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Heatproof flexible composite insulating material and preparation method thereof

A composite insulation and flexible technology, applied in the direction of organic insulators, inorganic insulators, plastic/resin/wax insulators, etc., can solve the problems that affect the wide use, soft paper, low tensile strength and elongation, and achieve reasonable structure, Highlight the effect of heat resistance and improve mechanical properties

Inactive Publication Date: 2016-06-15
SUZHOU JIN TENG ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because the composition contains 90% inorganic fibers, inorganic ceramic fiber paper has outstanding heat resistance, the heat resistance temperature is as high as 250 ° C, the insulation life is long, and it is better than polyaramid paper in terms of thermal conductivity and paint absorption ability; but inorganic The tensile strength and elongation of ceramic fiber paper are lower than that of polyaramid paper, and the paper is relatively soft, which greatly affects its wide use

Method used

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  • Heatproof flexible composite insulating material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] Mix 100g of phenolic compound and 150g of bisphenol A cyanate monomer, stir at 90°C for 20 minutes, add 40g of pentaerythritol acrylate, 18g of dodecylbenzenesulfonic acid, and continue stirring for 40 minutes; then add 500g of epoxy resin E44, 50g m-aminoacetanilide, 14g 1-hexyne, continue stirring for 40 minutes; then cool down to 70°C, add 12g shell powder, 10g yttrium nitrate and 80g isomeric tridecanol polyoxyethylene ether, stir for 40 minutes; then stir at 110°C After 1 hour, the adhesive was obtained; after the adhesive was coated with inorganic ceramic fiber paper, it was dried in a drying tunnel at 110°C, and the polyimide film was compounded by heating and pressing the rollers to obtain a heat-resistant flexible compound. Insulation material with uniform color appearance, flat surface, no damage, no air bubbles and impurities; breakdown voltage 11KV, moisture absorption rate 0.25%, thermal adhesiveness 191°C, no delamination, no foaming, no glue flow.

Embodiment 2

[0015] Mix 100g of phenolic compound and 130g of bisphenol A cyanate monomer, stir at 90°C for 20 minutes, add 30g of pentaerythritol acrylate, 10g of dodecylbenzenesulfonic acid, and continue stirring for 40 minutes; then add 400g of epoxy resin E44, 20g m-Aminoacetanilide, 11g 1-hexyne, continue stirring for 40 minutes; then cool down to 70°C, add 10g shell powder, 8g yttrium nitrate and 50g isomeric tridecanol polyoxyethylene ether, stir for 40 minutes; then stir at 110°C After 1 hour, the adhesive was obtained; after the adhesive was coated with inorganic ceramic fiber paper, it was dried in a drying tunnel at 110°C, and the polyimide film was compounded by heating and pressing the rollers to obtain a heat-resistant flexible compound. Insulation material with uniform appearance color, flat surface, no damage, no air bubbles and impurities; breakdown voltage 11KV, moisture absorption rate 0.24%, thermal adhesiveness 192°C, no delamination, no foaming, no glue flow.

Embodiment 3

[0017] Mix 100g of phenolic compound and 140g of bisphenol A cyanate monomer, stir at 90°C for 20 minutes, add 35g of pentaerythritol acrylate, 15g of dodecylbenzenesulfonic acid, and continue stirring for 40 minutes; then add 450g of epoxy resin E44, 35g m-aminoacetanilide, 12g 1-hexyne, continue stirring for 40 minutes; then cool down to 70°C, add 11g shell powder, 9g yttrium nitrate and 65g isomeric tridecanol polyoxyethylene ether, stir for 40 minutes; then stir at 110°C After 1 hour, the adhesive was obtained; after the adhesive was coated with inorganic ceramic fiber paper, it was dried in a drying tunnel at 110°C, and the polyimide film was compounded by heating and pressing the rollers to obtain a heat-resistant flexible compound. Insulation material with uniform color appearance, flat surface, no damage, no air bubbles and impurities; breakdown voltage 11KV, moisture absorption rate 0.21%, thermal adhesiveness 194°C, no delamination, no foaming, no glue flow.

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Abstract

The invention discloses a heatproof flexible composite insulating material and a preparation method thereof. The material is composed of inorganic ceramic fiber paper and a polyimide film bonded to the inorganic ceramic fiber paper via an adhesive. The adhesive is prepared by adding a filling material, including shell powder and yttrium nitrate, into mixed melting product of a phenolic compound, a bisphenol A dicyanate monomer, epoxy resin E44, pentaerythritol tetraacrylate, a dodecylbenzene sulfonic acid, iso-tridecanol polyoxyethylene ether, an N-Acetyl-1,3-phenylenediamine and butyl acetyne. The price of the heatproof flexible composite insulating material is reasonable is reasonable, so that the material can be applied to insulation systems of special motors, electrical appliances electronic transformers whose heatproof level is higher than H level (180 DEG C) in a more economical manner.

Description

technical field [0001] The invention relates to a heat-resistant flexible composite insulating material, in particular to a heat-resistant flexible composite insulating material applied to heat-resistant special motors, electrical appliances, electronic transformers and other products and a preparation method thereof. Background technique [0002] Polyimide materials are widely used in the field of electronic products due to their excellent high / low temperature resistance, radiation resistance, weather resistance, etc. and excellent electrical properties. In particular, polyimide film is widely used in the connection and support of electronic products due to its good mechanical properties, heat resistance and insulation properties. Due to its own defects, pure polyimide film limits its large-scale application. In order to further improve the application performance of polyimide film, composite film technology is widely used. The insulating material is usually an organic pol...

Claims

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Application Information

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IPC IPC(8): H01B3/08H01B3/38H01B13/00
CPCH01B3/08H01B3/38H01B13/00
Inventor 孙政良
Owner SUZHOU JIN TENG ELECTRONICS TECH
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