Palladium removing and copper extracting method for copper-based palladium plating electronic scraps

An electronic scrap and copper-based technology, which is applied in the direction of improving process efficiency, can solve the problems of corroding metal conductor circuits and containing cyanide, and achieves the effects of small copper-based damage, high selectivity, and low production costs

Inactive Publication Date: 2016-01-06
云龙县铂翠贵金属科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] Japanese Patent Laid-open No. 63-72198 proposes to remove the palladium coating with fluoboric acid-sodium chloride mixed solution, and JP 7-207466 pr...

Method used

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  • Palladium removing and copper extracting method for copper-based palladium plating electronic scraps

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Example 1 Refer to the accompanying drawings, a kind of electronic waste, with copper as the matrix, containing 0.73% palladium and 98% copper, take 100g of it, add 1 ~ 2mol / LH according to the solid-liquid ratio (S / L) 1:2 2 SO 4 , 20~50%NaNO 3 , Sodium sulfanilate 1~2g / L, heated to 60°C for 1h, the plated piece changed from silvery white to yellow, the solution was blue, the palladium coating was completely removed, leaving a copper base weight of 93g, copper The recovery rate is 95%. The amount of palladium metal in the deplating solution is too small and has not been dealt with separately.

Embodiment 2

[0035] Example 2 Referring to the accompanying drawings, a kind of electronic scrap, with copper as the matrix, containing 0.87% palladium and 98% copper, takes 100g of it, and adds 3 to 6mol / L HCl, 10~50%H 2 o 2 1. Sodium aminobenzenesulfonate 1 ~ 2g / L, heated to 80 ℃ for 2 hours, the plated parts changed from silvery white to yellow, the solution was blue, and most of the palladium coating was removed, but a small part was not removed. , leaving a copper base weight of 94g, and a copper recovery rate of 96%. The amount of palladium metal in the deplating solution is too small and has not been dealt with separately.

Embodiment 3

[0037] Example 3 Referring to the accompanying drawings, a kind of electronic scrap, with copper as the matrix, containing 0.87% palladium and 98% copper, takes 100g of it, and adds 3-6mol / L HCl, 10~20%NaClO 3 , FeCl 3 1~2g / L, heated to 80℃ for 2 hours, the plated parts changed from silvery white to yellow, the solution was blue, a small amount of hydrolyzate was produced in the solution, most of the palladium coating was removed, but a small part remained Retire, leave copper basis weight 93g, copper recovery rate 95%. The amount of palladium metal in the deplating solution is too small and has not been dealt with separately.

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Abstract

The invention discloses a palladium removing and copper extracting method for copper-based palladium plating electronic scraps. The method comprises the steps that the copper-based palladium plating electronic scraps and a dedplating solution composed of a compounding agent, an oxidizing agent, a rate-accelerating additive and the like are mixed according to the proportion of 1:3-1:10, and react for 1-6 h at the temperature of 10-100 DEG C, a palladium plating layer is removed, and most of a copper base is kept; iron powder, zinc powder, cooper plates and the like which enter the deplating solution and are used for palladium are replaced, so that palladium is enriched again; palladium enriched objects are dissolved for liquid preparing, and palladium is separated through an extraction method; palladium strip liquor is refined to obtain palladium powder, the recover rate of palladium is 99%, and the purity of palladium is 99.95%-99.9%; little iron powder, zinc powder and the like which enter the deplating solution and are used for copper are deeply replaced to obtain active copper powder, and the active copper powder can replace iron powder, zinc powder and the like to be used as a replacement agent used for selectively replacing palladium in the deplating solution; and the copper base is subjected to smelting and ingot casting, raw copper is obtained and sold, the recover rate of copper is 95%, and the purity of copper is 98%. The method has the beneficial effects that the palladium deplating efficiency is high, damage to the copper base is small, palladium and copper are high in recovery rate, the method is simple and feasible, the amount of adopted reagent is low, production cost is low, and energy saving and environment friendliness are achieved.

Description

technical field [0001] The invention belongs to the field of comprehensive utilization of electronic waste, and relates to a method for deplating palladium and extracting copper from copper-based palladium-plated electronic waste. Background technique [0002] Palladium exhibits extremely stable performance in environments such as high temperature, high pressure, and hydrogen sulfide. Palladium itself has low hardness, but the palladium coating obtained through a proper palladium plating process has very high hardness and excellent corrosion resistance. Wear resistance, electrical conductivity, chemical inertness, solderability, contact resistance stability, palladium-plated electronic components have been widely used in aerospace, communications, military, civilian and other fields. In the electronics industry, it is mainly used in electronic and electrical components such as electrical contacts, connectors, IC lead frames, semiconductors and printed boards; in the decorati...

Claims

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Application Information

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IPC IPC(8): C22B7/00C22B15/00C23F1/44
CPCY02P10/20
Inventor 蹇祝明余建民
Owner 云龙县铂翠贵金属科技有限公司
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