A circuit board foil surface treatment device relates to the technical field of circuit board foil production, and comprises a coarsening tank body and a foil surface, the inner side of the coarsening tank body is rotatably provided with a liquid
extrusion roller and a conductive roller, the foil surface is extruded by the liquid
extrusion roller and the conductive roller to
discharge liquid,
anode plates are fixed on the front side and the rear side, corresponding to the foil surface, in the coarsening tank body, and the front side and the rear side of the foil surface are respectively provided with an
anode plate. According to the circuit board foil surface treatment device, when
copper foil runs, the
current density is improved, the
cathode polarization can be improved, the
electroplating efficiency can be improved, plating layer
crystallization of the
copper foil is more compact, and the
copper foil surface treatment device has the advantages that the
copper foil surface
treatment effect is better, and the service life of the
copper foil surface treatment device is prolonged. And the plating layer
crystal is finer, that is, the appearance of the
copper foil is reduced, and the electroplated
crystal is more compact and uniform in growth vigor, so that
short circuit and open circuit cannot occur when downstream customers use the copper foil, the
current density can be improved to a certain extent, and the increase of the
electric power cost is reduced.