Soybean-based formaldehydeless adhesive used for chipboards, and application method thereof

An adhesive and soybean technology, which is applied in the application, adhesive, adhesive additive and other directions, can solve the problems of high water absorption thickness expansion rate, poor preformability, and the inability of soybean glue to uniformly sizing the moisture content of shavings

Active Publication Date: 2016-08-10
宁波朝露新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a soybean-based formaldehyde-free adhesive that can be used for particle boards. The method of multi-component sizing is adopted to solve the problems that soybean glue cannot be applied uniformly and the moisture content of the shavings after sizing

Method used

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  • Soybean-based formaldehydeless adhesive used for chipboards, and application method thereof
  • Soybean-based formaldehydeless adhesive used for chipboards, and application method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] In this example, the soybean-based formaldehyde-free adhesive consists of the following raw material components in parts by weight:

[0031] Defatted soy flour: 20 servings

[0032] Sodium hydroxide (acid-base regulator): 0.2 parts

[0033] Epoxy resin (crosslinking agent, commercially available): 20 parts

[0034] Casson (antifungal agent, commercially available): 0.5 parts

[0035] Polyether modified polysiloxane (leveling agent, commercially available, Jiangxi Tiansheng New Material Co., Ltd., model QS302): 0.5 parts

[0036] Water: 30 parts

[0037] Rosin emulsion (tackifier, commercially available, Xiamen Baixu Chemical Co., Ltd., model J7009, solid content 50%): 28.8 parts.

[0038] When applying, mix sodium hydroxide, epoxy resin, carthone, polyether modified polysiloxane and water evenly to form a suspension as the liquid component, defatted soybean powder as the powder component, and rosin emulsion as the third Components, mix the powder components and sha...

Embodiment 2

[0040] In this example, the soybean-based formaldehyde-free adhesive consists of the following raw material components in parts by weight:

[0041] Defatted soy flour: 25 servings

[0042] Citric acid (acid-base regulator): 0.4 parts

[0043] Silane coupling agent (crosslinking agent, model KH560): 2.5 parts

[0044] Didodecyldimethylammonium chloride (antifungal agent): 0.3 parts

[0045] Polyether modified polysiloxane (leveling agent): 0.7 parts

[0046] Water: 30 parts

[0047] Terpene resin emulsion (tackifier, commercially available, Guangzhou Songbao Chemical Co., Ltd., model 8218, solid content 60%): 41.1 parts.

[0048] In application, stir citric acid, silane coupling agent, quaternary ammonium salt derivatives, polyether modified polysiloxane with water to form a uniform liquid as the liquid component, defatted soybean powder as the powder component, terpene resin Emulsion is used as the third component. While mixing the powder component and shavings, evenly sp...

Embodiment 3

[0050] In this example, the soybean-based formaldehyde-free adhesive consists of the following raw material components in parts by weight:

[0051] Defatted soy flour: 27 parts

[0052] Oxalic acid (acid-base regulator): 0.3 parts

[0053] Silane coupling agent (crosslinking agent): 3 parts

[0054] Copper sulfate (mold inhibitor): 0.5 parts

[0055] Polyether modified polysiloxane (leveling agent): 0.6 parts

[0056] Water: 30 parts

[0057] Polyvinyl alcohol solution (tackifier, commercially available, solid content 22%): 38.6 parts.

[0058] In application, stir oxalic acid, silane coupling agent, copper sulfate, polyether modified polysiloxane, polyvinyl alcohol solution with water to form a homogeneous liquid as a thickening liquid component, defatted soybean powder as a powder component, While mixing the powder component and the shavings, evenly spray the viscosifying liquid component, adjust the moisture content of the surface layer to 13%, and the moisture content...

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Abstract

The invention discloses a soybean-based formaldehydeless adhesive used for chipboards, and an application method thereof. The soybean-based formaldehydeless adhesive is prepared from, by weight, 10-30 parts of a soybean derivative, 0.1-1 part of an acidity-alkalinity adjusting agent, 1-30 parts of a cross-linking agent, 0.1-1 part of a mildew inhibitor, 0.1-1 part of a leveling agent, 10-100 parts of water and 5-50 parts of a tackifier. Multi-component adhesive application is adopted to solve the problems of unable adhesive application of commercial soybean adhesives and too high water content of wood shavings after adhesive application, and the tackifier is used to solve the problems of poor initial viscosity of chipboards made by using the soybean adhesives, poor pre-forming property after adhesive application of wood shavings, and low static bending strength and large water absorption thickness swelling rate of boards.

Description

technical field [0001] The invention relates to a soybean adhesive, in particular to a soybean-based formaldehyde-free adhesive that can be used for particle boards and an application method thereof. Background technique [0002] Urea-formaldehyde glue, phenol-formaldehyde glue, and melamine-formaldehyde glue are the main varieties of glue used in the wood industry. In China, the output of urea-formaldehyde glue accounts for more than 80% of "trialdehyde glue". During the production and application of "trialdehyde glue" and its wood products, free formaldehyde will be continuously released, which seriously endangers the physical and mental health of industrial workers and consumers. Formaldehyde is classified as Class I carcinogen by the International Agency for Research on Cancer (IARC) of the World Health Organization, that is, it is carcinogenic to humans and animals. In recent years, reports of infant deformities and sepsis caused by formaldehyde have emerged in an endl...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J189/00C09J145/00C09J11/04C09J11/06B27N3/02B27N1/02
CPCB27N1/0209B27N3/02C08L2205/03C09J11/04C09J11/06C09J145/00C09J163/00C09J189/00C08L89/00C08L93/04C08K5/19C08L29/04C08K2003/3045
Inventor 桂成胜刘小青吴頔朱锦徐益忠
Owner 宁波朝露新材料科技有限公司
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