A kind of LED chip with composite transparent electrode and its manufacturing method
A technology of LED chips and transparent electrodes, applied in circuits, electrical components, semiconductor devices, etc., can solve the problems of high sheet resistance, high resistance, and high forward voltage of the chip, improve contact performance and transmittance, simple process, Easy-to-use effects
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Embodiment 1
[0027] Embodiment 1: as figure 1 As shown, a kind of LED chip with composite transparent electrode, using MOCVD method on Al 2 o 3 Or on the GaN substrate (1) sequentially grow gallium nitride buffer layer (2), N-GaN layer (3), quantum well layer (4), P-GaN layer (5); coating on the P-GaN layer A layer of photoresist, then exposure and development, and one side of the P-GaN layer is etched to the N-GaN layer (3) by ICP (Reactive Ion Etching); first, graphene oxide and polymethacrylate The ester (PMMA) material is uniformly mixed and coated on the substrate wafer, so that the graphene oxide can be tightly attached to the wafer in the reactor without being blown away by the carrier gas or protective gas, and the PMMA Also play the mechanical support effect to reaction product-graphene; 2 is the carrier gas, N 2 In order to protect the gas, a layered film (6) of graphene is obtained by chemical vapor deposition; the layered film (6) prepared by the above steps is immersed in ...
Embodiment 2
[0028] Embodiment 2: as figure 1 As shown, a kind of LED chip with composite transparent electrode, using MOCVD method on Al 2 o 3 Or on the GaN substrate (1) sequentially grow gallium nitride buffer layer (2), N-GaN layer (3), quantum well layer (4), P-GaN layer (5); coating on the P-GaN layer A layer of photoresist, then exposure and development, and one side of the P-GaN layer is etched to the N-GaN layer (3) by ICP (reactive ion etching method); first, graphene and polymethyl methacrylate (PMMA) materials are uniformly mixed and coated on the substrate wafer, so that graphene can be tightly attached to the wafer in the reactor without being blown away by the carrier gas or protective gas, and PMMA also acts To the mechanical support of the reaction product-graphene; the above-mentioned material is placed in a medium temperature tube furnace, with H 2 is the carrier gas, N 2In order to protect the gas, a layered film (6) of graphene is obtained by chemical vapor deposit...
Embodiment 3
[0029] Embodiment 3: as figure 1 As shown, a kind of LED chip with composite transparent electrode, using MOCVD method on Al 2 o 3 Or on the GaN substrate (1) sequentially grow gallium nitride buffer layer (2), N-GaN layer (3), quantum well layer (4), P-GaN layer (5); coating on the P-GaN layer A layer of photoresist, then exposure and development, and one side of the P-GaN layer is etched to the N-GaN layer (3) by ICP (Reactive Ion Etching); first, graphene oxide and polymethacrylate The ester (PMMA) material is uniformly mixed and coated on the substrate wafer, so that the graphene oxide can be tightly attached to the wafer in the reactor without being blown away by the carrier gas or protective gas, and the PMMA Also play the mechanical support effect to reaction product-graphene; 2 is the carrier gas, N 2 In order to protect the gas, a layered film (6) of graphene is obtained by chemical vapor deposition; the layered film (6) prepared by the above steps is immersed in ...
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