] (1) On a sapphire substrate with a thickness of 430um and a diameter of 2 inches, a 3um GaN seed crystal is grown on MOCVD as a seed crystal template;
[0041] (2) Deposit SiO with a thickness of 50 nm on the GaN / sapphire seed template using PECVD 2 Thin film, redeposited SiN with a thickness of 200nm x Thin films, deposited at 300°C;
[0042] (3) The composite mask made in step (2) is used to form the required pattern through processes such as gluing, alignment exposure, and development. The minimum line width of the pattern in the window area is 2 μm, and then use RIE to etch the composite mask. The etchant is SF 6 , the etching depth is 230nm;
[0043] (4) Use a buffered oxide etching solution to wet etch the composite mask to remove uncut SiO 2 Clean the patterned seed template after masking;
[0044] (5) Use 30% NaOH solution at a temperature of 80-90°C to remove the contaminated or damaged area on the surface of the GaN seed crystal, rinse with 0.5% HF soluti...
Embodiment 2
[0049] (1) On a sapphire substrate with a thickness of 430um and a diameter of 2 inches, a 3um GaN seed crystal is grown on MOCVD as a seed crystal template;
[0050] (2) Deposit SiO with a thickness of 100 nm on the GaN / sapphire seed template using PECVD 2 Thin film, redeposited SiN with a thickness of 400nm x Thin films, deposited at 300°C;
[0051] (3) On the composite mask, the required pattern is formed through processes such as glue coating, alignment exposure, and development, and RIE is used to etch the composite mask, and the etchant is CF 4 , the etching depth is 490nm;
[0052] (4) Use BOE solution to wet etch the composite mask to remove residual SiO in the window area 2 Mask and clean;
[0053] (5) Under normal temperature conditions, use 0.02M Na 2 S 2 o 8 Wash with a 0.02M NaOH mixed solution for 15 minutes under the irradiation of a 200W mercury lamp to remove the contaminated or damaged area on the surface of the GaN seed crystal, then rinse with 0.5% H...
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