Low-temperature anti-crystalized structural adhesive and preparation method thereof

A technology of anti-crystallization and structural adhesives, applied in the direction of adhesives, epoxy resin adhesives, adhesive types, etc., can solve the problems of epichlorohydrin, such as strong odor, low ambient temperature, and strong corrosion, and achieve simple and easy preparation methods Line, reduce production costs, reduce the effect of shrinkage

Inactive Publication Date: 2015-02-25
CARBON COMPOSITESTIANJIN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In addition, the main reasons for the crystallization of epoxy resin are the high purity of epoxy resin, narrow relative molecular mass distribution, and low ambient temperature. In order to solve this problem, previous researchers mai

Method used

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  • Low-temperature anti-crystalized structural adhesive and preparation method thereof
  • Low-temperature anti-crystalized structural adhesive and preparation method thereof
  • Low-temperature anti-crystalized structural adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0024] Example 1:

[0025] The low-temperature anti-crystallizing structural adhesive provided in this embodiment is formed by mixing the A component and the B component at a weight ratio of 2:1; among them:

[0026] The A component is composed of the following raw materials by weight:

[0027]

[0028] The B component is composed of the following raw materials by weight:

[0029]

[0030] Preparation:

[0031] 1) Preparation of component A: first weigh the raw materials in component A according to the above weight, and then combine bisphenol A epoxy resin, bisphenol F epoxy resin, diglycidyl ether, and dibutyl phthalate And γ-aminopropyltriethoxysilane are added to the mixer and stirred evenly, then add fumed silica, finally add quartz powder until it is evenly stirred, and package;

[0032] 2) Preparation of component B: Weigh the raw materials in component B according to the above ratio, then add the menthane diamine and 2,4,6-tris (dimethylaminomethyl) phenol into the mixer and stir...

Example Embodiment

[0034] Example 2:

[0035] The low-temperature anti-crystallizing structural adhesive provided in this embodiment is formed by mixing the A component and the B component at a weight ratio of 2:1; among them:

[0036] The A component is composed of the following raw materials by weight:

[0037]

[0038]

[0039] Preparation:

[0040] 1) Preparation of component A: first weigh the raw materials in component A according to the above weight, and then combine bisphenol A epoxy resin, bisphenol F epoxy resin, polyethylene glycol diglycidyl ether, and phthalic acid Dioctyl formate and γ-glycidoxypropyl triethoxysilane are added to the mixer and stirred evenly, then added fumed silica, and finally quartz sand is added until it is evenly stirred and packaged;

[0041] 2) Preparation of component B: Weigh the raw materials in component B according to the above ratio, then add QS-J002R and resorcinol to the mixer and stir evenly, then add bentonite, and finally add quartz sand until it is evenly...

Example Embodiment

[0043] Example 3:

[0044] The low-temperature anti-crystallizing structural adhesive provided in this embodiment is formed by mixing the A component and the B component at a weight ratio of 2:1; among them:

[0045] The A component is composed of the following raw materials by weight:

[0046]

[0047]

[0048] The B component is composed of the following raw materials by weight:

[0049]

[0050] Preparation:

[0051] 1) Preparation of component A: first weigh the raw materials in component A according to the above weight, and then combine bisphenol A epoxy resin, bisphenol F epoxy resin, polypropylene glycol diglycidyl ether, polysulfide rubber and γ -Propyltrimethylsilane is added to the mixer and stirred evenly, then fumed silica is added, and finally silicon micropowder is added until it is evenly stirred and packaged;

[0052] 2) Preparation of component B: Weigh the raw materials in component B according to the above ratio, then add QS-J004R and boron trifluoride monoethylamine ...

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Abstract

The invention relates to a low-temperature anti-crystalized structural adhesive and a preparation method thereof. The structural adhesive is prepared by mixing an A component and a B component according to the weight ratio of 2 to 1, wherein the A component consists of bisphenol A epoxy resin, bisphenol F epoxy resin, a glycidyl ether diluent, a flexibilizer, a coupling agent, a fumed silica thixotropic agent and fillers; the B component comprises an alicyclic amine curing agent, an accelerant, a fumed silica thixotropic agent and fillers. According to the low-temperature anti-crystalized structural adhesive, the bisphenol A epoxy resin and bisphenol F epoxy resin are compounded for use, and the diluent containing polyfunctional groups is adopted, so that not only can a good dilution effect be achieved, but also the usage amount of the bisphenol F epoxy resin can be reduced so as to prevent the crystallization of the epoxy resin; the viscosity and shrinkage can be reduced, and therefore the production cost is lowered; the preparation method is simple and feasible, no volatile substances are generated during production, and the low-temperature anti-crystalized structural adhesive is a green and environment-friendly building material and has no harm to the health of production personnel and users.

Description

technical field [0001] The invention belongs to the technical field of building materials and their preparation, and in particular relates to a low-temperature crystallization-resistant structural adhesive and a preparation method thereof. Background technique [0002] Structural adhesive refers to high strength (compressive strength > 65MPa, steel-steel positive tensile bonding strength > 30MPa, shear strength > 18MPa), can withstand large loads, and is resistant to aging, fatigue, and corrosion. It has stable performance and is suitable for bonding adhesives of strong structural parts. It is often used for external steel bonding reinforcement of concrete components, reinforcement and reinforcement of buildings, bridges and other parts. Epoxy structural adhesive is a kind of structural adhesive. Because epoxy resin structural adhesive has excellent properties such as high bond strength, low shrinkage, low creep, chemical resistance and electrical insulation, it pl...

Claims

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Application Information

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IPC IPC(8): C09J163/02C09J11/04
Inventor 陶春影许小海李玉俊张彦冲
Owner CARBON COMPOSITESTIANJIN CO LTD
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