Conductor line and manufacture method thereof

A manufacturing method and conductor circuit technology, which are applied in printed circuit manufacturing, printed circuit, conductive pattern formation and other directions, can solve the problems of poor process environmental protection, affect the overall performance, low yield rate, etc., achieve good environmental protection, simple manufacturing process, The effect of high yield

Active Publication Date: 2015-11-25
GOERTEK INC
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

To solve the problems in the prior art that the carrier containing metal catalyst affects the

Method used

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  • Conductor line and manufacture method thereof
  • Conductor line and manufacture method thereof
  • Conductor line and manufacture method thereof

Examples

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Example Embodiment

[0048] Example one

[0049] According to another aspect of the present invention, a method for manufacturing a conductor line is provided. The carrier can be selected as required. Usually it is a non-metal carrier, such as plastic, plastic, glass or ceramic. In this embodiment, the carrier adopts a plastic carrier 1, which is composed of PC (polycarbonate), ABS (acrylonitrile-butadiene-styrene copolymer), PBT (polybutylene terephthalate), One or more materials of PES (polyethersulfone resin), PSU (polysulfone plastic) or GF (glass fiber) are molded by mixing injection, extrusion or blow molding. In this embodiment, electroless plating is used for the plating treatment. The plating treatment can also be electroplating. Reference Figure 1-Figure 5 , Including the following steps:

[0050] S1. Prepare a plastic carrier 1, and perform the first modification treatment on the plastic carrier 1 according to the set pattern to form an uneven rough surface area. In this embodiment, a...

Example Embodiment

[0074] Example two

[0075] This embodiment provides a conductor line, which is manufactured according to the manufacturing method of the conductor line disclosed in the present invention. Including: carrier and conductor circuit body. The conductor circuit body is a combination of multiple metals or one metal. Commonly used conductive metals are materials such as copper, nickel, gold, silver or tin, and may also be other conductive alloy materials or superconducting materials. Various metal materials can be deposited in layers to form a multilayer body of conductive material. The conductor circuit body is embedded on the carrier. Commonly used carrier materials include plastics, plastics, glass and ceramics. The carrier undergoes modification treatment to form an uneven rough surface area; after the second modification treatment, a sensitized area is formed; after activation treatment, an activated area containing catalytic crystal nuclei is formed, without the need to add a ...

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Abstract

The invention relates a conductor line and a manufacture method thereof, and belongs to the field of electrical technology. The method comprises that S1) first modification is carried out on a carrier according to the set pattern to form rough surface areas; S2) second modification is carried out on the rough surface areas to form sensitive areas; S3) activation is carried out on the sensitive areas to form activated areas with catalytic nucleus; and S4) the activated areas are plated to from the conductor line. The conductor line comprises a conductor line body which is made of a metal combination or a metal and the carrier, wherein the conductor line body is embedded into he carrier. The manufacture method of the conductor line is simple in technology, easy to operate, sources of needed raw materials are wide, the manufacture process is environment protective, the yield is high, and thus, the method is easy to popularize. The conductor line has the advantages of simple design, wide application and high wearing property.

Description

technical field [0001] The present invention relates to the field of electrical technology, and more specifically, to a method for manufacturing a conductor circuit and the conductor circuit. Background technique [0002] At present, methods for directly manufacturing conductor circuits on plastic surfaces include: [0003] (1) Laser direct structuring technology, that is, adding a special catalyst additive in the plastic, exposing it to the surface of the plastic through laser irradiation, forming a metal trigger source, and then performing electroless plating based on the trigger source to obtain a conductor circuit. The disadvantages are: special catalyst additives need to be added to the plastic base material, which increases the material cost, and the material contains metal, which will have an adverse effect on the performance of the whole machine in some electromagnetic environments. [0004] (2) The method of electroplating on the surface of electroplating grade ABS...

Claims

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Application Information

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IPC IPC(8): H05K3/10
CPCH05K3/105H05K2203/0789H05K2203/0793
Inventor 赵义林徐帅刘传伟
Owner GOERTEK INC
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