Boron silane modified silicon resin, addition type resin composition and application

Abstract

The invention provides boron silane modified silicon resin and addition type resin composition containing the resin. The resin has the general structural formula shown in the specification, wherein R is an alkyl group, R1 is an epoxy group or an acrylate group or a methacrylate group, and R3 is a silicon vinyl group. A B-O bond is introduced into the molecular structure, and the heat stability of the resin is improved; at least one phenyl group is contained in the resin structure, and the resin is good in compatibility when compounded with other resin for use and can keep the transparency of final cured products; at least one silicon vinyl group is contained in the resin structure, and the resin can participate in final hydrosilylation curing and cannot affect the performance of the final cured products; active functional groups such as the alkoxy group, the epoxy group, acrylate and the like are introduced into the resin structure, during preparation of the composition, the polarity of the system can be improved greatly, and the dispersion performance of the resin to filler is improved greatly.

Description

technical field [0001] The invention relates to the field of material technology, in particular to a borosilane-modified silicone resin and an addition-type resin composition and application. Background technique [0002] Addition-type silica gel has incomparable advantages in performance compared with condensation-type silica gel: better mechanical properties, no release of small molecules, no impact on bonding materials and other components, lower shrinkage, better dimensional stability, electrical The performance is better and more stable, and there is basically no change in the curing process and after curing. However, because its structure is dominated by silicon-oxygen bonds, there are also some silicon-carbon or silicon-hydrogen bonds, and the polarity is poor, so the wetting of the substrate or filler is very poor, resulting in poor bonding performance and poor adhesion to the filler. The dispersion performance is also very poor, seriously affecting its performance....

AI Technical Summary

Problems solved by technology

However, because its structure is dominated by silicon-oxygen bonds, there are also some silicon-carbon or silicon-hydrogen bonds, and the polarity is poor, so the wetting of the substrate or filler is very poor, resulting in poor bonding performance and poor adhesion to the filler. The dispersion performance is also very poor, seriously affecting its performance

Most of the current solutions are solved by adding additives, such as Dow Corning's patent: curable organopolysiloxane composition and semiconductor devices made using the composition (application number: 03824673.2) and curable organopolysiloxane The alkane composition and semiconductor device (application number: 200480028707.8) are mainly composed of silicon-oxygen bonds, some silicon-carbon or silicon-hydrogen bonds, and the polarity is poor, and then by adding some alkoxy or epoxy-containing Silane coupling agent is used to improve the bonding and wetting properties, but the structure of these substances is quite different from that of the main body, so the addition amount is generally low (too much will easily lead to poor compatibility of the system), which will affect the bonding performance and wetting properties. The improvement of wet performance is extremely limited, which is also the root cause of its general bonding performance and poor wetting performance to fillers.

Moreover, these additives generally do not participate in the addition curing reaction, which will cause the performance of the film to deteriorate (lower hardness and lower strength)

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