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REsin Composition For Insulating Materials, Insulating Ink, Insulating Film And Organic Field Effect Transistor Using Insulating Film

A technology of resin composition and insulating material, applied in insulators, plastic/resin/wax insulators, organic insulators, etc., can solve the problems of high leakage current density of components, deterioration of transistor characteristics, and reduced reliability of components, and achieve fast curing speed , good reliability, fast solvent resistance effect

Inactive Publication Date: 2015-10-14
DIC CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, the leakage current density of the device is high, and the transistor characteristics deteriorate over time, so the reliability of the device may be lowered

Method used

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  • REsin Composition For Insulating Materials, Insulating Ink, Insulating Film And Organic Field Effect Transistor Using Insulating Film
  • REsin Composition For Insulating Materials, Insulating Ink, Insulating Film And Organic Field Effect Transistor Using Insulating Film
  • REsin Composition For Insulating Materials, Insulating Ink, Insulating Film And Organic Field Effect Transistor Using Insulating Film

Examples

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Embodiment

[0128] Next, the present invention will be specifically described by way of examples and comparative examples. In the examples, "parts" and "%" are based on mass unless otherwise specified.

[0129] The acid value of the vinyl polymer of the present invention is determined by adding dropwise 20 g of the resin composition for insulating materials obtained in the following synthesis example to 1 L of methanol, reprecipitating, separating by filtration, and drying to obtain a solid. The acid value is calculated. Specifically, by dissolving the weighed solid matter in a solvent of toluene / methanol=70 / 30 by volume ratio, adding a few drops of 1% phenolphthalein alcohol solution in advance, and then adding 0.1mol / L Potassium hydroxide alcohol solution, thereby confirming the method of discoloration point to measure, and obtain with the following calculation formula.

[0130] Acid value of vinyl polymer (mgKOH / g)=(V×F×5.611) / S

[0131] V: the usage amount of 0.1moI / L potassium hyd...

Synthetic example 1

[0155] 110 g of methyl isobutyl ketone (hereinafter referred to as MIBK) was added to a reaction apparatus equipped with a stirring device, a cooling pipe, a dropping funnel, and a nitrogen gas introduction pipe, and while stirring, the temperature was raised until the temperature in the system reached 100° C. Then, 72 g of styrene, 108 g of glycidyl methacrylate (hereinafter referred to as GMA), and 7.2 g of tert-butyl peroxyethylhexanoate (hereinafter referred to as P-O) were added dropwise using a dropping funnel over 4 hours. After forming the mixed solution, keep it at 100°C for 6 hours. Then, after cooling down to 70° C., the nitrogen inlet tube was replaced with an air inlet tube, and after adding 0.2 g of p-methoxyphenol (Metokinon) and 54.8 g of acrylic acid, 1.1 g of triphenylphosphine was added, and further The temperature was raised to 100°C and maintained for 8 hours. After cooling, MIBK was added so that the non-volatile matter became 50%, and the resin composit...

Synthetic example 2

[0162] 95 g of MIBK was added to a reaction device equipped with a stirring device, a cooling pipe, a dropping funnel, and a nitrogen gas introduction pipe, and while stirring, the temperature was raised until the temperature in the system became 100° C., and then, 4 hours were added dropwise by using the dropping funnel. After the liquid mixture consisting of 126 g of styrene, 54 g of GMA, and 3.6 g of P-O was kept at 100° C. for 6 hours. Next, after cooling down to 70°C, the nitrogen inlet tube was replaced with an air inlet tube, and after adding 0.2 g of p-methoxyphenol and 27.4 g of acrylic acid, 1.1 g of triphenylphosphine was added, and thereafter, the temperature was further raised under air bubbling. to 100°C and hold for 8 hours. After cooling, MIBK was added so that the non-volatile matter became 50%, and the resin composition (B) for insulating materials was obtained.

[0163] ・Addition of vinyl polymer: styrene (I) 126g, glycidyl methacrylate (II) 54g, acrylic ac...

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Abstract

In order to improve the performance of an organic field effect transistor, the present invention provides: an insulating material which has both solvent resistance and high curing rate suitable for printing methods, while having high dielectric breakdown strength and low leakage current density; an insulating film having the insulating material; and a transistor. A resin composition for insulating materials, which contains a vinyl polymer. The vinyl polymer has an acid value of 20 mgKOH / g or less and a (meth)acryloyl group equivalent of 220-1,600 g / eq; and the vinyl polymer has a phenyl group and a (meth)acryloyl group.

Description

technical field [0001] The invention relates to a resin composition for insulating materials, an insulating ink, an insulating film and an organic field effect transistor using the insulating film. Background technique [0002] Field effect transistors using inorganic materials such as polysilicon and amorphous silicon use chemical vapor deposition or oxidation in the film formation process of the semiconductor layer, so large-scale equipment such as vacuum equipment is required, and complex and numerous processes are required. In addition, since heating at 300 to 1000° C. is required in the crystallization process of the semiconductor layer, heat resistance is required for the substrate. [0003] On the other hand, a field-effect transistor using an organic material for the semiconductor layer can be formed by coating or printing a solution containing an organic material in the film-forming process of the semiconductor layer, and large-format elements can be produced at low...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F265/04C09D11/101C08F290/12C08F299/00H01B3/44H01L51/05
CPCH01B3/447C08F265/04C08F290/12C08F299/00C09D11/101H01L51/052H01L51/0541H01L51/0545C08F8/14C09D4/00C09D4/06C08F290/124C08F290/126H10K10/471H10K10/464H10K10/466C08F20/32C08F222/106C08F224/00
Inventor 水口良樱井美弥冈本朋子
Owner DIC CORPORATION
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