Silver paste for ceramic capacitor and preparation method thereof

A technology of ceramic capacitors and silver paste, applied in fixed capacitor electrodes, cable/conductor manufacturing, fixed capacitor parts, etc., can solve problems such as complex production process, toxic steam hazards, complex production management, etc., and achieve wide adaptability , save the preparation process, the effect of simple process

Inactive Publication Date: 2015-05-20
HEFEI SHENGDA ELECTRONIC TECH IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Glass powder is usually made by mixing bismuth oxide, boric acid, silicon dioxide and other raw materials, melting at high temperature, and quenching water. The production process is complicated, and it is accompanied by high temperature and toxic steam hazards.
In addition, it is impossible for the

Method used

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  • Silver paste for ceramic capacitor and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Step 1: Weigh according to the raw material composition and weight percentage of capacitor silver paste, weigh 10 parts of polymer thickener, 30 parts of organic solvent, mix well, then heat the mixed system to 90-120 ° C, and Fully stir, the stirring speed is 60-120 rpm, and the stirring time is 240-300 minutes, so that the polymer thickener is completely dissolved in the solvent to obtain an organic carrier;

[0025] Step 2: Weigh the dispersant, thixotropic agent, and leveling agent in equal parts, and then weigh a certain amount of solvent to dissolve all the additives in the solvent, stir the mixed system evenly, and make 2.8 parts organic additives;

[0026] Step 3: Mix and stir the silver conductive powder with 57% weight of raw materials, the prepared organic carrier and the prepared organic auxiliary agent;

[0027] Step 4: Grind the mixed raw materials obtained in step 3 on a three-roller grinder, obtain a uniformly dispersed slurry through a certain grinding...

Embodiment 2

[0029] Step 1: Weigh according to the raw material composition and weight percentage of capacitor silver paste, weigh 10 parts of polymer thickener, 34 parts of organic solvent, mix well, then heat the mixed system to 90-120 ° C, and Fully stir, the stirring speed is 60-120 rpm, and the stirring time is 240-300 minutes, so that the polymer thickener is completely dissolved in the solvent to obtain an organic carrier;

[0030] Step 2: Weigh the dispersant, thixotropic agent, and leveling agent in equal parts, and then weigh a certain amount of solvent to dissolve all the additives in the solvent, stir the mixed system evenly, and make 5 parts organic additives;

[0031] Step 3: Mix and stir the silver conductive powder with 50% weight of the raw material, the prepared organic carrier and the prepared organic auxiliary agent;

[0032] Step 4: Grind the mixed raw materials obtained in step 3 on a three-roller grinder, and obtain a uniformly dispersed slurry through a certain gri...

Embodiment 3

[0034] Step 1: Weigh according to the raw material composition and weight percentage of capacitor silver paste, weigh 8 parts of polymer thickener, 34 parts of organic solvent, mix well, then heat the mixed system to 90-120 ° C, and Fully stir, the stirring speed is 60-120 rpm, and the stirring time is 240-300 minutes, so that the polymer thickener is completely dissolved in the solvent to obtain an organic carrier;

[0035] Step 2: Weigh the dispersant, thixotropic agent, and leveling agent in equal parts, and then weigh a certain amount of solvent to dissolve all the additives in the solvent, stir the mixed system evenly, and make 3 parts organic additives;

[0036] Step 3: Mix and stir the silver conductive powder with 52% weight of raw materials, the prepared organic carrier and the prepared organic auxiliary agent;

[0037] Step 4: Grind the mixed raw materials obtained in step 3 on a three-roller grinder, and obtain a uniformly dispersed slurry through a certain grindin...

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Abstract

The invention provides a silver paste for a ceramic capacitor and a preparation method thereof. The silver paste contains the following ingredients in percentage by mass: 50-57% of silver conductive powder, 0.2-3% of inorganic additive, 40-44% of organic carrier and 2-5% of organic auxiliaries, wherein the organic carrier is a mixed system of an organic solvent and a macromolecular thickener, and the organic auxiliaries comprise a dispersing agent, a thixotropic agent and a leveling agent. According to the silver paste for the ceramic capacitor and the preparation method thereof, adhesive power between an electrode layer and a substrate is provided in a manner of replacing glass melting and curing with chemical bonding, a glass powder preparation process is avoided, the process is simple, good adhesive power with ceramic capacitor substrates of most current types can be formed, and thus, the adaptability is extensive.

Description

technical field [0001] The invention relates to the technical field of electronic materials, in particular to a silver paste for ceramic capacitors and a preparation method thereof. Background technique [0002] Ceramic capacitors are currently used as basic components in various electronic fields such as televisions, portable computers, and digital audio-visual products. With the popularity of household appliances in recent years and the miniaturization and miniaturization of electronic products, the demand for capacitors is increasing year by year. The silver paste is evenly attached to the surface of the dielectric by screen printing, and an excellent electrode layer is formed on the surface of the dielectric through drying, sintering and other processes. The demand for conductive silver paste used as the electrode of ceramic capacitors is gradually increasing, and the market prospect is promising. [0003] CN201010124369.5 and CN201110075889.6 respectively provid...

Claims

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Application Information

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IPC IPC(8): H01B1/22H01G4/008H01B13/00
Inventor 赵敏敏张虎雷跃文
Owner HEFEI SHENGDA ELECTRONIC TECH IND CO LTD
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