Room-temperature curing epoxy adhesive and preparation method thereof
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An epoxy adhesive, room temperature curing technology, applied in the direction of epoxy resin glue, adhesives, adhesive additives, etc., can solve the problems of inability to cure quickly, poor mechanical properties of epoxy adhesives, etc.
Inactive Publication Date: 2016-01-20
CHANGCHUN INST OF APPLIED CHEMISTRY - CHINESE ACAD OF SCI
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[0004] The purpose of the present invention is to provide a room temperature curing epoxy adhesive and a preparation method thereof in or
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[0028] The present invention also provides a preparation method of room temperature curing epoxy adhesive, including:
[0029] Mix epoxy resin and aromatic amine epoxy curing agent, stir well, then add ionic liquid, diluent, plasticizer, fiber reinforcement material and filler, stir evenly, remove air bubbles, and obtain room temperature curing epoxy adhesive .
[0030] Cast the above-mentioned adhesive on a mold and place it at room temperature to cure at 30-40°C for 5 minutes, and test its mechanical and thermal properties.
Embodiment 1
[0033] Mix 100 parts of epoxy resin E-44 and 20 parts of m-phenylenediamine, stir evenly, then add 5 parts of 1-hexyl-3-methylimidazole tetrafluoroborate, 10 parts of allyl glycidyl ether, 15 parts Parts of dioctyl phthalate, 5 parts of boron fiber, 5 parts of calcium silicate, carbon black, and aluminum hydroxide mixture (the mass ratio of calcium silicate, carbon black, and aluminum hydroxide is 3:1:2), The air bubbles are removed to prepare the adhesive, which is cast on the mold to reinforce it, and it is placed at 30-40°C to cure for 5 minutes. The specific mechanical properties are shown in Table 1.
Embodiment 2
[0035] Mix 100 parts of epoxy resin F-44 and 20 parts of metaxylylenediamine, stir evenly, then add 2 parts of 1-hexyl-3-methylimidazole hexafluorophosphate, 12 parts of 2-ethyl-hexyl glycidol Ether, 15 parts of polypropylene glycol diglycidyl ether, 8 parts of boron fiber, 8 parts of magnesium oxide, remove air bubbles to prepare adhesive, cast the adhesive on a mold to reinforce it, and place it at 30-40°C for 5 min. . The specific mechanical properties are shown in Table 1.
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Abstract
The invention provides a room-temperature curing epoxy adhesive and a preparation method thereof, which belongs to the technical field of adhesives. The room-temperature curing epoxy adhesive aims to solve the problems of poor mechanical properties and incapability of fast curing of an existing epoxy adhesive at room temperature. The adhesive comprises 100 parts of epoxy resin, 15 to 20 parts of aromatic amine curing agents, 2 to 10 parts of ionic liquid, 10 to 20 parts of thinners, 10 to 15 parts of plasticizers, 5 to 10 parts of fiber reinforced materials and 5 to 8 parts of filling agents, wherein the structural formula of the ionic liquid is shown in formula (I). The invention further provides a preparation method of the room-temperature curing epoxy adhesive. The preparation method has the advantages of simplicity and easiness in implementation, and the obtained adhesive can be cured at room temperature and has excellent mechanical properties.
Description
Technical field [0001] The invention belongs to the technical field of adhesives, and specifically relates to a room temperature curing epoxy adhesive and a preparation method thereof. Background technique [0002] Epoxy adhesives are liquid or solid adhesives composed of epoxy resin, curing agent, accelerator, modifier, etc. Since epoxy resin contains a variety of polar groups and highly active epoxy groups, it has strong adhesion to various polar materials such as metal, glass, cement, wood, and plastics. The agent has been widely used in industry and life with its excellent comprehensive performance. In the application field of epoxy adhesives, room temperature curing adhesives have become the first choice in the industrial field due to their low process cost, simple operation and comprehensive performance. However, the epoxy cured product of the room temperature system has few heat-resistant groups in the macromolecule, and the curing temperature at room temperature is low,...
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IPC IPC(8): C09J163/00C09J11/04C09J11/06C09J11/08
Inventor 魏巍郑昌梅郑春柏柳美华邓鹏飏张依帆尹园
Owner CHANGCHUN INST OF APPLIED CHEMISTRY - CHINESE ACAD OF SCI
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