Production process of low-dilatation and low-shrinkage insulated mirror boards based on impregnation process

Abstract

The invention discloses a production process of low-dilatation and low-shrinkage insulated mirror boards based on the impregnation process. The production process comprises the steps of S1, fusing aluminum in the atmosphere of inert gas; S2, immersing stainless steel plates into the aluminum and then taking out the stainless steel plates for cooling; S3, adding first powder into the aluminum, carrying out heating until the first powder is fused and then obtaining first fused mixed liquid; S4, immersing the stainless steel plates into the first fused mixed liquid and then taking out the stainless steel plates for cooling; S5, adding second powder into the first fused mixed liquid, carrying out heating until the second powder is fused and then obtaining second fused mixed liquid; S6, immersing the stainless steel plates into the second fused mixed liquid, then taking out the stainless steel plates for cooling and obtaining the insulated mirror boards after oxidation, wherein the first powder comprises, by weight, nickel of 50 parts and cerium of 7-8 parts, and the second powder comprises, by weight, germanium of 50 parts and strontium of 14-15 parts. According to the production process, the conventional impregnation process is improved, and therefore the prepared mirror boards can be frequently used at high temperature and high pressure and do not dilate or shrink and the surfaces are flat and resistant to wear and do not get sunken.

Description

technical field [0001] The invention relates to a production process of an insulating plate, in particular to a production process of a low-expansion-shrinkage insulating mirror plate based on an impregnation process. Background technique [0002] When manufacturing the main substrate of the circuit board (PCB), it is necessary to use a voltage machine to laminate multiple layers of different materials. The working principle of this voltage machine is to heat the processed glue through copper foil (or aluminum foil) Adhesive resin material, and press the multi-layer material by applying a certain pressure for at least half an hour, so as to make the circuit board base material, and in the process of pressing with an electric machine, due to cost considerations, a single pressing operation often needs to be done at the same time. Pressing multiple pieces of circuit board substrates, and in order to prevent multiple pieces of circuit board substrates from being affected by eac...

AI Technical Summary

Problems solved by technology

[0003] The biggest difference between the mirror plate and the ordinary insulating plate is that there is a dense coating on the surface, which has a great influence on the performance of the mirror plate. In the lamination process, the performance requirements of the mirror plate are very high. During operation, both high temperature heat (greater than 300°C) and strong pressure (greater than 50MPa) are generated, which requires the mirror plate to have excellent thermal pressure resistance, that is, the mirror plate needs to have a very high limit temperature resistance And the ultimate pressure resistance, and, more importantly, the surface coating of the mirror plate must remain very smooth and smooth after repeated hot pressing, without depressions on the surface, and no expansion and contraction. This requirement cannot be realized in the process. Generally, the mirror plate of the prior art can be used for about 100 times at room temperature, and then the surface begins to be sunken, resulting in the failure of the mirror plate, and it can only be used about 50 times at high temperature. has expired

The main reason why the existing technology cannot meet this requirement is that the preparation technology of this coating is not yet mature.

Images