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Modified styrene-maleic anhydride copolymer and thermosetting resin composition

A technology of resin composition and maleic anhydride, which is applied in the direction of synthetic resin layered products, layered products, chemical instruments and methods, etc., can solve the problems of harsh reaction conditions, processing technology and storage effects, dielectric constant and Problems such as increased dielectric loss

Active Publication Date: 2014-11-19
SHENGYI TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when an acid anhydride curing agent is used in combination with an epoxy resin, there is a problem of reactivity: without adding an accelerator, the reaction conditions are harsh and require a high reaction temperature, but the reaction at room temperature is very fast with the addition of an accelerator. Both processability and storage are seriously affected
However, this technology uses the hydroxyl group on the hydroxyl modifier or the newly generated carboxyl group after the modification reaction as the curing functional group to cure the epoxy resin, which will generate secondary hydroxyl groups during the curing process, which will deteriorate the dielectric properties of the cured product. , that is, the dielectric constant and dielectric loss increase, which is not conducive to its application in high-frequency and high-speed printed circuit board materials

Method used

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  • Modified styrene-maleic anhydride copolymer and thermosetting resin composition
  • Modified styrene-maleic anhydride copolymer and thermosetting resin composition
  • Modified styrene-maleic anhydride copolymer and thermosetting resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] Dissolve 250g of styrene-maleic anhydride copolymer resin (the ratio of styrene to maleic anhydride is 4:1), 110g of dicyclohexylcarbodiimide, and 100g of phenol in ethyl acetate and place them in a three-neck reaction flask Mix well, then add 1.0g of 4-dimethylaminopyridine under stirring, react at room temperature for 8 hours, place the reaction solution in a low temperature environment of 0-5°C to cool for a period of time, then filter to separate solid impurities, and then prepare The product distillation, purification obtains the styrene-maleic anhydride copolymer A-1 of phenol modification, and GPC method records its number-average molecular weight and is 8000g / mol, and structural formula is as follows:

[0049]

[0050] In the formula, n is an integer ranging from 1 to 30, x and y are both positive integers and the ratio of x to y is 4:1; R1, R2, R3 and R4 are all hydrogen atoms, and R5 and R6 are phenoxy groups.

Embodiment 2

[0052] Mix 150 g of styrene-maleic anhydride copolymer resin (the ratio of styrene to maleic anhydride is 2:1), 110 g of dicyclohexylcarbodiimide, 3-hydroxyl-1,2,3-benzene with ethyl acetate 170g of triazin-4(3H)-one was fully dissolved and placed in a three-neck reaction flask for thorough mixing, then 3.0g of 4-dimethylaminopyridine was added under stirring, and the reaction was carried out at room temperature for 10 hours, and the reaction solution was placed at 0~ Cool at a low temperature of 5°C for a period of time and then filter to separate solid impurities, then distill and purify the obtained product to obtain 3-hydroxy-1,2,3-benzotriazin-4(3H)-one modified Styrene-maleic anhydride copolymer A-2, using GPC method to record its number average molecular weight is 13000g / mol, structural formula is as follows:

[0053]

[0054] In the formula, n is an integer ranging from 1 to 30, x and y are positive integers and the ratio of x to y is 2:1; R1, R2, R3 and R4 are all ...

Embodiment 3

[0056] 100g of styrene-maleic anhydride copolymer resin (the ratio of styrene and maleic anhydride is 1:1), 110g of dicyclohexylcarbodiimide, N-(4-hydroxyphenyl)maleimide were mixed with tetrahydrofuran. After fully dissolving 200g of amine, place it in a three-neck reaction flask and mix thoroughly, then add 2.0g of 4-dimethylaminopyridine under stirring, react at room temperature for 10 hours, and place the reaction solution in a low-temperature environment of 0-5°C to cool for a period of time Then filter and separate the solid impurities, then distill and purify the obtained product to obtain N-(4-hydroxyphenyl)maleimide-modified styrene-maleic anhydride copolymer A-3, which is obtained by GPC method Its number average molecular weight is 21000g / mol, and its structural formula is as follows:

[0057]

[0058] In the formula, n is an integer from 1 to 30, x and y are positive integers and the ratio of x to y is 1:1; R1, R2, R3 and R4 are all hydrogen atoms, R5 and R6 are...

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Abstract

The invention provides a modified styrene-maleic anhydride copolymer which adopts the structural formula shown in the specification. The invention also provides a thermosetting resin composition including both the modified styrene-maleic anhydride copolymer and epoxy resin, and the composition is relatively low in dielectric constant and low in dielectric loss tangent and has excellent heat resistance, processing technology and storage performance. The invention further provides a prepreg and a laminate which are prepared from the thermosetting resin composition and both can be used as printed circuit substrate materials, PCBs and the like.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and in particular relates to a modified styrene-maleic anhydride copolymer and a thermosetting resin composition thereof, as well as a prepreg and a laminate made of the resin composition. Background technique [0002] In the prior art, the material prepared from the thermosetting resin composition with epoxy resin and its curing agent as an essential component has the advantages of good heat resistance, insulation, processability and low cost, so it is widely used in semiconductors, printing Among electronic materials such as circuit boards, it has become the most important raw material in printed circuit boards. [0003] In recent years, with the continuous advancement of high-speed and high-frequency technologies for information processing and information transmission, higher and higher requirements have been put forward for printed circuit substrate materials in terms of dielectr...

Claims

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Application Information

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IPC IPC(8): C08F212/08C08F222/08C08F8/00C08F8/30C08F8/32C08L63/00C08L35/06B32B27/38B32B27/30
Inventor 何继亮马建崔春梅
Owner SHENGYI TECH SUZHOU
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