Semiconductor silicon wafer corrosive liquid and corrosion method thereof
A technology for silicon wafers and semiconductors, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as fast corrosion speed and uneven corrosion on the surface of silicon wafers, and achieve the effects of low cost, easy control, and reduced damage
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[0016] Example 1:
[0017] An etching solution for semiconductor silicon wafers is formed by mixing 65% nitric acid, 45% hydrofluoric acid and 95% glacial acetic acid in a volume ratio of 4:4:6.
[0018] The method for etching semiconductor silicon wafers with an etching solution is to place the semiconductor silicon wafers in a closed container containing an etching solution and perform etching under low temperature conditions, the low temperature being -12°C.
[0019] Inert gas nitrogen is introduced into the container. The flow rate is 1sccm.
[0020] After etching the semiconductor silicon wafer, the silicon wafer needs to be cleaned.
[0021] For cleaning, high-purity deionized water with a resistivity greater than 18MΩ*cm is used to perform flow cleaning on the etched silicon wafer until the surface of the silicon wafer is clean.
Example Embodiment
[0022] Example 2:
[0023] An etching solution for semiconductor silicon wafers is mixed with 70% nitric acid, 55% hydrofluoric acid and 99% glacial acetic acid in a volume ratio of 14:14:18.
[0024] The method for etching semiconductor silicon wafers with an etching solution is to place the semiconductor silicon wafers in a closed container containing an etching solution and perform etching under low temperature conditions, the low temperature being -8°C.
[0025] Inert gas argon is passed into the container. The flow rate is 800sccm.
[0026] After etching the semiconductor silicon wafer, the silicon wafer needs to be cleaned.
[0027] For cleaning, high-purity deionized water with a resistivity greater than 18MΩ*cm is used to perform flow cleaning on the etched silicon wafer until the surface of the silicon wafer is clean.
Example Embodiment
[0028] Example 3:
[0029] An etching solution for semiconductor silicon wafers is made by mixing 66% nitric acid, 48% hydrofluoric acid and 97% glacial acetic acid in a volume ratio of 6:6:8.
[0030] The method for etching semiconductor silicon wafers with an etching solution is to place the semiconductor silicon wafers in a closed container containing an etching solution and perform etching under low temperature conditions, the low temperature being -10°C.
[0031] Inert gas helium is introduced into the container. The flow rate is 500sccm.
[0032] After etching the semiconductor silicon wafer, the silicon wafer needs to be cleaned.
[0033] For cleaning, high-purity deionized water with a resistivity greater than 18MΩ*cm is used to perform flow cleaning on the etched silicon wafer until the surface of the silicon wafer is clean.
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