Organosilicone heat conduction insulating piece and preparation method thereof

A technology of heat conduction insulation and heat conduction insulation layer, which is applied in the field of organic silicon heat conduction insulation sheet and its preparation, which can solve the problems of inability to further improve the heat conduction performance, poor tear resistance of the sheet, and low filler filling rate, etc., and achieve good insulation performance , good puncture resistance, simple preparation method

Active Publication Date: 2015-07-22
SHENZHEN ANPIN SILICONE MATERIAL
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The heat-conducting silica gel sheet is a silicone polymer elastomer with glass fiber as the base material and silica gel as the main material, and has thermal conductivity and flame-retardant properties by adding heat-conducting, flame-retardant and other fillers to the silica gel. Low-viscosity silica gel is usually used as the main material to prepare silica gel sheets. Under the premise of meeting

Method used

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  • Organosilicone heat conduction insulating piece and preparation method thereof
  • Organosilicone heat conduction insulating piece and preparation method thereof
  • Organosilicone heat conduction insulating piece and preparation method thereof

Examples

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Example Embodiment

[0074] The preparation method of the aforementioned organic silicon thermally conductive insulating sheet includes the following operation steps:

[0075] A. Mix the components contained in the organic silicon thermally conductive insulating composition according to the proportion to obtain a mixture;

[0076] B. The mixture is molded and cured at 40-90°C to obtain a cured sheet;

[0077] C. The temperature is raised to 110-250°C to vulcanize the primary cured sheet to obtain an organic silicon thermally conductive insulating sheet.

[0078] The molding of the mixture is to use processes such as calendering, casting, molding, injection molding, extrusion molding, etc., to make the mixture into a sheet with a certain thickness.

[0079] Preferably, when the organic silicon thermally conductive insulating sheet further includes a substrate, in step B, the mixture is compounded with the substrate while being molded, and then cured.

[0080] Preferably, the curing time is the time required f...

Example Embodiment

[0090] Example 1

[0091] In the silicone thermally conductive insulating composition, the base polymer is α,ω-divinyl polydimethylsiloxane with a viscosity of 100mpa·s at 25°C (the mass percentage of vinyl is 2.5%); the thermally conductive filler is Alumina with an average particle size of 30μm; crosslinking agent is methyl hydrogen-containing silicone oil, viscosity at 25°C is 100mpa·s, hydrogen content is 0.2% (mass); chain extender is α with a viscosity of 100mpa·s at 25°C , Ω-dihydropolydimethylsiloxane (0.18% (mass) of hydrogen). Vinyl (-CH=CH 2 The ratio of the molar amount of) to the sum of the molar amount of hydrogen groups in the crosslinking agent and the chain extender is 2.87.

[0092] In the silicone thermally conductive insulating composition, the silicone resin is DY-MQ102, Shandong Dayi Chemical Co., Ltd. Meanwhile, the platinum catalyst is a platinum catalyst, and the vulcanizing agent is bis(2,4-dichlorobenzoyl) peroxide.

[0093] The preparation method of the...

Example Embodiment

[0096] Example 2

[0097] In the silicone thermally conductive insulating composition, the base polymer is α, ω-divinyl polydimethylsiloxane with a viscosity of 4000mpa·s at 25°C (the mass percentage of vinyl is 0.50%); the thermally conductive filler is Aluminum nitride with an average particle size of 20μm; crosslinking agent is methyl hydrogen-containing silicone oil, viscosity at 25°C is 1000mpa·s, hydrogen content is 0.08% (mass); chain extender is a viscosity at 25°C of 1000mpa·s α,ω-dihydropolydimethylsiloxane (with a hydrogen content of 0.05% (mass)). Vinyl (-CH=CH 2 The ratio of the molar amount of) to the sum of the molar amount of hydrogen groups in the crosslinking agent and the chain extender is 1.27.

[0098] In the silicone thermally conductive insulating composition, the silicone resin is DY-MQ102, Shandong Dayi Chemical Co., Ltd. Meanwhile, the platinum catalyst is a platinum catalyst, and the vulcanizing agent is bis(2,4-dichlorobenzoyl) peroxide.

[0099] The pr...

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Abstract

The invention discloses an organosilicone heat conduction insulating piece and a preparation method thereof. The organosilicone heat conduction insulating piece at least comprises a heat conduction insulating layer, wherein the heat conduction insulating layer is prepared from an organosilicone heat conduction insulating composition by using a sheet material forming process; the organosilicone heat conduction insulating piece comprises a substrate; the organosilicone heat conduction insulating composition is prepared from linear organopolysiloxane containing alkenyl, heat conduction packing, a cross-linking agent, a platinum catalyst, a vulcanizing agent and the like. The organosilicone heat conduction insulating piece disclosed by the invention is high in heat conductivity, good in insulating property, good in stabbing resistance and tearing resistance, flexible in adjusting product property, simple in preparation method and wide in adaptability.

Description

technical field [0001] The invention belongs to the technical field of organic silicon materials, and relates to an organic silicon heat-conducting insulating sheet and a preparation method thereof. technical background [0002] In the miniaturization and ultra-thin design of equipment, the heat transfer, sealing, and insulation between the heat-generating part and the heat-dissipating part are one of the key factors to be considered. At present, thermally conductive and insulating filling materials are the main means to solve this problem. Thermally conductive and insulating filling materials are required to have good thermal conductivity and insulation properties, as well as strong tensile strength under low thickness conditions, which can resist puncture and tear, including thermally conductive silicone sheets. [0003] The heat-conducting silica gel sheet is a silicone polymer elastomer with glass fiber as the base material and silica gel as the main material, and has th...

Claims

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Application Information

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IPC IPC(8): C08L83/07C08L83/05C08K3/22C08K3/28C08K5/14B32B27/06B32B27/12B32B27/20B32B27/28
Inventor 李云张耀湘覃剑
Owner SHENZHEN ANPIN SILICONE MATERIAL
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