Piezoresistor blank, preparation method thereof, piezoresistor and preparation method thereof

A technology of varistor and green body, which is applied in the field of varistor manufacturing to achieve the effects of high density, high mechanical strength and uniform density

Active Publication Date: 2015-11-25
SHENZHEN SUNLORD ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, there is currently no method for

Method used

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  • Piezoresistor blank, preparation method thereof, piezoresistor and preparation method thereof
  • Piezoresistor blank, preparation method thereof, piezoresistor and preparation method thereof
  • Piezoresistor blank, preparation method thereof, piezoresistor and preparation method thereof

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preparation example Construction

[0032] The invention provides a method for preparing a piezoresistor green body, in one embodiment, comprising the following steps:

[0033] (1) Mix 70%~95% varistor powder and 5%~30% binder into pellets, after cooling to room temperature, crush them into Ф3mm~8mm pellets for molding ; Wherein, the varistor powder includes the following components by weight percentage: 85% to 95% of zinc oxide, 5% to 15% of additives; the additives include the following components by weight percentage: manganese carbonate 5%-8%, Bismuth oxide 35%-50%, tin dioxide 2%-4%, dicobalt oxide 15%-25%, titanium dioxide 5%-10%, barium carbonate 1%-3%, strontium carbonate 0.1%-1%, Boric acid 5%-20%, nickel oxide 2%-10%, aluminum nitrate 0.1%-1%; the binder includes the following components in weight percentage: paraffin wax 30%-88%, polymethyl methacrylate 5 %-30%, ethylene-vinyl acetate copolymer 5%-30%, stearic acid 2%-10%;

[0034] (2) Heat and melt the pellets in the barrel of the injection molding...

Embodiment 1

[0051] Granules for injection molding are composed of the following components by weight percentage:

[0052] Powder 70%

[0053] Binder 30%;

[0054] Described powder is made up of the component of following percentage by weight:

[0055] Zinc Oxide 95%

[0056] Additive 5%;

[0057] Additive is made up of the following components by weight percentage:

[0058]

[0059] The binder is composed of the following components in weight percentage:

[0060]

[0061] The preparation method of injection molding the varistor body and the varistor with the above pellets includes:

[0062] 1) Preparation of binder

[0063] First, heat the paraffin to 120°C. After the paraffin is completely melted, add polymethyl methacrylate and ethylene-vinyl acetate copolymer, and stir continuously with a stirring rod. After they are completely dissolved, add stearic acid to obtain a binder.

[0064] 2) Preparation of powder

[0065] Zinc oxide and additives are uniformly mixed through a ...

Embodiment 2

[0081] Granules for injection molding are composed of the following components by weight percentage:

[0082] Powder 75%

[0083] Binder 25%;

[0084] Described powder is made up of the component of following percentage by weight:

[0085] Zinc Oxide 88%

[0086] Additive 12%;

[0087] Described additive is made up of the component of following percentage by weight:

[0088]

[0089]

[0090] Described binding agent is made up of the component of following percentage by weight:

[0091]

[0092] The preparation method of injection molding the varistor body and the varistor with the above pellets includes:

[0093] 1) Preparation of binder

[0094] First heat the paraffin to 160°C. After the paraffin is completely melted, add polymethyl methacrylate and ethylene-vinyl acetate copolymer, and stir continuously with a stirring rod. After all the paraffin is dissolved, add stearic acid to obtain a binder.

[0095] 2) Preparation of powder

[0096] Mix zinc oxide an...

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Abstract

The invention discloses a piezoresistor blank, a preparation method thereof, a piezoresistor and a preparation method thereof. The preparation method of the piezoresistor blank includes (1), mixing 70-95wt% of piezoresistor powder and 5-30wt% of binder to be pug, cooling the pug to room temperature, and then breaking the pug into granules for injection molding, wherein the piezoresistor powder comprises, by weight, 85-95% of zinc oxide and 5-15% of additive which comprises, by weight, 5-8% of manganese carbonate, 35-50% of bismuth oxide, 2-4% of tin dioxide, 15-25% of cobalt oxide, 5-10% of titanium dioxide, 1-3% of barium carbonate, 0.1-1% of strontium carbonate, 5-20% of boric acid, 2-10% of nickel sesquioxide and 0.1-1% of aluminum nitrate, and the binder comprises, by weight, 30-88% of paraffin, 5-30% of polymethyl methacrylate, 5-30% of ethylene-vinyl acetate copolymer and 2-10% of stearic acid; (2), subjecting the granules to injection molding to obtain the piezoresistor blank. The piezoresistor is high in uniformity and production efficiency and large and uniform in density.

Description

technical field [0001] The invention relates to the manufacture of varistors, in particular to a varistor green body and a preparation method thereof, a varistor and a preparation method thereof. Background technique [0002] The production technology of traditional varistors is mainly the dry pressing method. There are many advantages: such as high production efficiency, less labor, low scrap rate, short production cycle, high density and high strength of the produced products, suitable for mass industrial production. The disadvantage is that the shape of the molded product is relatively limited, the product is prone to missing edges and corners when demoulding, the green body has low strength, the inner compactness of the green body is inconsistent, and the uniformity of the structure is relatively poor. And because dry pressing generally can only produce varistors with simple structures, for complex varistors, dry pressing generally cannot be completed at one time, and n...

Claims

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Application Information

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IPC IPC(8): C04B35/453C04B35/622
Inventor 朱晏军聂敏
Owner SHENZHEN SUNLORD ELECTRONICS
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