A silicon-based optical waveguide integrated photodetector for visible and near-infrared bands
A silicon-based optical waveguide and photodetector technology, which is applied in semiconductor devices, circuits, electrical components, etc., can solve the problems of complex structure and process of optical waveguide integrated photodetectors, difficulty in achieving integration and low cost, and achieve The effect of convenient design, simple structure and easy production
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Embodiment 1
[0033] In this embodiment, Si3N4 is selected as the material of the strip waveguide 13 and the diffraction grating 23 . The manufacturing process is: using a high-temperature oxidation process to grow a layer of SiO with a thickness of about 3 μm on the silicon substrate. 2 Thin film, the core layer does not need to be doped, so a simple thermal oxidation process can be used, and this process is suitable for mass production, so the cost is very low. Silicon nitride is then formed to a thickness of 0.25 µm. For the passive area, the strip waveguide is fabricated by photolithography and dry etching.
[0034] For the active light absorption region 2 of the photodetector, the strip waveguide is etched into a diffraction grating 23 with a certain period by photolithography and dry etching, and then the upper cladding layer 14, 24 with a thickness of about 1.2 μm is deposited. , and sputtering reflective mirror Au on the upper cladding, with a thickness of 100nm, on both sides of ...
Embodiment 2
[0038] In this embodiment, polymer material SU-8 strip waveguide 13 and diffraction grating 23 are selected. The manufacturing process is: on the silicon substrate, a layer of SiO is grown on the silicon substrate using a high-temperature oxidation process. 2 Thin film, the core layer does not need to be doped, the SU-8 plate is formed by spin-coating process, and the passive input optical waveguide 13 is formed by photolithography process.
[0039] For the active light absorption region 2 of the photodetector, the strip waveguide is etched into a diffraction grating 23 with a certain period by photolithography and dry etching processes, and then the upper cladding layers 14 and 24 with a thickness of about 0.2 μm are deposited. , and sputter gold reflective mirror surface on the upper cladding layer 24, the Au thickness is 100nm, on both sides of the active light absorption region 2 diffraction grating 23, use dry or wet process to remove SiO 2 thin film, and then deposit go...
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