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A method and system for recycling liquid metal printed circuit

A liquid metal and recovery method technology, applied in the direction of improving process efficiency, can solve problems such as high melting point, heavy metal ion pollution, cumbersome process flow, etc., and achieve the effect of simple process and high recovery efficiency

Active Publication Date: 2017-08-01
BEIJING DREAM INK TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The mechanical physical separation method (invention patent CN201310003383.3) mainly includes mechanical crushing, winnowing, electrostatic adsorption, centrifugation, etc., but these processes can only make circuit boards into particles, and cannot effectively separate the substrate from the metal; heat treatment technology (Invention patent CN201310430840.7) Although it can help to recycle the solder on the circuit board (the melting point is between 200-400 ° C), but for the most important conductive metals (copper, gold, etc.) in the circuit board, the melting point is too high. It is too high to be practical; hydrometallurgy technology is to use chemical reaction (invention patent CN201310583886.2) or biological fermentation (invention patent CN201310457250.3) to convert conductive metal materials into ions in the solution and then re-refine it. More cumbersome and there is a risk of heavy metal ion contamination

Method used

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  • A method and system for recycling liquid metal printed circuit
  • A method and system for recycling liquid metal printed circuit

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Experimental program
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Effect test

Embodiment 1

[0028] The liquid metal printed circuit recovery system used in this embodiment is composed of a discharge pool, a sorting pool, a centrifugal pool, a filter pool and a diversion pool. The liquid metal is gallium indium alloy, the polymer substrate material is polyvinyl chloride, and the package is Silica gel.

[0029] The liquid metal printed circuit recycling method of this embodiment is as follows: the liquid metal printed circuit to be recycled is first put into the discharge pool, and the conveyor belt in the pool will pass through the crushing teeth, brushes and placed on the side of the conveyor belt in turn. blower, so as to break and blow out the encapsulated silica gel on the surface of the circuit, and the liquid metal printed circuit after the encapsulation is removed reaches the gate of the discharging pool and falls into the sorting pool. The sorting pool is injected with 0.2mol / L sodium hydroxide aqueous solution every 10 minutes, and the ultrasonic oscillator l...

Embodiment 2

[0031] The difference between this embodiment and Embodiment 1 is that the liquid metal is bismuth-indium alloy, the polymer substrate material is polystyrene, and the package is latex.

Embodiment 3

[0033] The difference between this embodiment and embodiment 1 is that the liquid metal is gallium indium tin zinc alloy, the polymer substrate material is epoxy resin, and the package is sulfur rubber.

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Abstract

The invention discloses a recycling method for liquid metal printed circuits. The recycling method comprises the following steps that firstly, packages of the liquid metal printed circuits to be recycled are removed, and the liquid metal printed circuits with the packages removed are placed into sorting liquid in a batch mode to form a mixed material; secondly, the formed mixed material is subjected to ultrasonic treatment or mechanical oscillation treatment, so that liquid metal conductive circuit bodies in the liquid metal printed circuits are disengaged from organic polymer substrates and electronic components to form a mixture; thirdly, the formed mixture is subjected to centrifuging, filtering and flow splitting; and finally, liquid metal, the electronic components, the organic polymer substrate materials and the sorting liquid are separated out. The invention further discloses a system used by the recycling method for the liquid metal printed circuits. The system comprises a feeding pool, a sorting pool, a centrifuging pool, a filtering pool and a flow splitting pool. According to the recycling method for the liquid metal printed circuits and the system used by the recycling method, by means of the unique physical property of the liquid metal, the process is simple, energy saving and environment protection are achieved, and the recycling efficiency is high; and the recycling method and the system are suitable for recycling the liquid metal printed circuits on a large scale in the industrial field.

Description

technical field [0001] The invention relates to the technical field of resource recovery, and more specifically relates to a recovery method and a recovery system of a liquid metal printed circuit. Background technique [0002] Liquid metal is a general term for a series of low-melting-point metals and alloy materials. Because it has both conductivity and fluidity, it can be directly printed on the surface of various substrates to realize the additive manufacturing of electronic circuits. Compared with the processing of traditional copper-clad printed circuits, liquid metal printed circuits are fast, suitable for a variety of substrates and flexible; in addition, compared with traditional copper-clad printed circuits, the processing process of liquid metal printed circuits is more energy-saving and environmentally friendly. Recycling also has unique advantages. [0003] The traditional recycling of copper-clad printed circuits mainly includes mechanical and physical separat...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22B7/00
CPCC22B7/005Y02P10/20
Inventor 于洋王倩刘静
Owner BEIJING DREAM INK TECH CO LTD