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Wetting pilot strip-shaped brazing filler metal and preparation method thereof

A strip brazing filler metal and brazing filler metal technology are applied in the field of brazing filler metals, which can solve the problems of easy brittleness, low Sn content of AgCuZnSn brazing filler metals, reduced plasticity, etc. simple method effect

Inactive Publication Date: 2016-12-07
ZHENGZHOU RES INST OF MECHANICAL ENG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the Sn content in the AgCuZnSn solder produced by the above method is low, otherwise its plasticity will be significantly reduced, it will easily become brittle, and it will be difficult to shape it by conventional processing methods

Method used

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  • Wetting pilot strip-shaped brazing filler metal and preparation method thereof

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Experimental program
Comparison scheme
Effect test

preparation example Construction

[0017] The preparation method of the wetting leading strip solder of the present invention is as follows:

[0018] First of all, the solder alloy is prepared into filaments of the required size through smelting, extrusion, drawing and other processes. During the preparation process, the solder wire must undergo strict degreasing and pickling processes to ensure that the solder wire before hot-dip plating No oil, no impurities, no oxidation; then put the solder wire into the tinning machine for hot-dip plating. After tinning, the welding wire is prepared into a straight strip with a length of 500mm through straightening and cutting processes, and then the flux is coated on the surface of the tin layer in the form of pressure coating to form a self-contained solder wire with excellent wettability, seam filling and formability. The wetting of the flux leads to the finished strip of solder.

Embodiment 1

[0021] The brazing material alloy is BAg25CuZn wire with a diameter of 2mm, and the surface of the wire is hot-dip tinned by hot-dip plating. The thickness of the tin layer is 0.01mm. The adhesive is organic, and the thickness of the flux layer is 0.2mm. According to the national standard GB / T 11364-2008 "Solder Wettability Test Method", the matrix solder and the prepared solder were subjected to a wettability comparison test. Place 200 mg of the prepared brazing material in the center of a Q235 carbon steel plate with a thickness of 40 mm × 40 mm and a thickness of 2 mm, and cover the base solder with FB102 flux of the same quality as the prepared solder. The weight of the solder plus the base solder is 200 mg. 40mm×40mm, the center of Q235 carbon steel plate with a thickness of 2mm. Put them into the RSL-5 wetting furnace and heat them respectively, keep warm for 40-50 s after the solder is melted, and clean it after natural cooling at room temperature. After calculation, t...

Embodiment 2

[0023] The solder alloy is BAg30CuZn wire with a diameter of 2mm, and the surface of the wire is hot-dip tinned by hot-dip plating. The thickness of the tin layer is 0.02mm. The adhesive is organic, and the thickness of the flux layer is 0.2mm. According to the national standard GB / T 11364-2008 "Solder Wettability Test Method", the matrix solder and the prepared solder were subjected to a wettability comparison test. Place 200 mg of the prepared brazing material in the center of a Q235 carbon steel plate with a thickness of 40 mm × 40 mm and a thickness of 2 mm, and cover the base solder with FB102 flux of the same quality as the prepared solder. The weight of the solder plus the base solder is 200 mg. 40mm×40mm, the center of Q235 carbon steel plate with a thickness of 2mm. Put them into the RSL-5 wetting furnace and heat them respectively. After the solder is melted, keep it warm for 40-50 s. After cooling at room temperature, clean it. The wetted area of ​​the prepared sol...

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Abstract

The invention discloses wetting pilot strip-shaped brazing filler metal. The wetting pilot strip-shaped brazing filler metal comprises a brazing filler metal alloy inner core. A tin layer and a coating brazing flux layer sequentially wrap the brazing filler metal alloy inner core. The cross section of the formed strip-shaped brazing filler metal is in a circular or polygonal shape. The diameter of the brazing filler metal alloy inner core is determined according to the size of a brazing filler metal filling seam, the thickness of the tin layer is determined according to the brazing filler metal seam filling ability, and the thickness of the coating brazing flux layer is determined according to the difficulty of removing an oxidation film from the surface of a workpiece. During preparation, firstly, a brazing filler metal alloy is machined to be in the shape of a wire with the diameter meeting the requirement; after deoiling and acid pickling are conducted, the wire-shaped brazing filler metal alloy is placed in a tinning machine to be subjected to hot-dipping wire plating and then prepared to be in a strip shape after being straightened and cut off; and then, the surface of the tin layer is coated with a brazing flux in a press smearing manner, and a finished product of the pilot strip-shaped brazing filler metal is formed. A preparation method is simple, the tin content can be accurately controlled, and compared with traditional brazing filler metal, the wetting and seam filling performance of the brazing filler metal is greatly improved.

Description

technical field [0001] The invention relates to brazing filler metal, in particular to a wetting pilot strip-shaped solder, and the invention also relates to a preparation method of the strip-shaped solder. Background technique [0002] Liquid metals are all viscous liquids, and their fluidity can be measured by the viscosity of liquid metals. The more viscous a liquid metal is, the less fluid it is. The viscosity is inversely proportional to the superheat of the liquid metal. Therefore, when the brazing temperature is constant, the lower the melting temperature of the solder, the greater the superheat of the liquid solder, which will cause the viscosity of the liquid solder to decrease and the fluidity to increase. When the melting temperature of the solder increases, the degree of superheat decreases, the viscosity increases, and the fluidity decreases. [0003] Silver-based solder has a moderate melting point, superior brazing process performance, good connection stren...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/14B23K35/40
CPCB23K35/0227B23K35/404
Inventor 龙伟民董博文钟素娟马佳张青科董显吕登峰黄俊兰周许升路全彬张宏超王琦
Owner ZHENGZHOU RES INST OF MECHANICAL ENG CO LTD
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