Polydopamine function modified high-abrasion-resistant heat-conducting silicone rubber thermal interface material and preparation method thereof

Abstract

The invention discloses a polydopamine function modified high-abrasion-resistant heat-conducting silicone rubber thermal interface material which comprises, by weight parts, 45-65 parts of silicone rubber matrix, 22-32 parts of aluminum nitride, 14-26 parts of dopamine, 20-35 parts of silver nitrate solution with a concentration of 20 mmol / L, 1-3 parts of vinyl hydroxy silicone oil, 2-5 parts of bis-2,5 vulcanizing agent, an appropriate amount of deionized water, an appropriate amount of Tris-HCl buffer solution, 7-13 parts of lanthanum oxysulfide, 12-16 parts of intermediate super abrasion furnace black and 1-3 parts of polyaryl ether nitrile. Dopamine is subjected to oxidative polymerization on the surface of aluminum nitride to form a closely adherent polydopamine layer, the surface of the polydopamine layer coating aluminum nitride is loaded with silver nanoparticles, silicone rubber is compounded and filled, high thermal conductivity and heat dispersion performances of the silicone rubber thermal interface material are improved, and the polydopamine function modified high-abrasion-resistant heat-conducting silicone rubber thermal interface material has good flexibility, tear strength and electrical insulation properties.

Description

technical field [0001] The invention belongs to the field of thermal interface materials, and in particular relates to a polydopamine-functionally modified high-wear-resistant and thermally conductive silicone rubber thermal interface material and a preparation method. Background technique [0002] With the continuous improvement of LED manufacturing and packaging technology, the power of LED is getting bigger and bigger. At present, the input power of commercialized high-power LEDs is generally above 1W, the chip area is 1mm×1mm, and the heat flux is 100W / cm 2 Above, heat dissipation requirements are very high. The heat transfer from the chip to the external environment has to pass through several interfaces. The gap between the interfaces and the warpage of the substrate will affect the bonding and local heat dissipation, forming interface thermal resistance. With the development of high-power and high-brightness LEDs, interface thermal resistance has become one of the p...

AI Technical Summary

Problems solved by technology

Among them, the theoretical thermal conductivity of aluminum nitride high-purity single crystal can reach 320W / (m K), which has reliable electrical insulation performance, low dielectric loss and dielectric constant, and is an ideal thermal conductive filler. After absorbing moisture, it will undergo hydrolysis reaction with water to produce Al(OH) 3 It will interrupt the thermal conduction path, which will affect the transmission of phonons. Therefore, the thermal conductivity of the finished product is low. Even if the surface is treated with a silane coupling agent, it cannot guarantee that the filler surface is 100% covered.