Method for preparing silicon nitride crystal whisker
A technology for silicon nitride whiskers and silicon nitride powder is applied in the field of preparation of ultra-fine silicon nitride powder, and can solve the problems of the type, method and process limitation of preparing whiskers, and that the whiskers are not very perfect and accurate. Achieving the effect of high conversion rate and high product purity
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Embodiment 1
[0026] Silicon nitride powder and silicon powder are dried in a drying system, the drying temperature is 80°C, and the drying time is 8 hours to remove the adsorbed water in the powder; according to the quality of silicon nitride powder: silicon powder = 10:90 Ratio and add 10% ammonium chloride as an additive, the fineness of silicon nitride powder and silicon powder is 1-10 microns; fully mix in the raw material mixing system to make the raw materials evenly distributed; send the mixed materials into the nitriding furnace, Add dehydrated and deoxidized nitrogen / hydrogen, the volume ratio of nitrogen and hydrogen is: 3:1, nitriding at 0MPa, 1500°C for 30 hours, and then cooling to obtain silicon nitride whiskers.
[0027] 36% are β-Si3N4 whiskers, 64% α-Si3N4 whiskers, α-Si3N4 whiskers have smooth surfaces, some are defective, and have bifurcated whiskers; rare.
Embodiment 2
[0029] Dry silicon nitride powder and silicon powder in a drying system, the drying temperature is 90°C, and the drying time is 8 hours to remove the adsorbed water in the powder; according to the quality of silicon nitride powder: silicon powder = 30:70 Ratio and add 6% ammonium chloride as an additive, the fineness of silicon nitride powder and silicon powder is 1-10 microns; fully mix in the raw material mixing system to make the raw materials evenly distributed; send the mixed materials into the nitriding furnace, Add dehydrated and deoxidized nitrogen / hydrogen, the volume ratio of nitrogen and hydrogen is: 3:1, nitriding at 0.1MPa, 1500°C for 30 hours, and then cooling to obtain silicon nitride whiskers.
[0030] 75% α-Si3N4 whiskers, 25% β-Si3N4 whiskers, the surface of the whisker structure is smooth, a small amount of defects
Embodiment 3
[0032] Dry silicon nitride powder and silicon powder in a drying system at a drying temperature of 80-100°C and a drying time of 8 hours to remove the adsorbed water in the powder; according to silicon nitride powder: silicon powder = 50:50 The mass ratio of 15% ammonium chloride is added as an additive, and the fineness of silicon nitride powder and silicon powder is 1-10 microns; it is fully mixed in the raw material mixing system to make the raw materials evenly distributed; the mixed material is sent to the nitriding furnace , add dehydrated and deoxidized nitrogen / hydrogen, the volume ratio of nitrogen and hydrogen is: 3:1, nitriding at 0.1MPa, 1450°C for 30 hours, and then cooling to obtain silicon nitride whiskers.
[0033] It is mainly α-Si3N4 whiskers with a diameter of 100-200nm and no obvious defects.
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