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Palladium-free chemical copper plating method

A technology of electroless copper plating and inorganic materials, applied in the field of electroless plating, can solve the problems of slow reaction speed and precipitation of copper particles, and achieve the effects of low cost, stable plating solution, and low environmental pollution

Inactive Publication Date: 2016-08-03
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Patent 201510553243.2 discloses a method for electroless copper plating on the surface of inorganic particles. This method uses a polydopamine layer to reduce copper on the surface of inorganic particles under the action of an additional auxiliary reducing agent, dimethylaminoborane, but the reaction speed of this method is Slow, and while metal copper is deposited on the particle surface, copper particles are often precipitated in the solution

Method used

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  • Palladium-free chemical copper plating method
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  • Palladium-free chemical copper plating method

Examples

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Effect test

Embodiment 1

[0041] (1) Sonicate the alumina microspheres with an average particle size of 10 μm in absolute ethanol for 20 minutes, filter, collect the filter cake, and air-dry at 110°C for 4 hours before use;

[0042] (2) Use tris (trishydroxymethylaminomethane) and hydrochloric acid to prepare a buffer solution with a pH of 8.5, use the buffer solution to prepare a dopamine solution with a concentration of 2.7g / L, take 50mL of the dopamine solution, and add 2g of pretreated alumina Microspheres, stirred in the air atmosphere for 24 hours, filtered, collected filter cakes, vacuum-dried at 60°C for 4 hours, dopamine-coated alumina microspheres, set aside;

[0043] (3) Prepare a 17g / L silver nitrate solution complexed with ammonia water, disperse the dopamine-coated alumina microspheres in the silver nitrate solution complexed with ammonia water, stir for 2 hours, filter, wash 4 times with deionized water, and collect The filter cake was dried in a vacuum drying oven at 40°C for 6 hours to...

Embodiment 2

[0048] (1) Soak chopped carbon fibers with an average diameter of 8 μm and a length of 4 mm in aqua regia solution to remove the glue, wash them with deionized water for 5 times, and then dry them with air at 80°C;

[0049] (2) Use tris (trishydroxymethylaminomethane) and hydrochloric acid to prepare a buffer solution with a pH of 8.0, use the buffer solution to prepare a dopamine solution with a concentration of 5g / L, take 50mL of dopamine solution, and add 1g of pretreated chopped carbon fiber , stirred in the air atmosphere for 12 hours, filtered, collected the filter cake, vacuum-dried at 70°C for 4 hours, and then dopamine-coated chopped carbon fibers were used for later use;

[0050] (3) Prepare a 3g / L silver nitrate solution, place the dopamine-coated chopped carbon fiber in the silver nitrate solution, stir for 1 hour, filter, wash 4 times with deionized water, collect the filter cake, and dry it in a vacuum oven at 40°C for 5 hours reserve;

[0051] (4) Configure an ...

Embodiment 3

[0055] (1) Put the hollow glass microspheres with an average particle size of 12 μm in absolute ethanol for ultrasonication, and let them stand until they are separated. Take the hollow glass microspheres in the upper layer, filter them, collect the filter cake, and air-dry them at 80°C for 6 hours. reserve;

[0056] (2) Use tris and hydrochloric acid to prepare a buffer solution with a pH of 8.5, use the buffer solution to prepare a dopamine solution with a concentration of 0.5g / L, take 50mL of dopamine solution, add 1g of pretreated hollow glass microspheres, and stir in the air atmosphere 24h, filter, collect the filter cake, vacuum-dry at 40°C for 5h, and then dopamine-coated hollow glass microspheres, set aside;

[0057] (3) Prepare a 3g / L silver nitrate solution complexed with ammonia water, place dopamine-coated hollow glass microspheres in the silver nitrate solution complexed with ammonia water and stir for 4 hours, filter, wash 4 times with deionized water, and colle...

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Abstract

The invention discloses a palladium-free chemical copper plating method. The method comprises the steps of firstly forming a poly-dopamine layer on the surface of a base body in a solution through the oxidation polymerization effect of dopamine, reducing silver ions to nano silver through poly-dopamine, catalyzing reduction of copper ions in chemical copper plating solutions with the nano silver serving as a catalytic center and finally forming a complete and compact metal copper layer on a surface to be plated. The method has the advantages that the operation is simple, the application range of material to be plated is wide, the requirement for equipment is low, the cost is low, coatings are firm, and the sizes of crystal grains are small.

Description

technical field [0001] The invention relates to the field of electroless plating, in particular to a method for palladium-free electroless copper plating on the surface of inorganic materials or polymer materials. Background technique [0002] Electroless plating is the most commonly used method for plating metal on non-conductive surfaces in industry, and usually includes steps such as alkaline degreasing, roughening, electrical adjustment, pre-dipping, sensitization, activation, acceleration, and electroless plating. Among them, stannous chloride commonly used by Manhua and palladium for activation are relatively polluting to the environment, and the cost is high, so palladium-free electroless plating is the future development trend. Patent CN101067206 discloses a treatment process without palladium activation on the surface of ABS plastics, using the film-forming properties of chitosan and its derivatives and the chelating and adsorption of nickel, using chemical methods ...

Claims

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Application Information

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IPC IPC(8): C23C18/20C23C18/30C23C18/18C23C18/40
CPCC23C18/1893C23C18/2086C23C18/30C23C18/40C23C18/18
Inventor 吴叔青胡佳勋
Owner SOUTH CHINA UNIV OF TECH
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