Metal-ceramic composite material and method for manufacturing metal-ceramic composite parts

A composite material, cermet technology, applied in electrolytic coatings, electrophoretic plating, coatings, etc., can solve the problems of low thermal expansion coefficient, light specific gravity, etc., achieve low expansion coefficient, light weight, and improve the ability to resist thermal and cold cycle impact. Effect
CN104499031BActive Publication Date: 2017-07-07SHENZHEN GUOXIN CRYSTAL MATERIAL TECH
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Patents(China)
Current Assignee / Owner
SHENZHEN GUOXIN CRYSTAL MATERIAL TECH
Publication Date
2017-07-07

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Abstract

The invention discloses a metal-ceramic composite material and a method for manufacturing parts of the metal-ceramic composite material. The metal-ceramic composite material is composed of the following components according to the mass ratio: silicon carbide 76-92%, aluminum 3-22.5%, silicon 0.4% ‑0.8%, zinc 0.8‑1.5%, magnesium 0.1‑1.6%, rare earth 0.2‑1.5%. The metal-ceramic composite material provided by the invention has the advantages of low expansion coefficient, light weight and high heat dissipation rate; and through repeated mechanical performance tests, it is proved that the metal-ceramic composite material also has high strength, good wear resistance and corrosion resistance abrasion resistance. Applying the invention to electronic parts and components can meet the performance requirements of chip packaging, high-power electronic materials and heat dissipation protection materials, improve the heat dissipation performance of the chip, and at the same time make the chip and the base material have a good thermal expansion match, improve the resistance Thermal and cold cycle impact ability, prolong the service life of the device.
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Description

technical field

[0001] The present invention relates to the field of production of materials and components of microelectronic technology equipment and its material structure, in particular to the field of production of chip packaging materials and components and the production field of hand-held and portable radio appliance shells Background technique

[0002] With the development of high-width, high-integration, high-power, and miniaturized electronic products, and the rapid development of semiconductor integrated circuit technology, the problem of heat dissipation of electronic devices and the matching of thermal expansion of various components and materials have become increasingly prominent. In chip packaging, how to effectively overcome thermal resistance and dissipate a large amount of heat energy to the outside world, the choice of chip packaging materials and the composition and matching of the chemical composition of the shell material are particularly important. ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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