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Adhesive, and transparent substrate using same

A technology of transparent substrates and adhesives, which is applied in the direction of non-polymer adhesive additives, polyether adhesives, adhesive types, etc., can solve problems such as solvent cracking, and achieve excellent solvent resistance and excellent adhesion. Good compatibility, transparency and heat resistance

Inactive Publication Date: 2015-02-11
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

More specifically, the transparent substrate of the related art involves a problem in which when the substrate is in contact with any of various solvents, the substrate dissolves or causes solvent cracks

Method used

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  • Adhesive, and transparent substrate using same
  • Adhesive, and transparent substrate using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0092] Hereinafter, the present invention is specifically described by way of examples. However, the present invention is by no means limited to the following Examples. It should be noted that the thickness was measured using a digital micrometer "KC-351C type" manufactured by Anritsu Corporation.

[0093] [Production example 1] Production of thermoplastic resin (b)

[0094] In a reaction vessel equipped with a stirring device, 3.88g (0.012mol) of 4,4'-(1,3-dimethylbutylidene)bis(2,6-dimethylphenol), 4.18g ( 0.012mol) of 4,4'-(diphenylmethylene)bisphenol, 5.17g (0.018mol) of 4,4'-(1-phenylethylidene)bisphenol, 4.07g (0.018mol) of bisphenol A and 0.384 g of benzyltriethylammonium chloride were dissolved in 160 g of 1M sodium hydroxide solution. While stirring the solution, a solution prepared by dissolving 12.05 g (0.059 mol) of terephthaloyl chloride in 181 g of chloroform was added to the solution at one time, followed by stirring the mixture at room temperature for 120 mi...

reference example 1

[0099] [Reference Example 1] Production of thermoplastic resin (A)

[0100] In a reaction vessel equipped with a stirring device, 7.65 g (0.028 mol) of 4,4'-(1,3-dimethylbutylidene) bisphenol, 12.35 g (0.043 mol) of 4,4'- (1-Phenylethylidene)bisphenol, 0.444 g of benzyltriethylammonium chloride and 0.022 g of p-tert-butylphenol were dissolved in 185 g of 1M sodium hydroxide solution. While the solution was being stirred, a solution prepared by dissolving 14.4 g (0.071 mol) of terephthaloyl chloride in 246 g of chloroform was added to the solution at once, followed by stirring the mixture at room temperature for 120 minutes. After that, the polymerization solution was left to stand and separated to separate a polymer-containing chloroform solution, and then the solution was washed with acetic acid water and washed with ion-exchanged water. After that, the washed product was thrown into methanol to precipitate a polymer. The precipitated polymer was filtered off and dried unde...

Embodiment 1

[0102] (preparation of adhesive)

[0103]10 g of the white polymer obtained in Production Example 1 as the thermoplastic resin (b), 2.5 g of an epoxy group terminal coupling agent (manufactured by Shin-Etsu Chemical Co., Ltd.) as the thermosetting monomer (c) , trade name: "KBM-403"; with –Si(OCH 3 ) 3 base) and 0.6 g of 3-ethyl-3(((3-ethyloxetan-3-yl)methoxy)methyl)oxetane (manufactured by TOAGOSEI CO., LTD., Trade name: "ARON OXETANE OXT-221"), 0.05 g of dibutyltin dilaurate as the catalyst (d), and 0.4 g of 1,2-dimethylimidazole as the second catalyst were dissolved in 30 g of cyclopentyl Ketones thus provide a binder.

[0104] (Glass)

[0105] One surface of glass measuring 50 μm in thickness, 10 cm in length, and 4 cm in width was cleaned with methyl ethyl ketone, and then corona-treated and then epoxy-terminated coupling agent (manufactured by Shin-Etsu Chemical Co., Ltd. .Trade name: "KBM-403") for coupling treatment. The other surface of the glass is treated in t...

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Abstract

Provided is an adhesive having excellent solvent resistance and showing excellent adhesiveness even when the adherend is glass or a thermoplastic resin. This adhesive is for resin layer adherends containing glass and / or a thermoplastic resin (A), and contains a thermoplastic resin (b) having a glass transition temperature (Tg) exceeding 200°C, thermosetting monomers (c) having at least one substituent represented by -SiR'x(OR)y (R represents a linear or branched alkyl group of 1-5 carbon atoms, R' represents a linear or branched alkyl group of 1-5 carbon atoms, x represents an integer 0-2, y represents an integer 1-3, and x+y is 3), and a catalyst which acts on the substituents represented by said -SiR'x(OR)y.

Description

technical field [0001] The invention relates to an adhesive and a transparent substrate. Background technique [0002] In recent years, weight reduction and thinning of display elements such as flat panel displays (FPDs: liquid crystal display elements and organic EL display elements, etc.) sexual improvement. Hitherto, glass substrates have been used as transparent substrates for display elements in many cases. The glass substrate is excellent in each of transparency, solvent resistance, gas barrier and heat resistance. However, when one attempts to achieve weight reduction and thinning of glass materials used to form any such glass substrates, the following problems arise. That is, the glass substrate shows a certain degree of, but insufficient, flexibility and insufficient impact resistance, and thus the glass substrate becomes difficult to handle. [0003] In order that the handleability of thin glass substrates can be improved, substrates in which a resin layer is f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J201/00B32B17/10C09J11/06C09J163/00C09J201/06C09J201/10
CPCC09J201/06B32B17/064C09J201/00C09J201/10B32B27/36C09J11/06C08J5/124C08J2367/03C08J2369/00C08J2467/03C09J2203/318C09J171/10C09J171/12Y10T428/31518B32B17/10733B32B2307/412B32B2457/20B32B17/10C09J163/00C09J173/00
Inventor 服部大辅村重毅龟山忠幸
Owner NITTO DENKO CORP