Preparation method of hydrophobic nano-modified resin composite coating for LED substrate

Abstract

The invention relates to the preparation of coatings, and aims to provide a method for preparing hydrophobic nano-modified resin composite coatings for LED substrates. The method comprises: first uniformly dispersing nanometer α-Al2O3 and butanol; then adding silane coupling agent KH560 for aging to obtain modified α-Al2O3 sol, concentrated distillation; tridecafluorooctyltriethoxysilane, n- Mix butanol and formic acid, add deionized water, and age to obtain fluorosilane oligomer sol; mix the first two products, epoxy resin monomer, methyl ethyl ketone, xylene and 2,2,4-trimethyl- 1,3‑Pentanediol monoisobutyrate is dispersed to give a coating. The present invention introduces α-Al2O3 nanoparticles into the traditional epoxy resin coating to improve the thermal conductivity of the resin, while retaining the excellent coating and processability of the resin to the greatest extent, and the price is relatively good. The hydrophobic performance is significantly improved, which reduces the problem of short circuits caused by humid air. It is suitable for production and processing on existing production lines, and is a beneficial improvement to traditional epoxy resin-covered aluminum substrates.

Description

technical field [0001] The invention relates to coating technology, in particular to a method for preparing a hydrophobic nano-modified resin composite coating for LED substrates. Background technique [0002] The LED substrate is a bridge connecting the LED and the heat dissipation mechanism, and is the main channel through which heat is transferred from the chip to the outside world. Therefore, it is very important for the safe operation of the LED. Since the circuit wires of the LED are directly wired on the substrate, the thermal conductivity and insulation of the substrate are affected. Sexual demands are high. At the same time, since the LED circuit is directly wired on the substrate, when the surrounding air is humid, the substrate is easy to absorb water vapor, causing short circuits and other phenomena in the circuit. Traditional LED substrate materials are generally made of a pure aluminum substrate coated with a layer of resin insulating layer. In a typical LED s...

AI Technical Summary

Problems solved by technology

The resin insulation layer has high coating and adhesion on the aluminum plate, but most of the aluminum substrate resin insulation layer has little or no thermal conductivity, which prevents heat from being conducted from the LED to the heat sink (metal Substrate), unable to achieve the smooth flow of the entire heat dissipation channel

In this way, the heat accumulation of the LED will quickly cause the LED to fail

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