Terpolymer and thermosetting resin composition thereof

A terpolymer, resin composition technology, applied in layered products, metal layered products, chemical instruments and methods, etc., can solve the influence of processing technology and storage, increase in dielectric constant and dielectric loss. problems, such as the deterioration of the dielectric properties of the cured product, etc.

Active Publication Date: 2014-12-17
SHENGYI TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when an acid anhydride curing agent is used in combination with an epoxy resin, there is a problem of reactivity: without adding an accelerator, the reaction conditions are harsh and require a high reaction temperature, but the reaction at room temperature is very fast with the addition of an accelerator. Both processability and storage are seriously affected
However, this patent uses the hydroxyl group on the hydroxyl modification a

Method used

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  • Terpolymer and thermosetting resin composition thereof
  • Terpolymer and thermosetting resin composition thereof
  • Terpolymer and thermosetting resin composition thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] 312g of styrene, 98g of maleic anhydride, and 55g of N-phenylmaleimide were fully dissolved in butanone and placed in a four-neck reaction flask, and 20.0g of benzoyl peroxide initiator and 50.0g of pentene chain transfer were added agent, and reacted at 70-90°C for 5 hours to obtain an anhydride-containing terpolymer. Then the obtained terpolymer containing anhydride 320g, dicyclohexylcarbodiimide 110g, and phenol 100g are fully dissolved in ethyl acetate and then placed in a three-necked reaction flask to fully mix, then add 1.5g of 4- Dimethylaminopyridine, after reacting at room temperature for 10 hours, place the reaction solution in a low temperature environment of 0-5°C to cool for a period of time, then filter to separate solid impurities, and then distill and purify the obtained product to obtain active ester-modified Terpolymer (A-1), its number average molecular weight is 8200g / mol, and its structural formula contains the following three structural units:

...

Embodiment 2

[0057]Fully dissolve 49g of maleic anhydride, 110g of dicyclohexylcarbodiimide, and 50g of phenol in ethyl acetate and mix them thoroughly in a three-neck reaction flask, then add 1.0g of 4-dimethylaminopyridine under stirring, and react at room temperature After 5 hours, add 16g of methanol to react at room temperature for 5 hours, place the reaction solution in a low temperature environment of 0-5°C to cool for a period of time, then filter and separate the solid impurities, then distill and purify the obtained product to obtain Malay acid diester. At the same time, fully dissolve 90g of N-(4-hydroxyphenyl)maleimide, 110g of dicyclohexylcarbodiimide, and 30g of acetic acid in ethyl acetate, then place them in a three-necked reaction flask and mix them thoroughly, and then Add 2.0g of 4-dimethylaminopyridine, react at room temperature for 6 hours, place the reaction solution in a low temperature environment of 0-5°C to cool for a period of time, then filter to separate solid ...

Embodiment 3

[0061] 49g of maleic anhydride, 110g of dicyclohexylcarbodiimide, and 85g of 3-hydroxy-1,2,3-benzotriazin-4(3H)-one are fully dissolved in ethyl acetate and placed in a three-neck reaction flask Mix well, then add 1.5g of 4-dimethylaminopyridine under stirring, react at room temperature for 4 hours, then add 18g of methanol and react at room temperature for 5 hours, and place the reaction solution in a low temperature environment of 0-5°C to cool for a while After a period of time, the solid impurities are separated by filtration, and then the obtained product is distilled and purified to obtain a maleic acid diester. At the same time, fully dissolve 90g of N-(4-hydroxyphenyl)maleimide, 110g of dicyclohexylcarbodiimide, and 30g of acetic acid in ethyl acetate, then place them in a three-necked reaction flask and mix them thoroughly, and then Add 5.0g of 4-dimethylaminopyridine, react at room temperature for 5 hours, place the reaction solution in a low temperature environment ...

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Abstract

The invention provides a terpolymer containing structural units represented by a general formula (I), a general formula (II) and a general formula (III). The terpolymer has appropriate reaction activity, so as to improve the processing and storage performance of a composition of the terpolymer and epoxy resin, and has excellent dielectric properties. The invention also provides a thermosetting resin composition containing the terpolymer and epoxy resin. The composition has low dielectric constant, low dielectric loss tangent, and excellent heat resistance, processing manufacturability and storage performance. The invention also provides a prepreg and a laminate prepared from the thermosetting resin composition, and the thermosetting resin composition can be used in printed circuit substrate material and printed circuit board.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and in particular relates to a terpolymer and a thermosetting resin composition thereof, as well as a prepreg and a laminate made of the resin composition. Background technique [0002] In the prior art, the material prepared from the thermosetting resin composition with epoxy resin and its curing agent as an essential component has the advantages of good heat resistance, insulation, processability and low cost, so it is widely used in semiconductors, printing Among electronic materials such as circuit boards, it has become the most important raw material in printed circuit boards. [0003] In recent years, with the continuous advancement of high-speed and high-frequency technologies for information processing and information transmission, higher and higher requirements have been put forward for printed circuit substrate materials in terms of dielectric properties. To put it simply,...

Claims

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Application Information

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IPC IPC(8): C08F212/08C08F222/08C08F222/40C08F222/14C08F8/14C08L35/06C08L63/00C08K3/36C08G59/40C08J5/24B32B15/092
Inventor 何继亮马建崔春梅
Owner SHENGYI TECH SUZHOU
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