Photosensitive resin composition used for touch screen, and hardening film thereof, and touch screen with hardening film
A technology of photosensitive resin and composition, which is applied in the direction of photosensitive materials, optics, and optical components used in optomechanical equipment, and can solve problems such as lack of pattern formation, reduced visual recognition, and uneven color, so as to prevent Pattern visible phenomenon, excellent development characteristics, effect of increasing refractive index
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[0100] Hereinafter, the present invention will be described in more detail through synthesis examples and examples, but the present invention is not limited to these examples. In addition, unless otherwise specified, the evaluation of the resin in the following synthesis example was performed as follows.
[0101] [Solid content concentration]
[0102] A glass filter [weight: W] was impregnated with 1 g of the resin solution obtained in the following synthesis example 0 (g)] and weighing [W 1 (g)], according to the weight after heating at 160°C for 2 hours [W 2 (g)] to obtain the solid content concentration from the following formula.
[0103] Solid content concentration (weight%)=100×(W 2 -W 0 ) / (W 1 -W 0 )
[0104] [acid value]
[0105] The resin solution obtained in the following synthesis example was dissolved in dioxane, and titrated with a 1 / 10 N-KOH aqueous solution using a potentiometric titration device [manufactured by Hiranuma Sangyo Co., Ltd. under the trad...
Synthetic example 1
[0111] In a 500ml four-necked flask with a reflux condenser, add 0.23mol of bisphenol fluorene epoxy compound, 0.46mol of acrylic acid, 161.0g of propylene glycol monomethyl ether acetate and 0.48g of tetraethylammonium bromide (TEAB), reacted under heating at 100°C to 105°C with stirring for 20 hours. Then, add 0.08mol of 3,3',4,4'-biphenyltetracarboxylic dianhydride and 0.18mol of 1,2,3,6-tetrahydrophthalic anhydride in the flask, It stirred under heating at 125 degreeC for 6 hours, and the alkali-soluble resin solution 1 represented by General formula (V) was obtained. The solid content concentration of the obtained resin solution was 55.6 wt%, the acid value (solid content conversion) was 101 mgKOH / g, and the Mw obtained by GPC analysis was 2400.
[0112] In addition, the bisphenol fluorene epoxy compound used is a compound of general formula (IV), A is fluorene-9,9-diyl, R 3 ~R 6 for a hydrogen atom. The same compound was also used in Synthesis Example 2 and Synthesis...
Synthetic example 2
[0114] In a 500ml four-necked flask with a reflux condenser, add 0.23mol of bisphenol fluorene type epoxy compound, 0.46mol of acrylic acid, 161.0g of propylene glycol monomethyl ether acetate and 0.48g of tetraethylammonium bromide ( TEAB), and reacted at 100° C. to 105° C. under heating with stirring for 20 hours. Then, add 0.12mol of 3,3',4,4'-biphenyltetracarboxylic dianhydride and 0.12mol of 1,2,3,6-tetrahydrophthalic anhydride in the flask, It stirred under heating at 125 degreeC for 6 hours, and the alkali-soluble resin solution 2 represented by General formula (V) was obtained. The solid content concentration of the obtained resin solution was 55.6 wt%, the acid value (solid content conversion) was 103 mgKOH / g, and the Mw obtained by GPC analysis was 3600.
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