Modified phenolic resin composite thermal insulation material and preparation method thereof

Abstract

The invention provides a modified phenolic resin composite thermal insulation material which is prepared from the following raw materials in parts by weight: 30-70 parts of epoxy modified phenolic resin, 30-50 parts of coated expanded perlite, 10-20 parts of straw, 2-5 parts of adhesive, 1-3 parts of water repellent, 0.1-1 part of curing agent, 0.1-1 part of lubricant and 0.1-1 part of toughening agent. A preparation method comprises the following steps of: 1) weighing the phenolic resin, coated expanded perlite, straw, adhesive, water repellent, curing agent, lubricant and toughening agent according to the proportion, mixing and stirring uniformly, and putting into a steel mould; and 2) performing hot compression moulding in the conditions that the compression ratio is 1.6-2.4 and the hot compression moulding temperature is 210-240 DEG C, and preserving pressure for 1.5-2.5h to obtain the modified phenolic resin composite thermal insulation material. The thermal insulation material integrates the advantages of low heat conductivity coefficient of an organic thermal insulation material and high strength and difficulty in combustion of an inorganic thermal insulation material.

Description

technical field [0001] The invention belongs to the technical field of materials for building exterior walls, and in particular relates to a modified phenolic resin composite thermal insulation material. Background technique [0002] The construction area of ​​new urban and rural buildings in my country is nearly 2 billion square meters each year, and the existing buildings are nearly 42 billion square meters. Building energy consumption has accounted for more than 27% of the country's total energy consumption. It is the energy saving of the envelope structure that has a particularly important position. The most commonly used insulation materials such as extruded polystyrene board (XPS) or expanded polystyrene board (EPS), despite their advantages such as low thermal conductivity and low density, as organic materials, their flammability poses a great safety hazard, In recent years, fires in "CCTV Building", "Shanghai Teacher's Apartment" and "Shenyang Wanxin Hotel" caused by...

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Problems solved by technology

[0004] In order to solve the problems existing in the above-mentioned existing organic thermal insulation materials, the present invention proposes a modified phenolic resin composite thermal insulation material, which has the advantages of low thermal conductivity of organic thermal insulation materials and high strength of inorganic thermal insulation materials, and is difficult to burn