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Special backing board for hole drilling of printed circuit board and manufacturing method of special backing board

A technology for printing circuit boards and backing plates, which is used in chemical instruments and methods, metal processing, layered products, etc., can solve the problems of drill tip wear, excessive hole wall frizz, and drilling chips remaining in the hole, etc., and achieves good smoothness. performance and surface hardness, the effect of reducing the outlet drape and reducing the temperature of the drill tip

Active Publication Date: 2014-12-10
SHENZHEN NEWCCESS IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a backing plate for drilling printed circuit boards with a metal core material as a supporting structure and a preparation method thereof, aiming at solving the problem that the backing plate is prone to appear during use. Warping and deformation, and during the drilling process, due to the high hardness, the drill bit will be worn and even the drill pin will be broken.

Method used

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  • Special backing board for hole drilling of printed circuit board and manufacturing method of special backing board
  • Special backing board for hole drilling of printed circuit board and manufacturing method of special backing board
  • Special backing board for hole drilling of printed circuit board and manufacturing method of special backing board

Examples

Experimental program
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Effect test

Embodiment 1

[0048] Add meteorological silica powder with a particle size of <150 μm to the epoxy resin adhesive to prepare a mixed adhesive with a viscosity of 25,000 cP, pre-cure for 30 minutes at a constant temperature of 80 ° C, and put the pre-cured mixed adhesive The adhesive is evenly coated on the surface of the 0.1mm aluminum sheet to form a 0.5mm adhesive layer, which is compounded with the 1.8mm thick aluminum honeycomb core of the 3003 series of 1.83*0.06 (honeycomb side length*aluminum foil thickness). Press at 140°C and 0.7MPa for 30 minutes, cool to 25°C and unload the plate to form a product with a thickness of 2.0mm. The physical properties of the product are tested: the thickness tolerance is ±0.1mm, the hardness is SHD 80, and there is no warping after 1 week Bending phenomenon; drilling performance test: drill bit wear is small, no chipping, no residual glue adhesion, hole position accuracy 2.0, hole wall roughness <15μm, drape <10μm, nail head can be ignored.

Embodiment 2

[0050] Apply polyurethane resin adhesive evenly on the surface of 0.14mm aluminum sheet to form an adhesive layer of 0.05mm, and compound it with 1.83*0.04 (honeycomb side length*aluminum foil thickness) 5052 series aluminum honeycomb core with a thickness of 1.5mm , pressed at a temperature of 40°C and a pressure of 0.85MPa for 60 minutes, cooled to 25°C and unloaded to form a product with a thickness of 2.0mm. The physical properties of the product were tested: the thickness tolerance was ±0.08mm, the hardness SHD 78, and placed for 1 There is no warping phenomenon around; drilling performance test: drill bit wear is small, no chipping, no residual glue adhesion, hole position accuracy 2.2, hole wall roughness <17μm, drape <10μm, nail head can be ignored.

Embodiment 3

[0052] After the epoxy adhesive is pre-cured at 90°C for 30 minutes, it is evenly coated on the surface of a 0.08mm aluminum sheet to form a 0.05mm adhesive layer, which is compounded and pressed with an aluminum foam material with a thickness of 1.8mm. Press at a temperature of 150°C and a pressure of 1.1MPa for 30 minutes, cool to 25°C and unload the plate to form a product with a thickness of 2.0mm. The physical properties of the product are tested: the thickness tolerance is ±0.05mm, the hardness is SHD 80, and it is left for 1 week. Warpage phenomenon; Drilling performance test: Little wear of the drill bit, no chipping, no residual glue adhesion, hole position accuracy 2.0, hole wall roughness <15μm, edge <10μm, nail head can be ignored.

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Abstract

The invention discloses a special backing board for hole drilling of a printed circuit board and a manufacturing method of the special backing board. The special backing board for hole drilling of the printed circuit board is formed by combining a metal sheet or a glue-impregnated cured sheet with a metal core material in a bonding mode through adhesives or is formed by bonding the metal core material and an adhesive layer which is formed by coating the surface of the metal core material with a mixture in a bonding and combining mode, wherein the mixture is formed by mixing the adhesives and inorganic powder. The special backing board for hole drilling of the printed circuit board has good flatness and hardness; when the special backing board for hole drilling of the printed circuit board is stored and used, the phenomenon that resistance is increased due to buckling deformation and flashing is avoided; meanwhile, the service life of a drill pin can be prolonged, and the quality of the wall of a hole can be improved.

Description

technical field [0001] The invention relates to the field of PCB processing and preparation, in particular to a backing plate for drilling printed circuit boards and a preparation method thereof. Background technique [0002] In the production process of printed circuit board (PCB), it is necessary to arrange holes on the substrate to match the predetermined circuit design. In the process of hole layout, in order to prevent damage to the processing table and uneven force on the circuit board, a backing plate is often used as a buffer protection device at the basic bottom. [0003] As an important auxiliary material in the drilling field of PCB manufacturing, the backing plate plays a very important role in ensuring the quality of the tinning and copper plating process of the circuit board, protecting the drilling machine table, improving the accuracy of the hole position, suppressing the exit edge, and improving the quality of the hole wall . The backing boards current...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B26D7/00B32B15/04B32B15/01B32B3/12
Inventor 欧亚周杨柳张伦强刘飞
Owner SHENZHEN NEWCCESS IND
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