Antistatic silicon carbide based ceramic circuit board substrate material strengthened through tetrapod-shaped zinc oxide whiskers and preparation method of material

Abstract

The invention discloses an antistatic silicon carbide based ceramic circuit board substrate material strengthened through tetrapod-shaped zinc oxide whiskers. A silicon carbide based ceramic substrate adopts micron-size silicon carbide powder and nanometer scale aluminum oxide powder which are used in combination, the sintering temperature of the substrate material is low, the sintering density is high, wettability and cementitiousness of polyethylene glycol compound solvent containing nanosized ceramic powder transparent liquid among powders are high, all materials can be evenly dispersed and coated, and the effective effects of melting enhancement and strength enhancement are achieved, a unique structure of adding the tetrapod-shaped zinc oxide whiskers can form a heat-conducting and enhancing network in a green body, the heat-conducting property and mechanical property of ceramic plates are improved, the effects of electrostatic prevention, antimicrobial property and the like are achieved, the additional use value of the substrate is improved, and the prepared substrate is compact, tough, uniform in tissue, rapid in heat conduction, safe, environmentally friendly and huge in application potential.

Description

technical field [0001] The invention relates to the technical field of preparation of silicon carbide ceramics, in particular to an antistatic silicon carbide-based ceramic circuit board substrate material reinforced by four-needle zinc oxide whiskers and a preparation method thereof. Background technique [0002] As the power and density of electronic components increase, the calorific value per unit volume also increases, and the requirements for the comprehensive performance of circuit substrates are getting higher and higher. Among them, ceramic substrates have good comprehensive performance in terms of insulation, thermal conductivity and Thermal expansion, chemical stability and other aspects are outstanding, and are gradually widely used in substrate materials. Among them, alumina and beryllium oxide are mainly used as substrate materials for a long time. However, alumina ceramic sheets have low thermal conductivity and thermal expansion. The coefficient does not matc...

AI Technical Summary

Problems solved by technology

[0002] As the power and density of electronic components increase, the calorific value per unit volume also increases, and the requirements for the comprehensive performance of circuit substrates are getting higher and higher. Among them, ceramic substrates have good comprehensive performance in terms of insulation, thermal conductivity and Thermal expansion, chemical stability and other aspects are outstanding, and are gradually widely used in substrate materials. Among them, alumina and beryllium oxide are mainly used as substrate materials for a long time. However, alumina ceramic sheets have low thermal conductivity and thermal expansion. The coefficient does not match with Si and other shortcomings. Although the comprehensive performance of beryllium oxide ceramics is relatively good, its production cost is high and toxic. Although the comprehensive performance of aluminum nitride ceramics is relatively good, the production cost is high and the application is also limited. Silicon carbide as a substrate material has obvious advantages in terms of performance

[0003] Although the application prospects of silicon carbide ceramic substrates are broad, in the actual production process, there are problems such as low sintering density, low utilization rate of raw materials, and insulation to be improved, which restrict the large-scale use of such materials. Further improvements in the production process