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cutting piece

A cutting sheet, multi-functional acrylic technology, applied in the direction of film/sheet adhesive, adhesive type, electric solid device, etc., can solve the problems of chip falling off, splashing, splashing chips, etc., and achieve the effect of suppressing chip splashing Effect

Active Publication Date: 2018-05-11
LINTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] If the adhesive force to the adherend is insufficient, there may be a problem that the die chip that has been cut into individual dies falls off the dicing sheet and splashes during the process of dicing the semiconductor package (chip spatter)

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0111] (1) Preparation of coating composition

[0112] The following components (a) to (d) were mixed to prepare a solution-state coating composition (solvent: toluene).

[0113] (a) As the acrylate polymer (A), a copolymer obtained by copolymerizing 50 parts by mass of 2-ethylhexyl acrylate, 40 parts by mass of methyl acrylate, and 10 parts by mass of acrylic acid (weight average molecular weight : 800,000) as 100 parts by mass of solids;

[0114] (b) As the polyfunctional acrylic energy ray polymerizable compound (B), caprolactone-modified dipentaerythritol hexaacrylate (manufactured by Nippon Kayaku Co., Ltd.: DPCA-60, molecular weight: 1262, polymerizable functional group amount: 0.00475 mol / g) as 100 parts by mass of solid matter;

[0115] (c) As the cross-linking agent (C), a cross-linking agent component (manufactured by Toyo Chemical Co., Ltd.: BHS 8515) containing toluene diisocyanate-trimethylolpropane (TDI-TMP) was used as 10 parts by mass of solid matter;

[01...

Embodiment 2

[0122] As the cross-linking agent (C), in addition to using 0.07 parts by mass of 1,3-bis(N,N-diglycidylaminomethyl)cyclohexane (manufactured by Mitsubishi Gas Chemical Co., Ltd.: TETRAD-C), the same as the implementation In Example 1, diced sheets were produced in the same manner.

Embodiment 3

[0124] A dicing sheet was produced in the same manner as in Example 1 except that the compounding amount of the polyfunctional acrylate energy ray polymerizable compound (B) was changed to 33.3 parts by mass (solid content).

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Abstract

The invention provides a cutting sheet (1), which has a substrate (2) and an adhesive layer (3) laminated on at least one side of the substrate (2), the adhesive layer (3) is composed of acrylic acid An adhesive composition of a polymer (A) and a multifunctional acrylate energy ray polymerizable compound (B) is formed in 1 g of the multifunctional acrylate energy ray polymerizable compound (B). The energy ray polymerizable compound (B) has 0.004 to 0.009 moles of polymerizable functional groups, and the multifunctional acrylate energy ray polymerizable compound (B) accounts for the majority of the acrylic polymer (A) and the multifunctional acrylate energy ray polymerizable The ratio of the total amount of the compound (B) is 20 to 65% by mass, and the thickness of the pressure-sensitive adhesive layer (3) is 2 to 20 μm. According to the above-mentioned dicing sheet (1), when a work with a large surface roughness such as a semiconductor package is used as an adherend, it has sufficient adhesive force before irradiation of energy rays, and has moderate adhesion after irradiation of energy rays. Joint force, and it is difficult to produce adhesive aggregates.

Description

technical field [0001] The present invention relates to a dicing sheet used for dicing semiconductor packages and the like. Background technique [0002] As a general manufacturing method of a semiconductor device, a method is adopted in which a semiconductor substrate such as a semiconductor wafer is cut into individual chips, the resulting chip is picked up, mounted on a lead frame, and after connecting the two with a bonding wire, the chip is then bonded with a resin. Make a seal. [0003] In the process from the said dicing process to a pick-up process, the dicing sheet which formed the adhesive layer on the base film is used. In this dicing sheet, in order to enable the semiconductor substrate as the adherend to be firmly bonded in the dicing process, and to pick up the chip in the picking process, the adhesive layer is formed by adhesiveness due to energy such as ultraviolet rays and electron beams. The composition of the material is lowered by the irradiation of ray...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/301H01L21/683C09J133/14C09J7/20
CPCC09J2203/326H01L21/6836H01L2221/68327H01L2221/68336H01L2221/68381C09J133/14C09J7/385C09J2301/416
Inventor 西田卓生高麗洋佑
Owner LINTEC CORP