Composition, organic semiconductor field effect transistor containing same, and preparation method thereof
A field-effect transistor and organic semiconductor technology, applied in the field of polymer field-effect device performance, can solve the problems of improving, the mobility is not very helpful, and the conductivity of the semiconductor is increased.
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[0060] Preparation of bottom-gate and bottom-contact structure devices: highly doped silicon is used as the gate, and a layer of 300nm thick silicon dioxide is prepared on it by high temperature method as the dielectric layer, with a capacitance of 9nFcm -2 .
[0061] Modification of a monomolecular modification layer (octadecyltrichlorosilane, OTS) on silicon dioxide: the silicon wafer was sonicated three times in acetone and deionized water, 5 minutes each time. Then immerse in the mixed solution of sulfuric acid and hydrogen peroxide (2 / 1, v / v), boil in a water bath at 100°C for 20 minutes. Rinse 3 times with deionized water, sonicate 3 times, 5 minutes each time, then ultrasonically clean 1 time with isopropanol, 5 minutes, and blow dry with a nitrogen gun. Place the blow-dried silicon wafer in a vacuum drying oven at 80°C for 30 minutes in vacuum, drop 2 μl of octadecyltrichlorosilane in the middle of the watch glass, keep it in the vacuum drying oven at 125°C for 240 mi...
Embodiment 1
[0080] The semiconductor active material polymer PDPPTT used in this embodiment is shown in formula III.
[0081] The additive tetramethylammonium iodide adopted is as shown in formula VI:
[0082]
[0083] 1. The synthesis of polymer PDPPTT refers to the reported literature (Z.Y.Chen, M.J.Lee, R.S.Ashraf, Y.Gu, S.Albert-Seifried, M.M.Nielsen, B.Schroeder, T.D.Anthopoulos, M.Heeney, I.McCulloch, H. Sirringhaus. High-performance ambipolardiketopyrrolopyrrole-Thieno[3,2-b]thiophenecopolymer field-effect transistors with balanced hole and electronmobilities. Adv. Mater., 2012, 24, 647-652.). The synthesized PDPPTT has a weight average molecular weight of 225KDa and a dispersion coefficient of 2.72.
[0084] 2. Fabrication of Mixed Additive Polymer Thin Film Devices
[0085] A transistor structure with bottom gate and bottom contact is adopted. Highly doped silicon is used as the gate, and a layer of 300nm thick silicon dioxide is prepared on it by high temperature method as...
Embodiment 2
[0091] The semiconductor active material polymer PDPP4T used in this embodiment is shown in formula V.
[0092] The additive that adopts is shown in formula VII:
[0093]
[0094] 1. The synthesis of polymer PDPP4T refers to the reported literature (J.Am.Chem.Soc, 2011, 133, 10364). The synthesized PDPP4T has a weight average molecular weight of 271KDa and a dispersion coefficient of 2.5.
[0095] 2. Fabrication of Mixed Additive Polymer Thin Film Devices
[0096] A transistor structure with bottom gate and bottom contact is adopted. Highly doped silicon is used as the gate, and a layer of 300nm thick silicon dioxide is prepared on it by high temperature method as the dielectric layer, and the capacitance is 9nFcm -2 .
[0097] Modification of a monomolecular modification layer (octadecyltrichlorosilane, OTS) on silicon dioxide: the silicon wafer was sonicated three times in acetone and deionized water, 5 minutes each time. Then immerse in the mixed solution of sulfuri...
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