Carbon nanotube containing printed circuit board silver paste and preparation method thereof

Abstract

A carbon nanotube containing printed circuit board silver paste comprises the following raw materials by weight: 40-50 parts of ball micron silver powder, 15-20 parts of carbon nanotubes, 10-15 parts of flaky micron silver powder, 7-10 parts of glass powder, 8-12 parts of terpilenol, 7-9 parts of E-12 epoxy resin, 1-2 parts of triethylene tetramine, 3-5 parts of terpene, 5-7 parts of butyl carbitol, 1-3 parts of polyvinyl alcohol, 4-6 parts of 2-(2-butoxyethoxy)-ethanol acetate, 1-2 parts of n-butyl alcohol, 1-2 parts of epoxy flaxseed oil, and 3-5 parts of hyperbranched polyurethane acrylate. By adding carbon nanotubes and hyperbranched polyurethane acrylate, silver powder disperses more uniformly, the electrical conductivity is more excellent, and the consumption of silver powder is reduced. The organic carrier of the silver paste has excellent printing performance, the obtained conductive circuit is continuous and clear and does not blister or fracture, and the yield of circuit boards is greatly improved.

Description

technical field [0001] The invention belongs to the technical field of electronic paste, and in particular relates to a silver paste for a printed circuit board containing carbon nanotubes and a preparation method thereof. Background technique [0002] In the modern microelectronics industry, people have higher and higher requirements for electronic components, and the production is mostly carried out by process and standardization to reduce costs. The printed circuit board (PCB) was born to meet the needs of the microelectronics industry. Correspondingly, conduct research on new conductive pastes to match electronic pastes such as conductive pastes, electrode pastes, dielectric pastes, resistor pastes, and hole filling pastes with printed circuit boards (PCBs) that require new requirements. It is imperative. [0003] Generally speaking, the main components of electronic paste include functional phases such as metal, noble metal powder, etc., inorganic binders such as glass...

AI Technical Summary

Problems solved by technology

[0005] The binder in the conductive silver paste has a great influence on the yield of circuit printing, such as viscosity, cohesiveness, adhesion, leveling, film formation, solvent volatility, etc. will affect the printing performance of the circuit , there are pores, open circuits, etc., and sometimes the glass phase has not yet begun to melt after the organic matter has volatilized, resulting in the phenomenon that the conductive line falls off from the substrate, and the conductive line is scrapped. Therefore, the performance of the organic binder needs to be improved.

[0006] At present, many inorganic binders use glass powder. Glass powder is made of metal oxides, silicon oxide and other materials. If the melting point is too high, the glass phase has not yet started to melt after the volatilization of organic matter is completed, resulting in conductive lines obtained from conductive silver paste. The phenomenon of falling off from the substrate makes the conductive circuit scrapped; and many of the current glass powders contain harmful substances such as lead, which is not good for the environment, so it is necessary to develop glass powders with better performance