Flat plate heat pipe and manufacturing method thereof

Abstract

The invention provides a flat plate heat pipe. The flat plate heat pipe comprises an evaporation cover plate, a condensation cover plate, a liquid filling pipe and liquid absorption cores. The evaporation cover plate is of a concave table structure. A connection belt is arranged around the periphery of the top end of the concave table structure of the evaporation cover plate. The liquid absorption cores of a porous capillary structure are formed in the periphery of the inner side of the top end of the concave table structure of the evaporation cover plate, and a hydrophilic thin layer is compounded to the bottom face of the inner side of the top end of the concave table structure of the evaporation cover plate. A plurality of convex plates are arranged on the side, in contact with the evaporation cover plate, of the condensation cover plate. A hydrophobic thin layer is compounded to the positions, except for the positions with the convex tables, of the side, in contact with the evaporation cover plate, of the condensation cover plate. A through hole is formed in the outer side of the evaporation cover plate, and the liquid filling pipe is arranged in the through hole. The evaporation cover plate and the condensation cover plate are connected in a sealed mode to form a closed cavity. Through modification of the hydrophilic property of the evaporation cover plate of the flat plat heat pipe and the hydrophobic property of the condensation cover plate, and through the supporting convex plates machined on the condensation cover plate, the heat exchange capacity and stability of the flat plate heat pipe are improved.

Description

technical field [0001] The invention relates to the technical field of heat transfer and heat dissipation, in particular to a flat heat pipe and a manufacturing method thereof. Background technique [0002] With the continuous progress of micro-manufacturing technology and electronic technology, electronic devices are gradually developing towards miniaturization, compactness and high performance. It is a problem of excessive local heat flow, which seriously affects the performance of the chip. In addition, electronic devices have high requirements on temperature uniformity, and excessive temperature will cause fatigue damage to electronic devices. In order to reduce the heat generation of the chip, conventional cooling technologies such as forced convection heat exchange combined with fins and fans, semiconductor cooling, synthetic jet cooling and other new heat dissipation technologies, but the above heat dissipation technologies have been difficult to meet the heat dissip...

AI Technical Summary

Problems solved by technology

[0004] However, due to the existence of the liquid-absorbing core of the flat heat pipe, part of the condensed liquid cannot return immediately and adheres to the condensation cover, so that the condensation of the steam becomes film-like condensation. When the steam exchanges heat with the condensation cover, it needs to pass through the liquid film, resulting in The thermal resistance increases and the condensation speed slows down, which affects the overall internal gas-liquid circulation efficiency and reduces the heat dissipation performance; when the liquid drawn back by the liquid-absorbing core cannot meet the amount required for evaporation, the liquid-absorbing core at the evaporating end dries up, and the evaporation end The temperature of the wall surface rises sharply, causing the wall surface of the evaporation end to burn out

In addition, due to the relatively large heat exchange area of ​​the flat heat pipe, in order to ensure its mechanical strength and reduce its deformation after heating, it is usually necessary to add support columns, and this measure is likely to cause the support columns to be deformed by heat, dislocation, instability, and poor flow of working fluid. and other problems, resulting in a serious decline in the overall performance of the flat heat pipe, which cannot meet the heat dissipation requirements

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