Copper matrix surface laser cladding technology

A laser cladding and matrix technology, applied in the direction of metal material coating process, coating, etc., can solve the problems of high dilution rate between cladding layer and matrix, which cannot well meet industrial production, and high thermal deformation rate of matrix.

Active Publication Date: 2015-12-16
河北瑞驰伟业科技有限公司
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Problems solved by technology

[0005] like figure 1 As shown, the cladding layer obtained by carbon dioxide laser cladding technology has a high dilution rate with the substrate, and the heat-affected zone is large, resulting in a decrease in the physical properties of the cladding layer, a high heat deformation rate of the substrate, and micro-trachoma and pores.
[0006] like figure 2 As shown, although the cladding layer and subs

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  • Copper matrix surface laser cladding technology
  • Copper matrix surface laser cladding technology
  • Copper matrix surface laser cladding technology

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Embodiment Construction

[0031] (1) Laser cladding process on copper substrate surface

[0032] The laser cladding process of the copper substrate surface of the present invention includes the following steps:

[0033] A. Polishing: Use sandpaper or polishing equipment to polish the surface of the copper substrate to make the surface of the copper substrate smooth and shiny;

[0034] B. Decontamination; Use acetone, a decontamination agent, to clean the surface of the copper substrate to remove oil stains and other pollutants on the surface of the copper substrate;

[0035] C. Laser cladding: Use a laser coaxial powder feeder to send the cladding alloy material with a particle size of -150 to 300 meshes to the surface of the copper substrate, and at the same time use a pulsed Nd:YAG laser to perform layer-by-layer laser cladding to form a cladding The thickness of the layer is between 0.1 and 2.5 mm; wherein, in terms of mass percentage, the composition of the wear-resistant and high-temperature alloy materia...

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Abstract

The invention relates to a metal surface treatment technology, in particular to a copper matrix surface laser cladding technology. The purpose is to provide a cladding technology, and a specific cladding material and specific laser parameters are adopted, so that the cladding layer formed on the copper matrix surface is compact in tissue and free from cracks and pores and forms good metallurgical bonding with the copper matrix surface. The copper matrix surface laser cladding technology includes the steps of polishing, decontaminating, laser cladding and cooling. The anti-abrasion and anti-high-temperature alloy material adopted in the laser cladding step is prepared from 20-29% of Ni, 18-28% of Fe, 6-10% of C, 10-23% of Co, 2.5-4.5% of B and 3.0-5.0% of Si. According to the technological parameters of a pulse Nd:YAG laser device, the focal length of a focus lens is 200-250 mm, the cladding power P is 800-1000 W, the diameter of a light spot is 2.5-4.0 mm, and the cladding scanning speed V is 20-45 mm/s; the overlap rate is 50%.

Description

Technical field [0001] The invention relates to a metal treatment material and treatment process. Background technique [0002] Laser cladding technology is one of the main methods to modify the surface of materials. It uses high-energy density laser beams to quickly melt alloys with different compositions and properties on the surface of the substrate. The formation on the surface of the substrate has a completely different composition and composition from the substrate. The rapid solidification process of the high-performance alloy layer. [0003] The copper alloy laser cladding technology has the following difficulties: ①The copper alloy has good thermal conductivity, small specific heat capacity, poor wettability, hard oxide film on the surface, and high reflectivity to the light spot, which makes the heat generated by the laser in its The surface is not easy to stay, high power density is not easy to form, and the molten pool cannot be formed; ②The performance of the copper a...

Claims

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Application Information

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IPC IPC(8): C23C24/10
CPCC23C24/103
Inventor 王菊花李建平
Owner 河北瑞驰伟业科技有限公司
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