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Conductive composite material and preparation method thereof, and preparation method for conductive line

A conductive composite material and wiring technology, which is applied to conductive materials, circuits, and printed circuits dispersed in non-conductive inorganic materials, can solve the problems of low yield rate and high process control requirements, and achieve small thermal shock and high applicability Wide, to achieve the effect of light and thin

Active Publication Date: 2015-10-28
SHENZHEN GRADUATE SCHOOL TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The narrowest line width of the traditional screen printing conductive paste wiring technology can usually only reach 50 microns, and the yield rate is low and the process control requirements are high

Method used

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  • Conductive composite material and preparation method thereof, and preparation method for conductive line
  • Conductive composite material and preparation method thereof, and preparation method for conductive line
  • Conductive composite material and preparation method thereof, and preparation method for conductive line

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Micro-nano (diameter between 100 nanometers and 10 microns) metal particles with a three-dimensional fractal hierarchical structure are selected as conductive fillers. The morphology of the metal particles is as follows: figure 1 As shown, it has a three-dimensional dendrite structure. Based on the weight of the conductive composite material to be prepared, 50 wt% silver particle conductive filler is dispersed in the polyester resin matrix to prepare a low-power laser-etched conductive composite material. The conductive silver paste made of conductive composite material was printed on the glass substrate by screen printing, the average thickness of the silver paste line was 15 microns, and the initial width and spacing of the silver paste were set to 50 microns. The printed samples were heat-treated at 150°C for 15 minutes, and laser etching was performed after complete curing. The SEM image of the cross-section of the sample before laser etching figure 2 As shown, t...

Embodiment 2

[0040] Micro-nano (diameter between 100 nanometers and 10 micrometers) metal particles with a three-dimensional fractal hierarchical structure are selected as conductive fillers. Based on the weight of the conductive composite material to be prepared, 50 wt% silver particle conductive filler is dispersed in the polyester resin matrix to prepare a low-power laser-etched conductive composite material. The conductive silver paste made of conductive composite material was printed on the PET substrate by screen printing, the average thickness of the silver paste line was 15 microns, and the initial width and spacing of the silver paste were set to 50 microns. The printed samples were heat-treated at 150°C for 15 minutes, and laser processing was performed after complete curing. During laser etching, the laser wavelength is selected to be 532 nm, and the laser power is selected to be 20% (the maximum laser power is 20 watts). The SEM image of the sample after laser etching is as fo...

Embodiment 3

[0042] Micro-nano (diameter between 100 nanometers and 10 micrometers) metal particles with a three-dimensional fractal hierarchical structure are selected as conductive fillers. Based on the weight of the conductive composite material to be prepared, the conductive filler of silver particle conductive filler with a weight percentage of 40wt% is dispersed in the polyester resin matrix to prepare a low-power laser-etched conductive composite material. The conductive silver paste made of conductive composite material was printed on the PET substrate by screen printing, the average thickness of the silver paste line was 15 microns, and the initial width and spacing of the silver paste were set to 50 microns. The printed samples were heat-treated at 150°C for 15 minutes, and laser processing was performed after complete curing. During laser etching, the laser wavelength is selected to be 532 nm, and the laser power is selected to be 20% (the maximum laser power is 20 watts). The ...

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Abstract

The invention discloses a conductive composite material and a preparation method thereof, and a preparation method for a conductive line. The conductive material comprises a substrate, and metal particles uniformly dispersed in the substrate, the diameter of the metal particles is from 100 nm to 10 <mu>m, the substrate is polymer resin, and the metal particles are metal particles with three-dimensional fractal layered structures. The conductive material is used for laser etching, the micro-nano metal particles with the three-dimensional fractal layered structures are employed as the conductive filling material, the unique geometric shapes of the metal particles are employed so that ablation occurs more easily under the effect of laser compared with conventional filling material particles, and finer wiring effect can be realized under low laser power; the same conductivity is reached by adopting less metal particles than the conventional filling material particles so that the required laser etching energy is less; and the content of the metal particles is less so that the bonding force in conductive slurry and the bonding force between the conductive slurry and a matched insulation substrate can be both greatly increased.

Description

【Technical field】 [0001] The invention relates to a conductive composite material involved in a laser etching wiring process, in particular to a conductive composite material used for laser etching wiring and a preparation method thereof. 【Background technique】 [0002] With the rapid development of mobile electronic equipment and touch screen industry, the laser etching conductive paste market in touch screen processing is also developing rapidly. The narrowest line width of the traditional screen printing conductive paste wiring technology can usually only reach 50 microns, and the yield rate is low and the process control requirements are high. Laser etching and wiring technology is a new type of high-efficiency and fast processing technology. Laser etching technology uses a pulsed laser point light source to etch along a predetermined trajectory to instantly vaporize the conductive silver paste to be processed, so as to remove excess conductive silver paste and form a c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01B13/00H05K3/02
Inventor 杨诚崔晓亚张哲旭
Owner SHENZHEN GRADUATE SCHOOL TSINGHUA UNIV
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