Flexible surface acoustic wave device resistant to high temperature and manufacturing method thereof

A surface acoustic wave device, high temperature resistant technology, used in electrical components, impedance networks and other directions, can solve the problems of surface acoustic wave device influence, softening, melting, decomposition, inability to fold, bend, etc., to improve the center frequency, quality Light, inexpensive effect

Inactive Publication Date: 2015-10-14
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For surface acoustic wave devices prepared on rigid single crystal substrates, although the technology is mature and the device performance is stable, it has a large mass and cannot work in a non-planar environment, and cannot be folded or bent.
For surface acoustic wave devices prepared on flexible organic polymer substrates, although they have good flexibility and light weight and portability, they are difficult to apply due to the limitations of the substrate (organic polymer) itself. In a high temperature environment, at 200°C to 300°C, most organic polymers will soften, melt, decompose, and emit volatile gases, which will have a great impact on surface acoustic wave devices

Method used

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  • Flexible surface acoustic wave device resistant to high temperature and manufacturing method thereof
  • Flexible surface acoustic wave device resistant to high temperature and manufacturing method thereof

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Embodiment

[0027] Step 1. Pretreatment of the flexible alloy substrate: select high-temperature nickel-based Hastelloy C-276 as the flexible alloy material, and cut the flexible alloy material into a thickness of 100 μm and a size of 20 mm×10 mm. Electrochemical polishing is performed on the flexible alloy substrate to polish, passivate and remove metal burrs on the surface of the alloy strip. Use a mixed solution of alcohol and acetone to ultrasonically clean both sides of the alloy strip twice. Put the cleaned flexible Hastelloy substrate into an oven filled with pure nitrogen and heat it to 100°C for 1 hour.

[0028] Step 2. Preparation of the buffer layer and the bottom protective layer: a layer of yttrium oxide (Yttrium oxide (Y 2 o 3 ) or yttrium aluminum oxide (Y 2 o 3 -Al 2 o 3 ) amorphous oxide film, the specific parameters are shown in the table below.

[0029]

[0030] Step 3, the preparation of aluminum nitride piezoelectric thin film: the aluminum nitride piezoelec...

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Abstract

The invention relates to the field of surface acoustic wave device manufacturing, and specifically relates to a structure of a flexible surface acoustic wave device resistant to high temperature and a manufacturing method thereof. The structure sequentially comprises, from bottom to top, a bottom protective layer, a flexible alloy substrate, a buffer layer, a piezoelectric film, an interdigital electrode, and a top protective layer. The flexible alloy substrate is made of high-temperature flexible alloy strips. The buffer layer and the bottom protective layer are amorphous oxide films. The piezoelectric film is an aluminum nitride film. The interdigital electrode is made of gold. The top protective layer is an aluminum nitride film. The method comprises the steps of preprocessing the flexible alloy substrate, preparing the amorphous oxide films by a chemical solution dip-coating method, preparing the piezoelectric film and the interdigital electrode, and finally, preparing the top protective layer. The flexible surface acoustic wave device has the advantages of being resistant to high temperature, good in flexible characteristic, light, capable of working in a complex curved surface environment, and low in cost.

Description

Technical field: [0001] The invention relates to the field of surface acoustic wave device manufacturing, in particular to a structure and a manufacturing method of a high temperature resistant flexible surface acoustic wave device. Background technique: [0002] A surface acoustic wave is an elastic wave that propagates along a solid surface. In 1855, it was discovered by the British physicist Rayleigh in the study of seismic waves. This kind of elastic wave propagates along the semi-infinite solid surface, its energy is mainly concentrated on the surface of the elastic body, and its amplitude decays exponentially with the increase of the depth into the substrate material, this kind of wave is the surface acoustic wave, also called Ray lipo. [0003] Surface acoustic wave devices are a new type of devices that use surface acoustic waves to complete various complex signal processing, and have been widely used in modern electronic information technology. The first surface ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03H3/08H03H9/145
Inventor 彭斌姜建英张万里张文旭王睿邓言文
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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