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Radiation-sensitive resin composition and electronic part

A resin composition, sensitive technology, applied in the direction of photosensitive material processing, photosensitive materials used in photomechanical equipment, instruments, etc., can solve the problem of not necessarily good pattern formation, and achieve excellent storage stability and low hygroscopicity , The effect of excellent developing adhesion

Active Publication Date: 2019-11-22
ZEON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, according to the radiation-sensitive resin composition described in this patent document 1, although a resin film having excellent electrical properties such as low dielectric properties can be formed, when a fine pattern is formed by development, the pattern formation property is not necessarily good. Therefore, there is a problem that it cannot be used as a resin film application for a wiring layer formed in a fine pattern such as a rewiring layer formed on a surface protection film.

Method used

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  • Radiation-sensitive resin composition and electronic part
  • Radiation-sensitive resin composition and electronic part
  • Radiation-sensitive resin composition and electronic part

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0172] Hereinafter, an Example and a comparative example are given, and this invention is demonstrated more concretely. "Parts" in each example are based on weight unless otherwise specified.

[0173] In addition, the definition and evaluation method of each characteristic are as follows.

[0174]

[0175] The radiation-sensitive resin composition prepared in each Example and each comparative example was put into a container made of polyethylene, and after vibrating for 3 hours with a vibrator, the state of the radiation-sensitive resin composition was visually observed as follows: benchmark to evaluate storage stability.

[0176] A: Each component constituting the radiation-sensitive resin composition was completely dissolved.

[0177] C: Cloudiness and precipitation occurred.

[0178]

[0179] The radiation-sensitive resin composition produced in each example and each comparative example was coated on a silicon substrate by spin coating, and heated and dried (prebaked...

Synthetic example 1

[0188]

[0189] Will contain N-phenyl-bicyclo[2.2.1]hept-5-ene-2,3-dicarboximide (NBPI) 40 mole% and 4-hydroxycarbonyltetracyclo[6.2.1.1 3,6 .0 2,7 ] 100 parts of monomer mixture of 60 mole % of dodec-9-ene (TCDC), 2.0 parts of 1,5-hexadiene, (1,3-di-me-trimethylimidazolin-2-ylidene) ( 0.02 parts of tricyclohexylphosphine)benzylidene ruthenium dichloride (synthesized by the method described in Org. Lett., Vol. 1, p. 953, 1999), and 200 parts of diethylene glycol ethyl methyl ether It was placed in a nitrogen-substituted glass pressure-resistant reactor, and reacted at 80° C. for 4 hours while stirring to obtain a polymerization reaction liquid.

[0190] Then, the obtained polymerization reaction solution was put into an autoclave, stirred at 150° C. under a hydrogen pressure of 4 MPa for 5 hours, and hydrogenated to obtain a polymer solution containing a cyclic olefin polymer (A-1). The obtained cyclic olefin polymer (A-1) had a polymerization conversion rate of 99.7%, a p...

Embodiment 1

[0192] 291 parts of a polymer solution of the cyclic olefin polymer (A-1) obtained in Synthesis Example 1 as the binder resin (A) (100 parts based on the cyclic olefin polymer (A-1)), 4,4'-[1-[4-[1-[4-hydroxyphenyl]-1-methylethyl]phenyl]ethylidene]bisphenol (1.0 mol ) and condensate of 1,2-naphthoquinonediazido-5-sulfonyl chloride (2.5 moles)) 35 parts, 2,2-bis(hydroxymethyl)1-butanol as crosslinking agent (C) The 1,2-epoxy-4-(2-oxiranyl) cyclohexane adduct (15 functional alicyclic epoxy resin with cyclohexane skeleton and terminal epoxy group, trade name " EHPE3150", manufactured by Daicel Chemical Industry Co., Ltd., total chlorine content 25ppm or less) 30 parts, N-phenyl-3-aminopropyltrimethoxysilane (trade name "KBM-573" as a silane coupling agent (D) , Shin-Etsu Chemical Co., Ltd.) 1 part, and 160 parts of ethylene glycol dimethyl ether as a solvent were mixed and dissolved, and filtered through a filter made of polytetrafluoroethylene with a pore size of 0.45 μm to pre...

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Abstract

The present invention provides a radiation-sensitive resin composition containing a binder resin (A), a radiation-sensitive compound (B), a crosslinking agent (C), and a silane coupling compound represented by the following general formula (1). Joint agent (D). (in the above general formula (1), R 1 ~R 3 Each independently is a monovalent alkyl group with 1 to 5 carbon atoms, R 4 is a divalent alkylene group with 1 to 10 carbon atoms, R 5 is a hydrogen atom or a monovalent alkyl group with 1 to 5 carbon atoms, R 6 ~R 10 is a hydrogen atom or a monovalent alkyl group having 1 to 5 carbon atoms. ).

Description

technical field [0001] The present invention relates to a radiation-sensitive resin composition and an electronic component having a resin film formed from the radiation-sensitive resin composition. A radiation-sensitive resin composition of a resin film and an electronic component having a resin film formed of the radiation-sensitive resin composition. Background technique [0002] In various display elements such as organic EL elements and liquid crystal display elements, integrated circuit elements, solid-state imaging elements, color filters, black matrices, and other electronic components, as a surface protective film for preventing deterioration and damage, and for making elements Various resin films are provided for flattening the surface, the electrical insulating film for maintaining electrical insulation, and the insulating film used in the redistribution layer (Re-Distribution Layer: RDL) formed on the surface protection film, etc. . [0003] Conventionally, the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/075G03F7/004G03F7/023
CPCG03F7/0226G03F7/0233G03F7/038G03F7/0755C08K5/544G03F7/032G03F7/0751G03F7/16G03F7/20G03F7/26
Inventor 堤隆志
Owner ZEON CORP
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