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A gravure hard copper additive and plating solution

An additive and hard copper technology, applied in the field of gravure hard copper additives and plating solutions, can solve the problem of long effective storage time, and achieve scientific and reasonable components and dosage, high hardness and good brightness.

Active Publication Date: 2019-01-29
JIANGSU MENGDE NEW MATERIALS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of the above situation, in order to overcome the defects of the prior art, the object of the present invention is to provide a gravure hard copper additive, which can effectively solve the problems of high hardness, good brightness, flexible performance and long effective storage time.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] Add the plated parts to the gravure hard copper plating solution, the composition of the plating solution is: copper sulfate 240g / L; sulfuric acid 60g / L; chloride ion 150mg / L; hardness agent: 1ml / L, brightener: 3ml / L, of which Benzothiazole sodium polydithiopropane sulfonate: 0.7%, ethylene thiourea: 0.4%, the balance is deionized water, brightener: 3-mercaptopropane sodium sulfonate: 15%, polyethyleneimine alkane Base salt: 1%, acid copper strong displacer: 0.3%, polyethylene glycol 6000-10000: 1.5%, the balance is deionized water, bath temperature 38°C, cathode current density 15A / dm 2 , the area ratio of cathode and anode is 1:4, and the moving speed of cathode and anode is 1m / s.

Embodiment 2

[0016] Add the plated parts into the gravure hard copper plating solution, the composition of the plating solution is: copper sulfate 200g / L; sulfuric acid 50g / L; chloride ion 100mg / L; hardness agent: 1ml / L, brightener: 2ml / L, of which Sodium thiamidazole dithiopropane sulfonate: 0.5%, thiazole thione: 0.6%, the balance is deionized water, brightener: polysodium dithiodipropane sulfonate: 2%, polyethylene Amine alkyl salt: 1.5%, acid copper strong displacement agent: 1%, polyethylene glycol 6000-10000: 2%, the balance is deionized water, bath temperature 38 ℃, cathode current density 15A / dm 2 , the area ratio of cathode and anode is 1:4, and the moving speed of cathode and anode is 1m / s.

Embodiment 3

[0018] Add the plated parts into the gravure hard copper plating solution, the composition of the plating solution is: copper sulfate 240g / L; sulfuric acid 60g / L; chloride ion 150mg / L; hardness agent: 3ml / L, brightener: 3ml / L, of which Benzothiazole sodium polydithiopropane sulfonate: 0.7%, ethylene thiourea: 0.4%, the balance is deionized water, brightener: phenyl polydithiodipropane sodium sulfonate: 15%, polyethylene Imine alkyl salt: 1%, acid copper strong displacer: 0.3%, polyethylene glycol 6000-10000: 1.5%, the balance is deionized water, bath temperature is 38°C, cathode current density is 15A / dm 2 , the area ratio of cathode and anode is 1:4, and the moving speed of cathode and anode is 1m / s.

[0019] Table 1 embodiment coating effect comparison table

[0020] Example

[0021] The hardener has both a hardening effect and a brightening effect. In the process of electroplating, it can effectively improve the cathode polarization, so that the generation rate ...

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PUM

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Abstract

The invention relates to a plating solution additive and a plating solution, in particular to an intaglio hard copper additive and a plating solution. The intaglio hard copper additive comprises a hardening agent and a brightening agent, wherein the hardening agent comprises 0.3%-0.7% of thiazole disulphide, 0.4%-0.8% of ethylene thiourea and the balance of deionized water; the brightening agent comprises 1.0-2.0% of sodium polydithionate, 1.0%-1.5% of PN, 0.3%-1.0% of an acid copper strong covering agent, 1.5%-2.0% of a polyether compound and the balance of deionized water. When the additive is added to the plating solution for rapid hard copper electroplating, an electroplating body can have high hardness, good finish and good smoothness.

Description

technical field [0001] The invention relates to the field of electroplating, in particular to a gravure hard copper additive and a plating solution. Background technique [0002] Electronic engraving printing gravure has extremely high requirements on the copper layer during engraving, the hardness is controlled at 190-230HV, and the copper ions must be evenly arranged. Currently, the additives used are mainly imported products, and the quality and performance of domestic gravure hard copper additives are poor. Therefore how to develop a kind of gravure hard copper additive that makes copper layer hardness big, brightener is good, performance is flexible, and effective storage time is long is the technical problem that needs serious solution. Contents of the invention [0003] In view of the above situation, in order to overcome the defects of the prior art, the object of the present invention is to provide a gravure hard copper additive, which can effectively solve the pr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/38
Inventor 杭冬良
Owner JIANGSU MENGDE NEW MATERIALS TECH CO LTD
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