Palladium-free chemical copper plating method

A technology of electroless copper plating and inorganic materials, applied in the field of electroless plating, can solve the problems of slow reaction speed and precipitation of copper particles, and achieve the effects of low cost, stable plating solution, and low environmental pollution

Inactive Publication Date: 2016-08-03
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Patent 201510553243.2 discloses a method for electroless copper plating on the surface of inorganic particles. This method uses a polydopamine layer to reduce copper on the surface of inorganic particles under the action of

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Example Embodiment

[0040] Example 1

[0041] (1) Ultrasonic alumina microspheres with an average particle size of 10 μm in absolute ethanol for 20 minutes, filter, collect the filter cake, and dry it by blasting at 110 °C for 4 hours before use;

[0042] (2) Use tris (tris (tris(hydroxymethylaminomethane)) and hydrochloric acid to prepare a buffer solution with a pH of 8.5, use the buffer solution to prepare a dopamine solution with a concentration of 2.7g / L, take 50mL of the dopamine solution, and add 2g of pretreated alumina The microspheres were stirred in an air atmosphere for 24 hours, filtered, and the filter cake was collected. After vacuum drying at 60°C for 4 hours, the dopamine-coated alumina microspheres were set aside for later use;

[0043] (3) Prepare 17g / L silver nitrate solution complexed with ammonia water, disperse the dopamine-coated alumina microspheres in the silver nitrate solution complexed with ammonia water, stir for 2h, filter, wash 4 times with deionized water, collect...

Example Embodiment

[0047] Example 2

[0048] (1) The chopped carbon fibers with an average diameter of 8 μm and a length of 4 mm were soaked in aqua regia solution to remove the glue, washed with deionized water for 5 times, and then dried by blasting at 80 °C;

[0049] (2) Prepare a buffer solution with a pH of 8.0 with tris (tris (tris(hydroxymethyl)aminomethane) and hydrochloric acid), prepare a dopamine solution with a concentration of 5g / L with the buffer solution, take 50mL of the dopamine solution, and add 1g of pretreated chopped carbon fibers , stirred in air atmosphere for 12h, filtered, collected the filter cake, vacuum-dried at 70°C for 4h, dopamine-coated chopped carbon fiber, set aside;

[0050] (3) Prepare a 3g / L silver nitrate solution, put the dopamine-coated chopped carbon fibers in the silver nitrate solution and stir for 1 hour, filter, wash with deionized water for 4 times, collect the filter cake, and dry it in a vacuum drying oven at 40 °C for 5 hours backup;

[0051] (4...

Example Embodiment

[0054] Example 3

[0055] (1) Put the hollow glass microbeads with an average particle size of 12 μm in anhydrous ethanol and ultrasonically, let it stand for stratification, take the hollow glass microbeads with the upper layer intact, filter, collect the filter cake, and blow dry at 80 °C for 6 hours backup;

[0056] (2) Use tris and hydrochloric acid to prepare a buffer solution with a pH of 8.5, use the buffer solution to prepare a dopamine solution with a concentration of 0.5 g / L, take 50 mL of dopamine solution, add 1 g of pretreated hollow glass beads, and stir in an air atmosphere 24h, filter, collect the filter cake, vacuum dry the dopamine-coated hollow glass microbeads at 40°C for 5h, and set aside;

[0057] (3) Prepare 3g / L ammonia-complexed silver nitrate solution, place the dopamine-coated hollow glass beads in the ammonia-complexed silver nitrate solution, stir for 4 hours, filter, wash 4 times with deionized water, collect the filter cake, After drying in a v...

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Abstract

The invention discloses a palladium-free chemical copper plating method. The method comprises the steps of firstly forming a poly-dopamine layer on the surface of a base body in a solution through the oxidation polymerization effect of dopamine, reducing silver ions to nano silver through poly-dopamine, catalyzing reduction of copper ions in chemical copper plating solutions with the nano silver serving as a catalytic center and finally forming a complete and compact metal copper layer on a surface to be plated. The method has the advantages that the operation is simple, the application range of material to be plated is wide, the requirement for equipment is low, the cost is low, coatings are firm, and the sizes of crystal grains are small.

Description

technical field [0001] The invention relates to the field of electroless plating, in particular to a method for palladium-free electroless copper plating on the surface of inorganic materials or polymer materials. Background technique [0002] Electroless plating is the most commonly used method for plating metal on non-conductive surfaces in industry, and usually includes steps such as alkaline degreasing, roughening, electrical adjustment, pre-dipping, sensitization, activation, acceleration, and electroless plating. Among them, stannous chloride commonly used by Manhua and palladium for activation are relatively polluting to the environment, and the cost is high, so palladium-free electroless plating is the future development trend. Patent CN101067206 discloses a treatment process without palladium activation on the surface of ABS plastics, using the film-forming properties of chitosan and its derivatives and the chelating and adsorption of nickel, using chemical methods ...

Claims

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Application Information

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IPC IPC(8): C23C18/20C23C18/30C23C18/18C23C18/40
CPCC23C18/1893C23C18/2086C23C18/30C23C18/40C23C18/18
Inventor 吴叔青胡佳勋
Owner SOUTH CHINA UNIV OF TECH
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