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Production technology of high-purity and high-conductivity oxygen-free copper strips

A production process, oxygen-free copper technology, applied in the production process field of high-purity and high-conductivity oxygen-free copper strip, can solve the problems of low production efficiency, unstable oxygen content of products, and low yield, and achieve the effect of saving energy consumption

Active Publication Date: 2016-10-12
泰州麒润电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The traditional oxygen-free copper strip production process has disadvantages such as large investment scale, low yield, limited product length, low production efficiency, high energy consumption, and unstable oxygen content of the product.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] The production process of a high-purity and high-conductivity oxygen-free copper strip in this embodiment 1 is: high-purity copper smelting—upward continuous casting—continuous extrusion—face milling—multi-pass cold rolling—straightening—annealing—cleaning and passivation -Divide.

[0031] The specific steps are:

[0032] 1. High-purity copper smelting: Using No. 1 standard cathode copper as raw material, vacuum electron beam is used to smelt and solidify to remove impurity elements. The working vacuum of the electron gun is 5×10 -3 Pa, the vacuum degree of the melting chamber is 5×10 -3 Pa, acceleration voltage 50KV. The traction speed is 5mm / min. The obtained high-purity copper ingot had a copper content of 99.9995%, an oxygen content of 0.0001%, and an electrical conductivity of 102.6% IACS.

[0033] 2. Upward continuous casting: high-purity copper is used as raw material, and the high-purity copper is preheated and dried and then melted in a smelting device. Ch...

Embodiment 2

[0046]The production process of the high-purity and high-conductivity copper strip in Example 2 is as follows: upward continuous casting—continuous extrusion—face milling—multi-pass cold rolling—straightening—annealing—cleaning and passivation—slitting.

[0047] Lack the step of high-purity copper smelting, other steps are identical with embodiment 1.

Embodiment 3

[0049] The production process of the high-purity and high-conductivity oxygen-free copper strip in Example 3 is: high-purity copper smelting—upward continuous casting—continuous extrusion—face milling—multi-pass cold rolling—annealing—cleaning and passivation—slitting.

[0050] The step of straightening is lacking, and other steps are the same as in Example 1.

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Abstract

The invention relates to a production technology of high-purity and high-conductivity oxygen-free copper strips. The technology comprises the following steps: 1, high-purity copper melting; 2, updraft continuous casting of copper rods; 3, production of copper strip blanks through a continuous extruding set; 4, face milling of the copper strip blanks; 5, rolling through adopting a cold rolling unit; 6, copper strip plate shape straightening and control; 7, annealing; 8, cleaning passivation; and 9, cutting. The high-purity and high-conductivity oxygen-free copper strips produced in the invention have the advantages of high copper content, low oxygen content, high electricity conduction performance, high plastic processing performance and high plate shape quality, and the technology has the advantages of short flow, high efficiency and energy saving.

Description

technical field [0001] The invention relates to the technical field of nonferrous metal processing, in particular to a production process of a high-purity and high-conductivity oxygen-free copper strip. Background technique [0002] Copper and copper alloys have the characteristics of high electrical conductivity, thermal conductivity, good ductility, and easy processing. They also have excellent vacuum sealing performance and will not leak even if they are very thin, which is especially important for electric vacuum devices. In addition, it has excellent soldering performance, and almost all liquid solders can wet its surface well without nickel plating. Therefore, copper and copper alloys are one of the metals widely used in electric vacuum devices. [0003] Oxygen-free copper strip generally adopts the following production process methods: [0004] Melting in vacuum furnace—ingot casting—heating—hot rolling—face milling—cold rolling—intermediate annealing—cleaning—cold ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B21C37/02
CPCB21C37/02
Inventor 徐高磊
Owner 泰州麒润电子有限公司
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