Electroplating solution for surface pore filling of plate parts and electroplating method thereof

A technology of electroplating solution and plate-shaped parts, applied in the direction of electrical connection formation of printed components, etc., can solve problems such as reducing hole filling efficiency, affecting hole filling quality, and affecting hole filling efficiency

Active Publication Date: 2014-11-05
上海天承化学有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Its disadvantage is that the concentration ratio of Fe(III) ions and Fe(II) ions in the plating solution must be well controlled, otherwise the quality of hole filling will be affected, and at the same time due to Fe(III) ions and Fe(II) ions The redox pair has good reversibility. Under the effect of concentration difference, the Fe(III) ions in the pores can be replenished by the way Fe(II) ions lose electrons, which affects the efficiency of hole filling; in addition, Fe(III) ) The radius of hydrated ions is smaller and the diffusion into the pores is faster, which also reduces the efficiency of hole filling; and this method uses pulsed current to increase

Method used

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  • Electroplating solution for surface pore filling of plate parts and electroplating method thereof
  • Electroplating solution for surface pore filling of plate parts and electroplating method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] This example uses a vertical plating process. The composition concentration of the electroplating solution of this example is as follows:

[0027] Sulfuric acid 180g / L;

[0028] Vanadyl sulfate 100g / L;

[0029] Vanadium pentoxide 5g / L;

[0030] Additives also include copper ion sources, chloride ions, etc., which are omitted in view of the well-known techniques in this field.

[0031] The temperature of the above-mentioned improved chemical agent is controlled between 20 and 24°C, and a certain DC voltage is applied between the insoluble anode soaked in the above-mentioned improved chemical agent and the circuit board as the cathode by spraying circulation to form a loop. Copper ions are deposited on the circuit board as the cathode, and the cathode current density is 5ASD, electrolyzed for 30 minutes, which has an excellent filling and leveling effect on the depression of the circuit board. Through the surface scratch test, the length of the scratch is 10cm, the wi...

Embodiment 2

[0033] This example uses a vertical plating process. The composition concentration of the electroplating solution of this example is as follows:

[0034] Sulfuric acid 200g / L;

[0035] Vanadyl sulfate 50g / L;

[0036] Vanadium pentoxide 3g / L;

[0037] Additives also include copper ion sources, chloride ions, etc., which are omitted in view of the well-known techniques in this field.

[0038] The temperature of the above-mentioned improved chemical agent is controlled between 20 and 24°C, and a certain DC voltage is applied between the insoluble anode soaked in the above-mentioned improved chemical agent and the circuit board as the cathode by spraying circulation to form a loop. Copper ions were deposited on the circuit board as the cathode, the cathode current density was 3ASD, electrolysis was performed for 30 minutes, the blind holes with a diameter of 100 μm and a depth of 75 μm were completely filled, and the section showed that the filling rate was 105%.

Embodiment 3

[0040] This example uses a vertical plating process. The composition concentration of the electroplating solution of this example is as follows:

[0041] Sulfuric acid 220g / L;

[0042] Vanadyl sulfate 30g / L;

[0043] Vanadium pentoxide 2g / L;

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Abstract

The invention discloses an electroplating solution for surface pore filling of plate parts and an electroplating method thereof. The electroplating solution contains 0.1-200g/L tetravalent vanadium and 0.2-15g/L pentavalent vanadium. The tetravalent vanadium and the pentavalent vanadium which are added to the electroplating solution are capable of forming a quasi-reversible redox system, and in the redox system, the pentavalent vanadium is superior to bivalent copper in reduction. Compared with the bivalent iron/trivalent iron system in the prior art, the charge number of the pentavalent vanadium is far higher than that of trivalent ferric irons so that the radius of the pentavalent vanadium hydrated ion can be greater than that of the trivalent ferric hydrated iron. The case that the metal ions of high titanium oxide are difficult to supplement by the way of electron transfer due to concentration polarization is avoided, so that more excellent pore-filling effect can be achieved.

Description

technical field [0001] The invention relates to the technical field of copper electroplating, in particular to an electroplating solution and an electroplating method for filling holes on the surface of plate-shaped parts. Background technique [0002] With the development of science and technology, electronic products tend to be more and more intelligent and miniaturized. This trend continues to promote the improvement of the circuit board manufacturing process; and eventually leads to the emergence of high-density interconnect circuit boards (HDI). This kind of circuit board has small pad diameter, small internal line width, small line spacing, and many layers at the same time. Therefore, the number of through holes or blind holes that provide access between different layers is large and the aperture is small; this brings great challenges to the process of metallization in the hole, thereby establishing a channel between layers, drilling process, filling material , and th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/02C25D3/38C25D7/00H05K3/42
Inventor 章晓冬冯建松刘江波童茂军王亚君
Owner 上海天承化学有限公司
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