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Conductor line and manufacture method thereof

A manufacturing method and conductor circuit technology, which are applied in printed circuit manufacturing, printed circuit, conductive pattern formation and other directions, can solve the problems of poor process environmental protection, affect the overall performance, low yield rate, etc., achieve good environmental protection, simple manufacturing process, The effect of high yield

Active Publication Date: 2015-11-25
GOERTEK INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

To solve the problems in the prior art that the carrier containing metal catalyst affects the overall performance, the process is poor in environmental protection and the yield rate is low.

Method used

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  • Conductor line and manufacture method thereof
  • Conductor line and manufacture method thereof
  • Conductor line and manufacture method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0049] According to another aspect of the present invention, a method of manufacturing a conductor line is provided. Carriers can be selected as needed. It is usually a non-metallic carrier, such as plastic, plastic, glass or ceramics. In the present embodiment, the carrier adopts a plastic carrier 1, and the plastic carrier 1 is made of PC (polycarbonate), ABS (acrylonitrile-butadiene-styrene copolymer), PBT (polybutylene terephthalate), One or more materials in PES (polyethersulfone resin), PSU (polysulfone plastic) or GF (glass fiber), mixed with injection molding, extrusion or blow molding. In this embodiment, electroless plating is used for the plating treatment. Electroplating and other methods can also be used for plating treatment. refer to Figure 1-Figure 5 , including the following steps:

[0050] S1. Prepare a plastic carrier 1, and perform a first modification treatment on the plastic carrier 1 according to a set pattern, so as to form an uneven rough surface...

Embodiment 2

[0075] This embodiment provides a conductor circuit, which is manufactured according to the manufacturing method of the conductor circuit disclosed in the present invention. Including: carrier and conductor line body. The body of the conductor line is a combination of multiple metals or a metal. Commonly used conductive metals are copper, nickel, gold, silver or tin, or other conductive alloy materials or superconducting materials. Multiple metal materials can be deposited in layers to form a multilayer conductive material body. The conductor line body is embedded on the carrier. Commonly used carrier materials include plastics, plastics, glass, and ceramics. The carrier is modified to form an uneven rough surface area; the second modification is used to form a sensitized area; after activation, an activated area containing catalytic crystal nuclei is formed without adding a special catalyst to the carrier; the conductor circuit body It can be deposited on the carrier by el...

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Abstract

The invention relates a conductor line and a manufacture method thereof, and belongs to the field of electrical technology. The method comprises that S1) first modification is carried out on a carrier according to the set pattern to form rough surface areas; S2) second modification is carried out on the rough surface areas to form sensitive areas; S3) activation is carried out on the sensitive areas to form activated areas with catalytic nucleus; and S4) the activated areas are plated to from the conductor line. The conductor line comprises a conductor line body which is made of a metal combination or a metal and the carrier, wherein the conductor line body is embedded into he carrier. The manufacture method of the conductor line is simple in technology, easy to operate, sources of needed raw materials are wide, the manufacture process is environment protective, the yield is high, and thus, the method is easy to popularize. The conductor line has the advantages of simple design, wide application and high wearing property.

Description

technical field [0001] The present invention relates to the field of electrical technology, and more specifically, to a method for manufacturing a conductor circuit and the conductor circuit. Background technique [0002] At present, methods for directly manufacturing conductor circuits on plastic surfaces include: [0003] (1) Laser direct structuring technology, that is, adding a special catalyst additive in the plastic, exposing it to the surface of the plastic through laser irradiation, forming a metal trigger source, and then performing electroless plating based on the trigger source to obtain a conductor circuit. The disadvantages are: special catalyst additives need to be added to the plastic base material, which increases the material cost, and the material contains metal, which will have an adverse effect on the performance of the whole machine in some electromagnetic environments. [0004] (2) The method of electroplating on the surface of electroplating grade ABS...

Claims

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Application Information

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IPC IPC(8): H05K3/10
CPCH05K3/105H05K2203/0789H05K2203/0793
Inventor 赵义林徐帅刘传伟
Owner GOERTEK INC
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