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Manufacture of matrix anode and method using high temperature co-fired multilayer ceramic technology

A technology of multi-layer ceramics and high-temperature co-firing, which is applied in the direction of electron multiplier anode devices, multiplier electrodes, cold cathode manufacturing, etc., can solve problems such as poor production, easy air leakage of lead-out needles, and reduced sealing yield, reaching High production efficiency, improved unevenness, and good consistency

Active Publication Date: 2017-07-25
NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] However, using the metal glass sealing process to make matrix anodes can achieve a higher matrix density, but relatively speaking, the higher the density, the higher the precision requirements for the sealing mold will be. Once the mold is set
[0008] If the design is not well made, some lead-out pins are prone to air leakage, which will lead to a significant decrease in the sealing yield

Method used

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  • Manufacture of matrix anode and method using high temperature co-fired multilayer ceramic technology
  • Manufacture of matrix anode and method using high temperature co-fired multilayer ceramic technology
  • Manufacture of matrix anode and method using high temperature co-fired multilayer ceramic technology

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Embodiment

[0047] control figure 1, a 10×10 matrix anode made by high-temperature co-fired multilayer ceramic technology, including: Kovar sealing disc 1; Kovar pin 2; The transition piece between the substrate 3 and the shell is brazed with the multilayer ceramic substrate 3 and sealed with the shell by laser welding or argon arc welding. The multi-layer ceramic substrate 3 is located on the inner surface of the vacuum chamber. On the inner surface of the vacuum chamber is a 10×10 metal contact array 4 uniformly arranged to form an anode input array. On the outer surface of the vacuum chamber is a uniformly arranged 10×10 metal contact array 4. 10 leads out the pin 2 to form an anode output array.

[0048] A method for manufacturing a microchannel plate photomultiplier tube matrix anode using a high-temperature co-fired multilayer ceramic process, comprising:

[0049] Step 1: According to Figure 2, process the Kovar sealing disc 1 with an outer diameter of Φ35.5mm and a height of 2.5m...

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Abstract

The present invention adopts high-temperature co-firing multilayer ceramic technology to manufacture matrix anode and its method. The matrix anode multilayer ceramic substrate and the tube shell are provided with a keratable sealing disc, which is connected to the matrix anode multilayer ceramic substrate. The sealing plate takes over the housing, the matrix anode multilayer ceramic substrate is located on the inner surface of the vacuum chamber, and is uniformly arranged in an array of metal contacts to form an anode input array, and the matrix anode multilayer ceramic substrate is located on the outer surface of the vacuum chamber to form a uniform array Arranged x×x lead-out needles form an anode output array. Advantages: Since metal lines can be printed on each layer of the substrate and interconnected through vertical metallized through holes, the spacing of electrodes on both sides of the substrate can be made different. High-density matrix anode; using semiconductor manufacturing technology, the matrix anode produced has better consistency than traditional technology, which can improve the inhomogeneity of the anode response and increase production efficiency.

Description

technical field [0001] The invention relates to a high-temperature co-fired multilayer ceramic process for manufacturing a matrix anode of a microchannel plate photomultiplier tube and a method thereof. The invention belongs to the technical field of electric vacuum photodetection devices. Background technique [0002] The matrix anode microchannel plate photomultiplier tube is a photoelectric conversion detection device that can convert weak optical signals into electrical signals. It has the characteristics of extremely high electronic gain and sensitivity, ultra-fast time response, and ultra-high timing accuracy. Through The follow-up signal readout circuit can realize photon counting and position imaging functions, and can be widely used in laser radar, medical high-resolution gamma camera, high-energy particle detection and other application fields. This type of device is mainly composed of a photocathode, a microchannel plate, a matrix anode and a tube shell with vacu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01J43/12H01J9/14
CPCH01J9/148H01J43/12
Inventor 杨杰李永彬赵文锦
Owner NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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