Underfill adhesive and preparation method thereof

An underfill, epoxy resin technology, applied in the direction of adhesive, epoxy resin, adhesive type, etc., can solve the problem of poor thermal conductivity, achieve high thermal conductivity and improve thermal conductivity.

Active Publication Date: 2015-09-16
SHENZHEN INST OF ADVANCED ELECTRONICS MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Based on this, it is necessary to provide an underfill with better thermal con

Method used

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  • Underfill adhesive and preparation method thereof

Examples

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preparation example Construction

[0052] Further, a method for preparing an underfill glue is provided. see figure 2 , the preparation method of the underfill comprises the following steps:

[0053] Step S110: uniformly mixing the epoxy resin, curing agent and toughening agent to obtain a first mixture.

[0054] In terms of mass percentage, 10-50% of epoxy resin, 2-20% of curing agent and 1-15% of toughening agent are added into a high-speed shear mixing tank and mixed uniformly to obtain the first mixture.

[0055] Preferably, the uniform mixing time is 5-30 minutes.

[0056] Step S120: adding fillers, dispersants, defoamers, coupling agents and pigments into the first mixture, and mixing uniformly to obtain a second mixture.

[0057] In terms of mass percentage, add 30-70% of filler, 0.1-3% of dispersant, 0.05%-1% of defoamer, 0.1-1% of coupling agent and 0.1-0.5% of pigment into the above mixture Fill in, mix evenly, obtain the second mixture.

[0058] Preferably, the uniform mixing time is 5-30 minut...

Embodiment 1

[0068] Weigh 10.0g of bisphenol A type epoxy resin E511, 10.0g of curing agent methyl hexahydrophthalic anhydride, and 1.0g of toughening agent carboxyl-terminated nitrile rubber (CTBN) and add them into a high-speed shear mixing tank and mix evenly for 5min, then weigh Take spherical nano-SiO with a particle size of 800nm 2 Filler 30.0g, spherical nano-Al with a particle size of 200nm 2 o 3 Put 38.15g of filler, 0.1g of fatty acid dispersant, 0.05g of polysiloxane defoamer, 0.1g of silane coupling agent and 0.5g of pigment into the mixing tank and mix evenly for 5min. Next, 0.1 g of the catalyst 2-ethyl-4-methylimidazole and 10.0 g of the diluent o-cresyl glycidyl ether were put into the mixing tank and mixed uniformly for 5 minutes, and vacuum degassed for 5 min to obtain the underfill rubber.

[0069] The component distribution ratio of the obtained underfill is shown in Table 1 below:

[0070] Table 1

[0071] components mass percentage filler 68.15％ ...

Embodiment 2

[0074] Weigh bisphenol F type epoxy resin EPIKOTE 86220.0g, alicyclic epoxy resin 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexyl carboxylate 10.0g, curing agent m-phenylenediamine 8.0 g and 2.0 g of toughening agent polysulfide rubber were added to the high-speed shear mixing tank and mixed evenly for 10 minutes, and then weighed spherical SiO with a particle size of 1000 nm 2 Put 20.5g of filler, 33.4g of spherical nano-BN filler with a particle size of 200nm, 0.2g of fatty acid dispersant, 0.10g of polysiloxane defoamer, 0.2g of silane coupling agent and 0.5g of pigment into the mixing tank Mix well for 10min. Next, 0.1 g of the catalyst 2-phenyl-4-methylimidazole and 5.0 g of the diluent neopentyl glycol diglycidyl ether were put into the mixing tank and mixed uniformly for 10 minutes, followed by vacuum defoaming for 5 minutes to obtain the underfill rubber.

[0075] The component distribution ratio of the obtained underfill is shown in Table 2 below:

[0076] Table 2

...

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Abstract

The invention relates to an underfill adhesive and a preparation method thereof. The underfill adhesive comprises the following ingredients by weight percent: 30 to 70 percent of filler, 10 to 50 percent of epoxy resin, 2 to 20 percent of curing agent, 0.1 to 0.5 percent of catalyst, 1 to 15 percent of flexibilizer, 1 to 25 percent of diluting agent, 0.1 to 3 percent of dispersing agent, 0.05 to 1 percent of defoaming agent, 0.1 to 1 percent of coupling agent and 0.1 to 0.5 percent of pigment; the filler comprises a first component and a second component, wherein the first component is spherical silicon dioxide, and the second component is selected from one of spherical nano aluminum oxide, spherical nano boron nitride, spherical nano aluminum nitride, spherical nano silicon carbide, spherical nano silicon nitride and spherical nano diamond powder. The filler comprises the first component and the second component, and a heat conduction channel can be formed in the underfill adhesive, so that the heat conduction coefficient can be increased; and the underfill adhesive has high heat conductivity and can be widely applied to high-density systematic encapsulation.

Description

technical field [0001] The invention relates to the technical field of adhesives, in particular to an underfill adhesive and a preparation method thereof. Background technique [0002] Underfill is used to fill the gap between the chip and the substrate formed by the solder ball connections. Tightly adhere the chip, solder ball bumps and the substrate together, that is, use the underfill technology to reduce the stress on the solder joint caused by the mismatch between the thermal expansion coefficient of the chip and the substrate, and improve the thermal fatigue life of the solder joint. Underfill glue plays a non-negligible role in improving the reliability of electronic packaging. [0003] In addition, with the improvement of chip integration, packaging density and operating frequency, the ratio of power to volume is increasing day by day, causing the heat flux density of the chip to increase rapidly and the heating power to increase rapidly under the condition of high ...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J11/04
Inventor 李刚朱朋莉赵涛孙蓉
Owner SHENZHEN INST OF ADVANCED ELECTRONICS MATERIALS
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