Coupling method of optical fiber and silicon optical chip and chip thereof

Abstract

The invention provides a coupling method of an optical fiber and a silicon optical chip, and the silicon optical chip. The method comprises the following steps of: pasting and fixing the silicon optical chip (1) on a substrate (2), wherein the end face coupling waveguide of the silicon optical chip (1) is of a cantilever beam structure and has a spot-size converter (1-1); enabling the end face of the optical fiber (4) to be aligned with and the spot-size converter (1-1) of the coupling waveguide in a coupled manner through an image system and a fine tuning frame; enabling a fixed block (5) to be close to the optical fiber (4) from the side surface and fixing the fixed block (5) on the substrate (2); pasting a cushion block (3) respectively on the input end and output end of the silicon optical chip (1) and enabling the cushion blocks to support the parts, whose coatings are not stripped, of the optical fiber (4); utilizing the fine tuning frame to precisely align the end face of the optical fiber (4) with the area of the spot-size converter (1-1); adopting ultraviolet glue (6) to fixedly paste the optical fiber (4) with the fixed block (5) and the cushion blocks (3) after that a suitable coupling interval is obtained by adjustment. According to the invention, the coupling method of the optical fiber and the silicon optical chip is simple and reliable, the process complexity is low, the universality is good and the method is suitable for batch production.

Description

technical field [0001] The invention relates to a coupling method of an optical fiber and a silicon photonic chip and the silicon photonic chip, and the invention belongs to the field of communication. Background technique [0002] With the rapid development of optical communication and the Internet, data transmission and processing speeds are developing at a higher rate, and silicon photonics technology has become one of the solutions for high-speed optical communication devices and systems. Since silicon photonic devices are compatible with existing CMOS standard processes, they can be integrated with microelectronic integrated circuits to achieve on-chip optical interconnection with high performance, low cost, small size and high integration. Therefore, silicon-based optoelectronic devices based on SOI have become a research hotspot. [0003] The key part of silicon-based optoelectronic chip packaging technology is to realize the coupling connection between the optical s...

AI Technical Summary

Problems solved by technology

However, the silicon photonics chip designed with a cantilever beam structure is suspended around the waveguide on the end face, and the cantilever is only connected to the main body of the chip. This structure is sensitive to stress. When the stress is large, the cantilever structure will be damaged and the chip will be scrapped.

The hard glue used in the conventional coupling method will cause large stress due to environmental changes, so it cannot be used for cantilever beam waveguide chip coupling

In addition, there are protrusions on the bottom of the end face of the chip (the protruding part is larger than the coupling pitch), and conventional fiber arrays cannot be used. Special specification fiber arrays must be customized for coupling alignment. The manufacturing process of this type of fiber array is complicated, difficult to process, and high in cost. And the coupling process with the chip is complex

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