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Preparing method for dampproof mould-proof low-formaldehyde medium and high density fiberboard

A high-density fiberboard and low-formaldehyde technology, applied in fiber raw materials, fiber raw material processing, chemical instruments and methods, etc., can solve the problems of high price and high production cost, and achieve the effects of improving moisture resistance, product quality, and fiber temperature

Active Publication Date: 2016-03-30
JINAN CAIMING IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For the release of formaldehyde, it is often used to change the glue making formula, using MDI glue or soybean bio-glue, the effect is better, but the production cost is high and the price is expensive, which is generally unaffordable for customers.

Method used

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  • Preparing method for dampproof mould-proof low-formaldehyde medium and high density fiberboard

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Effect test

specific Embodiment 1

[0029] The present invention is a moisture-proof, mildew-proof, low-formaldehyde type medium and high-density fiberboard preparation method, and the preparation method comprises the following steps:

[0030] (1) chipping step: cutting the three leftovers of branch wood forestry into evenly sized wood chips by a chipper;

[0031] (2) Screening step: remove unqualified wood chips and impurities through the wood chips of step (1) through a swing sieve and winnowing;

[0032] (3) Pre-cooking step: the wood chips in step (2) are sent into the pre-cooking bin, and then sent into the mill;

[0033] (4) Thermal grinding step: the wood chips in step (3) are decomposed into fibers through a thermal grinder to decompose the wood chips that have been cooked at a high temperature of 165-175 ° C and at a high pressure of 0.8-0.9 MPa;

[0034] (5) Drying step: the fiber in step (4) is mixed with activated carbon powder in the drying pipeline;

[0035] (6) fiber winnowing step: step (5) fib...

specific Embodiment 2

[0048] The difference with specific embodiment 1 is:

[0049] In the hot grinding process, add ingredients according to the following weight ratio: 230kg / m 3 Urea-formaldehyde resin adhesive, 8kg / m 3 Refined paraffin wax, 1.5 / m 3 The solidifying agent is an acidic particle yuanqing solution that accounts for 1% of the dry fiber. Particle Yuanqing is added to water and heated to 60 degrees in the dissolution tank. The mass ratio of acid particle Yuanqing solution to water and acid particle Yuanqing is 4:1. Grinding in the spray pipe.

[0050] In the drying process, the ingredients are added according to the following weight ratio: the 150-mesh activated carbon powder is spirally quantified and then transported to the drying pipe by the fan to fully merge with the fibers. The inlet temperature of the drying pipeline is below 175°C, the outlet temperature is 60°C, and the airflow with a wind speed of 30m / s is used for drying and mixing with activated carbon powder. After dryi...

specific Embodiment 3

[0052] The difference with specific embodiment 1,2 is:

[0053] In the hot grinding process, add ingredients according to the following weight ratio: 210kg / m 3 Urea-formaldehyde resin adhesive, 7kg / m 3 Refined paraffin wax, 1.6kg / m 3 The solidifying agent is an acidic particle Yuanqing solution that accounts for 1.1% of the dry fiber. Particle Yuanqing is added to water and heated to 55 degrees in the dissolution tank. The mass ratio of acid particle Yuanqing solution to water and acid particle Yuanqing is 4:1. Grinding in the spray pipe.

[0054] In the drying process, the ingredients are added according to the following weight ratio: the 170-mesh activated carbon powder is quantified by the spiral and then transported to the drying pipe by the fan to fully merge with the fibers. The inlet temperature of the drying pipeline is below 175°C, the outlet temperature is 50°C, and the airflow with a wind speed of 30m / s is used for drying and mixing with activated carbon powder....

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Abstract

The invention discloses a preparing method for a dampproof mould-proof low-formaldehyde medium and high density fiberboard. In the hot grinding process, 200 kg / m<3>-230 kg / m<3> of a urea resin adhesion agent, 6 kg / m<3>-8 kg / m<3> of refined paraffin wax, 1.5 kg / m<3>-2 kg / m<3> of a curing agent and an acid particle deep black solution accounting for 1% to 2% of absolutely-dried fibers are added into a slurry spraying pipe; and in the drying process, 100-200-mesh activated carbon powder is added. Through the special process, the effects that the product quality is improved, the dampproof and mould-proof effects are improved, and the formaldehyde emission amount is reduced are achieved; and in the board heating process, a preheating system heats fibers in advance, the fiber temperature is improved, the fibers are softened, the hot press time is shortened, the hot pressing efficiency is improved, the product quality is improved, the working cost is reduced, and the working efficiency is improved.

Description

technical field [0001] The invention relates to a method for preparing a fiberboard, in particular to a method for preparing a moisture-proof, mildew-proof, low-formaldehyde type medium and high-density fiberboard. Background technique [0002] Adhesives are widely used in the production process of wood-based panels. Generally, adhesives contain "unstable" factors, which will break the chain in a low pH value or high tide and high humidity environment, thereby decomposing free formaldehyde. Under the action of electrolyte, etc., free formaldehyde will also be released. Therefore, the rational use of additives such as curing agent can control the amount of formaldehyde released. Today's medium and high-density fiberboard production process mainly includes material preparation (chips or purchased wood chips), wood chip screening and cleaning, pre-cooking, cooking, hot grinding, glue application, drying, paving, pre-pressing, hot-pressing, Cutting, cooling, sanding, edge sawin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B27D1/08B27N3/04B27N3/12B27N3/14B27N1/00B32B21/04B32B37/10B32B37/06D21B1/14
Inventor 李茂桧
Owner JINAN CAIMING IND CO LTD
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