Scaling powder for no-clean lead-free low-silver welding paste

A no-cleaning and fluxing technology, applied in the direction of welding medium, welding equipment, welding/cutting medium/material, etc., can solve the problems of increased workload, strong corrosion, and large environmental pollution, and achieve reduced corrosion, less residue, The effect of little environmental pollution

Active Publication Date: 2015-03-11
CHONGQING UNIV OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] In order to solve the problems that the existing lead-free solder paste needs to be cleaned after soldering, the workload is increased, and the problem of str

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 6

[0050] Examples Prepare raw materials according to the following weight ratio: succinic acid: oxalic acid: citric acid: malic acid, salicylic acid, lactic acid = 3: 3: 1: 1: 0.5: 0.2, succinic acid + oxalic acid + lemon Acid + malic acid + salicylic acid + lactic acid = 13%, surfactant OP-10 is 1.5%, emulsifier ricinoleoyl diethanolamine is 3%, film-forming agent polyethylene glycol 2000 is 8%, antioxidant is Hydroquinone is 1%, corrosion inhibitor benzotriazole is 0.4%, and the balance is solvent. The solvent is isopropanol, diethylene glycol, triethylene glycol, and ethylene glycol butyl ether according to the ratio of 1:1 : 0.8:0.1 volume ratio mixed mixture.

[0051] The formulations of other specific embodiments of the present invention can also be formulated through the parameter ranges of the claims and instructions; in addition, the tin-based solder paste prepared by the solution of the present invention can produce Sn-0.45Ag-0.68Cu Or Sn-0.3Ag-0.7Cu and other convent...

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Abstract

The invention discloses scaling powder for no-clean lead-free low-silver welding paste. The scaling powder comprises, by weight percentage, 3-13% of active agent, 0.2-1.5% of surface active agent, 0.2-3.0% of emulgator, 3.0-10.0% of thixotropic agent, 3-8% of film-forming agent, 0.1-1% of antioxidant, 0.1-0.5% of corrosion inhibitor and the rest of solvent. The active agent is composed of four or five components in succinic acid, oxalic acid, salicylic acid, glutaric acid, citric acid, adipic acid, lactic acid, benzoic acid, malic acid and triethanolamine. The scaling powder for the no-clean lead-free low silver welding paste does not contain halogen, the corrosion to a circuit board is greatly lowered, the printing quality of the welding paste is good without bridging or turned-down edges, a welding point is good in forming after returning, the brazing connecting defect is greatly lowered, the residue is small without solder balls, the cleaning is not needed, the welding paste is directly used for assembling, the Sn-0.45 Ag-0.68 Cu or Sn-0.3 Ag-0.7 Cu low silver welding paste manufactured by using the scaling powder does not contain the halogen and rosin, the organic chemistry smoke is small, and the pollution to the environment is small.

Description

technical field [0001] The invention relates to a flux, especially a flux for no-cleaning lead-free low-silver solder paste, which is suitable for preparing conventional lead-free low-silver solder such as Sn-0.45Ag-0.68Cu or Sn-0.3Ag-0.7Cu Paste products. [0002] Background technique [0003] The solder paste used in surface mount (SMT) plays an important role in the whole soldering process. As an auxiliary material in solder paste (mass fraction is 10%~20%), flux can not only provide excellent soldering performance, but also directly affect the printing performance and storage life of solder paste. Therefore, the quality of flux directly affects the entire process and product quality of SMT. There are many types of fluxes for solder paste, and their component ratios and applicability are different. Although traditional rosin-based fluxes can provide good fluxing performance, most of these fluxes have high solid content, resulting in many residues after soldering and p...

Claims

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Application Information

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IPC IPC(8): B23K35/363
CPCB23K35/3612
Inventor 甘贵生杜长华唐明甘树德杨栋华迟露鑫孟国奇王怀山
Owner CHONGQING UNIV OF TECH
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