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Electroplating liquid for plating gallium and pulse electroplating method for gallium film

A technology of pulse electroplating and electroplating solution, which is applied in the field of electroplating, can solve the problems of high temperature operation, high cost consumption, high energy consumption, etc., and achieve the effects of wide operating temperature, good conductivity, and waste reduction

Inactive Publication Date: 2016-01-13
WUXI JIABANG ELECTRIC POWER PIPE FACTORY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional smelting, refining and alloy preparation methods can no longer fully meet the needs of today's production of scattered metals and their alloys, and traditional methods also have shortcomings of varying degrees, such as high temperature operation, high energy consumption, serious environmental pollution, etc., so it is necessary to seek A new method, the emergence of an environmentally friendly electroplating solution for gallium plating provides a new possibility
In the electroplating industry, the electroplating solution is discarded as electroplating waste, so additional environmental pollution and disposal costs are generated
When electroplating with a new plating solution, the purchase of the plating solution consumes a lot of costs

Method used

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  • Electroplating liquid for plating gallium and pulse electroplating method for gallium film
  • Electroplating liquid for plating gallium and pulse electroplating method for gallium film
  • Electroplating liquid for plating gallium and pulse electroplating method for gallium film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] The gallium plating electroplating solution of the present embodiment is made up of the component of following concentration:

[0021]

[0022] The pulse electroplating method for preparing a gallium thin film using the gallium plating electroplating solution of this embodiment comprises the following steps:

[0023] a. Prepare the electroplating solution according to the proportion;

[0024] b. Pulse electroplating, the electroplating solution is injected into the electroplating equipment, and the copper sheet is used as the cathode and the pure gold plate is used as the anode for electroplating. The film deposited on the surface of the cathode copper sheet is a gallium film. The electroplating process conditions are, and the current density is 0.6A / dm 2 , The frequency is 500Hz, the duty ratio is 1:7, the temperature of the plating solution is 25°C, and the pH value is 7.5-11.5.

[0025] Wherein, the distance between the cathode and the anode is 5 cm, the power s...

Embodiment 2

[0027] The gallium plating electroplating solution of the present embodiment is made up of the component of following concentration:

[0028]

[0029] The pulse electroplating method for preparing a gallium thin film using the gallium plating electroplating solution of this embodiment comprises the following steps:

[0030] a. Prepare the electroplating solution according to the proportion;

[0031] b. Pulse electroplating, the electroplating solution is injected into the electroplating equipment, and the copper sheet is used as the cathode and the pure gold plate is used as the anode for electroplating. The film deposited on the surface of the cathode copper sheet is a gallium film. The electroplating process conditions are, and the current density is 0.7A / dm 2 , The frequency is 600Hz, the duty ratio is 1:9, the temperature of the plating solution is 35°C, and the pH value is 7.5-11.5.

[0032] Wherein, the distance between the cathode and the anode is 6.5 cm, the power...

Embodiment 3

[0034]

[0035] The pulse electroplating method for preparing a gallium thin film using the gallium plating electroplating solution of this embodiment comprises the following steps:

[0036] a. Prepare the electroplating solution according to the proportion;

[0037] b. Pulse electroplating, the electroplating solution is injected into the electroplating equipment, and the copper sheet is used as the cathode and the pure gold plate is used as the anode for electroplating. The film deposited on the surface of the cathode copper sheet is a gallium film. The electroplating process conditions are, and the current density is 0.8A / dm 2 , The frequency is 700Hz, the duty ratio is 1:11, the temperature of the plating solution is 50°C, and the pH value is 7.5-11.5.

[0038] Wherein, the distance between the cathode and the anode is 8cm, the power supply for electroplating is a single-pulse electroplating power supply, and the mass percentage of gold in the anode is ≥99.99%.

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Abstract

The invention discloses electroplating liquid for plating gallium and a pulse electroplating method for a gallium film. The electroplating liquid for plating gallium is composed of, by concentration, 500-700 g.kg<-1> of chloride N-propylpyridine, 60-90 g.kg<-1> of anhydrous gallium chloride, 0.5-2.5 g.kg<-1> of N-methyl pyrolidone, 2.5-4.5 g.kg<-1> of ethanediol, 2.5-4 g.kg<-1> of gelatin, 2.5-4.5 g.kg<-1> of sodium chloride, and the balance propyl alcohol. The electroplating liquid for plating gallium has certain unique performance such as a low melting point, good electrical conductivity, ignorable steam pressure, wide usage temperature range and special solubleness.

Description

technical field [0001] The invention relates to the field of electroplating, in particular to an electroplating solution for gallium plating, and also relates to a pulse electroplating method for preparing a gallium thin film by using the electroplating solution. Background technique [0002] Scattered metals refer to a series of rare metal elements, including gallium (Ga), indium (In), thallium (Tl), germanium (Ge), selenium (Se), tellurium (Te) and rhenium (Re). Scattered metals are my country's superior resources. From the perspective of the use of gallium, its elemental metal and alloy have many special properties. Indispensable emerging materials in cutting-edge technology fields such as energy and energy. Traditional smelting, refining and alloy preparation methods can no longer fully meet the needs of today's production of scattered metals and their alloys, and traditional methods also have shortcomings of varying degrees, such as high temperature operation, high ene...

Claims

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Application Information

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IPC IPC(8): C25D3/54C25D5/18
Inventor 徐德生
Owner WUXI JIABANG ELECTRIC POWER PIPE FACTORY
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