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Organosilicone heat conduction insulating piece and preparation method thereof

A technology of heat conduction insulation and heat conduction insulation layer, which is applied in the field of organic silicon heat conduction insulation sheet and its preparation, which can solve the problems of inability to further improve the heat conduction performance, poor tear resistance of the sheet, and low filler filling rate, etc., and achieve good insulation performance , good puncture resistance, simple preparation method

Active Publication Date: 2015-07-22
SHENZHEN ANPIN SILICONE MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The heat-conducting silica gel sheet is a silicone polymer elastomer with glass fiber as the base material and silica gel as the main material, and has thermal conductivity and flame-retardant properties by adding heat-conducting, flame-retardant and other fillers to the silica gel. Low-viscosity silica gel is usually used as the main material to prepare silica gel sheets. Under the premise of meeting the production process requirements, the amount of filler and the thermal conductivity of the final sheet can be increased, but the prepared sheet has poor tear resistance and poor reliability after application. , or use raw polymer silicon rubber as the main material to obtain a sheet with good tear resistance, but the filling rate of the product is low, and the thermal conductivity cannot be further improved

Method used

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  • Organosilicone heat conduction insulating piece and preparation method thereof
  • Organosilicone heat conduction insulating piece and preparation method thereof
  • Organosilicone heat conduction insulating piece and preparation method thereof

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preparation example Construction

[0074] The preparation method of the above-mentioned organosilicon heat-conducting insulating sheet comprises the following steps:

[0075] A. Mix the components contained in the silicone thermally conductive and insulating composition uniformly according to the proportion to obtain a mixture;

[0076] B. Form the mixture and cure it at 40-90°C to obtain a cured sheet;

[0077] C. Raise the temperature to 110-250° C. to vulcanize the primary cured sheet to obtain a silicone heat-conducting insulating sheet.

[0078] The molding of the mixture means that the mixture is made into a sheet with a certain thickness by calendering, casting, molding, injection molding, extrusion molding and other techniques.

[0079] Preferably, when the silicone heat-conducting insulating sheet further includes a base material, in step B, the mixture is molded and compounded with the base material, and then cured.

[0080] Preferably, the curing time is the time required for the mixture to cure un...

Embodiment 1

[0091] In the silicone heat-conducting insulating composition, the base polymer is α, ω-divinylpolydimethylsiloxane (the mass percentage of vinyl is 2.5%) with a viscosity of 100mpa·s at 25°C; the heat-conducting filler is Alumina with an average particle size of 30 μm; the crosslinking agent is methyl hydrogen-containing silicone oil with a viscosity of 100 mpa s at 25 °C and a hydrogen content of 0.2% (mass); the chain extender is α , ω-dihydropolydimethylsiloxane (hydrogen content of 0.18% (mass)). The vinyl group in the base polymer (-CH=CH 2 The ratio of the molar weight of ) to the sum of the molar weights of hydrogen groups in the crosslinking agent and chain extender is 2.87.

[0092] In the silicone heat-conducting insulating composition, the silicone resin is DY-MQ102, Shandong Dayi Chemical Co., Ltd. Meanwhile, the platinum catalyst is a platinum catalyst, and the vulcanizing agent is bis(2,4-dichlorobenzoyl) peroxide.

[0093] The preparation method of organosil...

Embodiment 2

[0097] In the silicone heat-conducting and insulating composition, the base polymer is α, ω-divinylpolydimethylsiloxane (the mass percentage of vinyl is 0.50%) with a viscosity of 4000mpa·s at 25°C; the heat-conducting filler is Aluminum nitride with an average particle size of 20 μm; the cross-linking agent is methyl hydrogen-containing silicone oil, the viscosity at 25°C is 1000mpa·s, and the hydrogen content is 0.08% (mass); α,ω-Dihydropolydimethylsiloxane (hydrogen content: 0.05% by mass). The vinyl group in the base polymer (-CH=CH 2 ) and the ratio of the sum of the molar weights of the hydrogen groups in the cross-linking agent and the chain extender is 1.27.

[0098] In the silicone heat-conducting insulating composition, the silicone resin is DY-MQ102, Shandong Dayi Chemical Co., Ltd. Meanwhile, the platinum catalyst is a platinum catalyst, and the vulcanizing agent is bis(2,4-dichlorobenzoyl) peroxide.

[0099] The preparation method of organosilicon heat conducti...

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Abstract

The invention discloses an organosilicone heat conduction insulating piece and a preparation method thereof. The organosilicone heat conduction insulating piece at least comprises a heat conduction insulating layer, wherein the heat conduction insulating layer is prepared from an organosilicone heat conduction insulating composition by using a sheet material forming process; the organosilicone heat conduction insulating piece comprises a substrate; the organosilicone heat conduction insulating composition is prepared from linear organopolysiloxane containing alkenyl, heat conduction packing, a cross-linking agent, a platinum catalyst, a vulcanizing agent and the like. The organosilicone heat conduction insulating piece disclosed by the invention is high in heat conductivity, good in insulating property, good in stabbing resistance and tearing resistance, flexible in adjusting product property, simple in preparation method and wide in adaptability.

Description

technical field [0001] The invention belongs to the technical field of organic silicon materials, and relates to an organic silicon heat-conducting insulating sheet and a preparation method thereof. technical background [0002] In the miniaturization and ultra-thin design of equipment, the heat transfer, sealing, and insulation between the heat-generating part and the heat-dissipating part are one of the key factors to be considered. At present, thermally conductive and insulating filling materials are the main means to solve this problem. Thermally conductive and insulating filling materials are required to have good thermal conductivity and insulation properties, as well as strong tensile strength under low thickness conditions, which can resist puncture and tear, including thermally conductive silicone sheets. [0003] The heat-conducting silica gel sheet is a silicone polymer elastomer with glass fiber as the base material and silica gel as the main material, and has th...

Claims

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Application Information

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IPC IPC(8): C08L83/07C08L83/05C08K3/22C08K3/28C08K5/14B32B27/06B32B27/12B32B27/20B32B27/28
Inventor 李云张耀湘覃剑
Owner SHENZHEN ANPIN SILICONE MATERIAL
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