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Ultra-smooth metal film surface preparation method

A metal thin film, ultra-smooth technology, applied in metal material coating process, ion implantation plating, coating and other directions, can solve the problems of limited application, non-conductivity of mica sheets, etc., and achieve the effect of reliable process

Active Publication Date: 2015-12-23
山东韩师傅新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There have been a large number of studies using mica sheets as substrates, but mica sheets are not conductive, which limits their application

Method used

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Examples

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preparation example Construction

[0030] The preparation method of a kind of ultra-smooth metal thin film surface of the present invention comprises the following steps:

[0031] Step 1, preparation of mica soft substrate

[0032] The preparation process of the mica soft substrate is as follows: in the ultra-clean workbench, the mica sheet with a thickness of about 1 mm is cut into a suitable size substrate with a cutting knife. From the middle line of the thickness, the mica sheet is divided into two substrates A and B with a thickness of about 0.5 mm, wherein the substrate A is used to prepare a mica soft substrate with a thickness of about 2 μm, and the substrate B is used as a mica hard substrate. Place the prepared mica soft substrate. The mica soft substrate is prepared by peeling off layers. The following three steps can be used for specific implementation: 1) Place a disposable medical needle with a diameter of 2 mm in the direction parallel to the thickness of the mica substrate A; 2) Press the medic...

Embodiment 1

[0040] A method for preparing an ultra-smooth metal thin film surface of the present invention comprises the following steps:

[0041] 1. Preparation of mica soft substrate

[0042]Mica is a layered alumina silicate crystal, and the layers are maintained by electrostatic force. The mica can be separated layer by layer by mechanical stripping. When the thickness of the mica sheet is 2 μm (the soft substrate is green), it can not only guarantee the strength requirement, but also have good flexibility. After peeling off the mica soft substrate, adjust the voltage of the DC power supply instrument to 18-20V, the current to 50-200mA, and heat the platinum wire with a diameter of 0.5mm to melt and cut the mica soft substrate. Its advantage is to reduce the deformation produced by the traditional mechanical force cutting method or the pollution of the mica soft substrate by debris in the cutting process. The size of the cut mica soft substrate is 15×15mm. Under the action of elect...

Embodiment 2

[0050] A method for preparing an ultra-smooth metal thin film surface of the present invention comprises the following steps:

[0051] 1. Preparation of mica soft substrate

[0052] The method for preparing the mica soft substrate is as in step 1 in Example 1, and the size of the mica soft substrate is 20×20 mm.

[0053] 2. Deposition of metal thin film on mica soft substrate

[0054] Control the heating current to 2.3-2.7A, make the evaporation temperature at 1080°C-1100°C, and the vacuum degree is 5×10 -3 Au thin films were deposited on mica soft substrates by vapor deposition under Pa. The deposition rate is The deposited film thickness was 50 nm.

[0055] 3. "Sandwich" interlayer preparation

[0056] When preparing the Au metal thin film, the adhesive used in the "sandwich" interlayer is Epoxy377 (EPo, Tek). Epoxy377 consists of two components. Before use, take equal amounts of the components and mix them evenly, then drop 5 μL of adhesive on the curved surface of t...

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Abstract

The invention discloses an ultra-smooth metal film surface preparation method. The method comprises the steps that firstly, a soft mica substrate is prepared; secondly, a layer of metal film is formed on the surface of the soft mica substrate in a vacuum evaporation mode; thirdly, the metal film is made to be evenly attached to the substrate through initial adhesion between adhesives and the metal film, and a sandwiched structure of the soft mica substrate, the metal film layer and the substrate is formed after solidification; and fourthly, the sandwiched structure obtained in the third step is soaked in a solvent, the substrate is clamped through tweezers and slightly rocked in the solvent or the soft mica substrate is dragged gently, the soft mica substrate on the outermost layer is removed through surface tension of the solvent, and an ultra-smooth metal film surface is obtained. By means of the method, a large-area flexible metal film can be acquired, the stripping process of the soft mica substrate is optimized through attachment of the adhesives, ultra-smooth metal films can be prepared on various kinds of substrates, the roughness of the ultra-smooth metal film surface can reach the atomic level, and the method is applicable to the surface treatment process during mass production.

Description

【Technical field】 [0001] The invention relates to the technical field of surface treatment, in particular to a preparation method for an ultra-smooth metal thin film surface. 【Background technique】 [0002] Ultra-smooth surface preparation technology has become increasingly prominent with the rapid development of precision, ultra-precision, optoelectronics and nano-processing technology. At the same time, high-tech developments such as new electric light sources, computer chips, and substrates for growing nano-films all place extremely high requirements on the surface quality of materials. [0003] At present, there are many technologies for preparing smooth surfaces by using mechanical, chemical and magnetic fluid polishing methods. The mechanical polishing method is prone to scratches and internal stress due to the direct contact between the abrasive and the substrate, and the processing deterioration layer and subsurface damage due to the action of mechanical force. The...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/18C23C14/24C23C14/58
Inventor 董光能秦立果吴红星
Owner 山东韩师傅新材料有限公司
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